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Journal Articles

Experimental Study on Electrochemically Assisted Friction and Wear of 4H-SiC Based on Advanced Oxidation Processes of Hydroxyl and Sulfate Radicals

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Jiawen Yao, Juze Xie, Yangting Ou, Jisheng Pan
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. December 2025, 147(12): 124204.
Paper No: TRIB-25-1099
https://doi.org/10.1115/1.4068492
Published Online: May 9, 2025
View Articletitled, Experimental Study on Electrochemically Assisted Friction and Wear of 4H-SiC Based on Advanced Oxidation Processes of Hydroxyl and Sulfate Radicals
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Topics: Friction, Polishing, Silicon carbide, Wear, Oxidation, Slurries
Journal Articles

Study on the Mechanism of Electrochemical Mechanical Polishing Mechanism of Single-Crystal 4H-SiC Based on Friction and Wear

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Rongji Zhuang, Lijie Wu, Jisheng Pan, Bo Ran, Jingkuang Wen, Yongze Zhou, Jilong Xie
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. September 2025, 147(9): 091114.
Paper No: TRIB-25-1060
https://doi.org/10.1115/1.4068302
Published Online: April 11, 2025
View Articletitled, Study on the Mechanism of Electrochemical Mechanical Polishing Mechanism of Single-Crystal 4H-SiC Based on Friction and Wear
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Topics: Friction, Polishing, Silicon carbide, Wear, Abrasives, Electrolytes, Disks, Oxidation
Journal Articles

Analytical Model of the Evolution of Surface Topography During Sliding Wear

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Noël Brunetière
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Briefs
J. Tribol. November 2025, 147(11): 114501.
Paper No: TRIB-25-1048
https://doi.org/10.1115/1.4068176
Published Online: March 24, 2025
View Articletitled, Analytical Model of the Evolution of Surface Topography During Sliding Wear
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Topics: Adhesion, Plasticity, Surface roughness, Wear, Deformation, Adhesives, Surface topography, Polishing
Journal Articles

Tribological Characteristics of Tantalum-Oxide Coating Fabricated on Pre-Treated 2024 Aluminum Alloys

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Sevda Albayrak, Canser Gül, Hanifi Çinici, Ömer Şahin
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. October 2023, 145(10): 101706.
Paper No: TRIB-23-1088
https://doi.org/10.1115/1.4062721
Published Online: June 26, 2023
View Articletitled, Tribological Characteristics of Tantalum-Oxide Coating Fabricated on Pre-Treated 2024 Aluminum Alloys
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Topics: Aluminum alloys, Coating processes, Coatings, Tantalum, Wear, Polishing, Tribology, Wear testing
Journal Articles

Effect of Sliding Velocity on UHMWPE and VEXLPE Friction Against CoCr in Multidirectional, Serum Lubricated Conditions

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Vesa Saikko, Omar Morad, Raine Viitala
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Briefs
J. Tribol. March 2023, 145(3): 034501.
Paper No: TRIB-22-1298
https://doi.org/10.1115/1.4056224
Published Online: November 23, 2022
View Articletitled, Effect of Sliding Velocity on UHMWPE and VEXLPE Friction Against CoCr in Multidirectional, Serum Lubricated Conditions
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Topics: Disks, Friction, Lubrication, Polishing
Journal Articles

Tribo-Oxidation and Tribological Behavior of TaC–20%SiC Composites at Elevated Temperatures

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Zihao Wu, Shubo Zhang, Hao Chen, Wanxiu Hai, Meiling Liu, Wenzhou Sun, Falian Qin
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. February 2023, 145(2): 021701.
Paper No: TRIB-21-1457
https://doi.org/10.1115/1.4055845
Published Online: October 26, 2022
View Articletitled, Tribo-Oxidation and Tribological Behavior of TaC–20%SiC Composites at Elevated Temperatures
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Topics: Composite materials, Oxidation, Temperature, Tribology, Wear, Friction, Polishing
Journal Articles

On the Planarization Mechanism and Pad Aging Effects of Soft Pad Polishing: A Perspective From the Micro-Mechanical Properties of Soft Pads

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Yeau-Ren Jeng, Ping-Chi Tsai, Yu-Zheng Lin
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research-Article
J. Tribol. June 2019, 141(6): 064501.
Paper No: TRIB-17-1422
https://doi.org/10.1115/1.4043348
Published Online: April 18, 2019
View Articletitled, On the Planarization Mechanism and Pad Aging Effects of Soft Pad Polishing: A Perspective From the Micro-Mechanical Properties of Soft Pads
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Topics: Polishing, Testing, Microscale devices, Storage, Dynamic testing (Materials)
Journal Articles

The Effects of Microdimple Texture on the Friction and Thermal Behavior of a Point Contact

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S. Li, U. Parmar
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research-Article
J. Tribol. July 2018, 140(4): 041503.
Paper No: TRIB-17-1417
https://doi.org/10.1115/1.4039228
Published Online: March 2, 2018
View Articletitled, The Effects of Microdimple Texture on the Friction and Thermal Behavior of a Point Contact
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Topics: Disks, Friction, Lubrication, Pressure, Stress, Surface texture, Temperature, Texture (Materials), Surface roughness, Tribology
Journal Articles

Effect of CoCr Counterface Roughness on the Wear of UHMWPE in the Noncyclic RandomPOD Simulation

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Vesa Saikko, Vesa Vuorinen, Hannu Revitzer
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research-Article
J. Tribol. March 2017, 139(2): 021606.
Paper No: TRIB-16-1008
https://doi.org/10.1115/1.4033648
Published Online: August 11, 2016
View Articletitled, Effect of CoCr Counterface Roughness on the Wear of UHMWPE in the Noncyclic RandomPOD Simulation
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Topics: Knee, Simulation, Surface roughness, Wear, Disks, Polishing
Journal Articles

Frictional Behavior and Topography of Porous Polyurethane on Copper and Silicon Dioxide Articulating Contacts

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David C. Ponte, D. M. L. Meyer
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research-Article
J. Tribol. July 2016, 138(3): 031604.
Paper No: TRIB-15-1302
https://doi.org/10.1115/1.4032523
Published Online: April 25, 2016
View Articletitled, Frictional Behavior and Topography of Porous Polyurethane on Copper and Silicon Dioxide Articulating Contacts
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Topics: Copper, Polymers, Pressure, Silicon, Tribometers, Uncertainty, Urethane elastomers, Surface roughness, Tribology, Uncertainty analysis
Journal Articles

Investigation of Protein Adsorption Mechanism and Biotribological Properties at Simulated Stem-Cement Interface

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Hongyu Zhang, Shaohua Zhang, Jianbin Luo, Yuhong Liu, Shanhua Qian, Fanghui Liang, Yongling Huang
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research-Article
J. Tribol. July 2013, 135(3): 032301.
Paper No: TRIB-11-1217
https://doi.org/10.1115/1.4023802
Published Online: April 29, 2013
View Articletitled, Investigation of Protein Adsorption Mechanism and Biotribological Properties at Simulated Stem-Cement Interface
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Topics: Bone, Cements (Adhesives), Polishing, Proteins, Tribology, Stainless steel, Disks, Biotribology, Titanium alloys, Pins (Engineering)
Journal Articles

Analysis of Laminar Flow Over a Non-Conventional Random Rough Surface Based on Lattice Boltzmann Method

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Ping Zhou, Dongming Guo, Renke Kang, Zhuji Jin
Journal: Journal of Tribology
Publisher: ASME
Article Type: Other (Seals, Manufacturing)
J. Tribol. January 2012, 134(1): 012201.
https://doi.org/10.1115/1.4005517
Published Online: February 9, 2012
View Articletitled, Analysis of Laminar Flow Over a Non-Conventional Random Rough Surface Based on Lattice Boltzmann Method
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Topics: Flow (Dynamics), Lattice Boltzmann methods, Polishing, Surface roughness, Simulation
Journal Articles

Coffee Stain Ring Effect and Nonuniform Material Removal in Chemical Mechanical Polishing

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Jianguo Xin
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. October 2010, 132(4): 041605.
https://doi.org/10.1115/1.4002108
Published Online: October 7, 2010
View Articletitled, Coffee Stain Ring Effect and Nonuniform Material Removal in Chemical Mechanical Polishing
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Topics: Evaporation, Flow (Dynamics), Polishing, Semiconductor wafers, Slurries, Microfluidics
Journal Articles

Solution of Reynolds Equation in Polar Coordinates Applicable to Nonsymmetric Entrainment Velocities

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Kurt Beschorner, C. Fred Higgs, III, Michael Lovell
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Briefs
J. Tribol. July 2009, 131(3): 034501.
https://doi.org/10.1115/1.3118783
Published Online: May 22, 2009
View Articletitled, Solution of Reynolds Equation in Polar Coordinates Applicable to Nonsymmetric Entrainment Velocities
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Topics: Disks, Navier-Stokes equations, Polishing, Pressure, Semiconductor wafers
Journal Articles

A Particle-Augmented Mixed Lubrication Modeling Approach to Predicting Chemical Mechanical Polishing

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Elon J. Terrell, C. Fred Higgs, III
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. January 2009, 131(1): 012201.
https://doi.org/10.1115/1.2991173
Published Online: December 2, 2008
View Articletitled, A Particle-Augmented Mixed Lubrication Modeling Approach to Predicting Chemical Mechanical Polishing
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Topics: Modeling, Particulate matter, Polishing, Semiconductor wafers, Simulation, Wear, Lubrication, Slurries, Contact mechanics, Particle dynamics
Journal Articles

Comparison of Interfacial Forces During Post-Chemical-Mechanical-Polishing Cleaning

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Dedy Ng, Hong Liang
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. April 2008, 130(2): 021603.
https://doi.org/10.1115/1.2908896
Published Online: May 7, 2008
View Articletitled, Comparison of Interfacial Forces During Post-Chemical-Mechanical-Polishing Cleaning
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Topics: Adhesion, Drag (Fluid dynamics), Fluids, Friction, Lubrication, Particulate matter, Polishing, Semiconductor wafers, Van der Waals forces, Pressure
Journal Articles

A Modeling Approach for Predicting the Abrasive Particle Motion During Chemical Mechanical Polishing

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Elon J. Terrell, C. Fred Higgs III
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Papers
J. Tribol. October 2007, 129(4): 933–941.
https://doi.org/10.1115/1.2768614
Published Online: April 18, 2007
View Articletitled, A Modeling Approach for Predicting the Abrasive Particle Motion During Chemical Mechanical Polishing
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Topics: Particulate matter, Semiconductor wafers, Simulation, Slurries, Modeling, Polishing, Flow (Dynamics)
Journal Articles

On the CMP Material Removal at the Molecular Scale

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L. Chang
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Briefs
J. Tribol. April 2007, 129(2): 436–437.
https://doi.org/10.1115/1.2647829
Published Online: November 13, 2006
View Articletitled, On the CMP Material Removal at the Molecular Scale
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Topics: Chemistry, Particulate matter, Polishing, Semiconductor wafers, Slurries, Semiconductors (Materials)
Journal Articles

Analysis of the Tribological Mechanisms Arising in the Chemical Mechanical Polishing of Copper-Film Wafers When Using a Pad With Concentric Grooves

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Jen Fin Lin, Sheng-Chao Chen, Yu Long Ouyang, Ming Shih Tsai
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. July 2006, 128(3): 445–459.
https://doi.org/10.1115/1.2194913
Published Online: March 8, 2006
View Articletitled, Analysis of the Tribological Mechanisms Arising in the Chemical Mechanical Polishing of Copper-Film Wafers When Using a Pad With Concentric Grooves
Open the PDF for Analysis of the Tribological Mechanisms Arising in the Chemical Mechanical Polishing of Copper-Film Wafers When Using a Pad With Concentric Grooves in another window
Topics: Copper, Polishing, Pressure, Semiconductor wafers, Lubrication, Surface roughness, Slurries, Abrasives, Particulate matter
Journal Articles

Revisiting the Removal Rate Model for Oxide CMP

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Jamshid Sorooshian, Leonard Borucki, David Stein, Robert Timon, Dale Hetherington, Ara Philipossian
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. July 2005, 127(3): 639–651.
https://doi.org/10.1115/1.1866168
Published Online: June 13, 2005
View Articletitled, Revisiting the Removal Rate Model for Oxide CMP
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Topics: Heating, Photovoltaics, Polishing, Pressure, Semiconductor wafers, Temperature, Slurries, Electromagnetic scattering, Silicon