When a drop of coffee dries on the counter-top, it leaves a dense, ringlike stain along its perimeter. Solids immersed in a drying drop will migrate toward the edge of the drop and form a solid ring. Such phenomena create ringlike stains and happen for a wide variety of surfaces, solvents, and solutes. It is referred to as the coffee stain ring effect. The phenomenon is caused by the outward microfluidic flow of the solute within the drop, which is driven by the evaporation of solvent. We show that the mechanism for the ring effect contributes to the nonuniform material removal in chemical mechanical polishing (CMP), specifically, at edges of blanket wafers causing the edge effect or at edges and corners of protrusive features on patterned wafers inducing the doming effect; metal dishing and dielectric erosion. By controlling the evaporation profile of the solvent in the slurry layer between the wafer surface and the polishing pad, such as making grooves or embedding the abrasive particles on the pad, or delivering the slurry from the bottom of the pad, one can improve the uniformity of material removal during the CMP process.
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October 2010
Research Papers
Coffee Stain Ring Effect and Nonuniform Material Removal in Chemical Mechanical Polishing
Jianguo Xin
Jianguo Xin
Department of Mathematics and Statistics,
e-mail: jxin@uncc.edu
University of North Carolina
, Charlotte, NC 28223
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Jianguo Xin
Department of Mathematics and Statistics,
University of North Carolina
, Charlotte, NC 28223e-mail: jxin@uncc.edu
J. Tribol. Oct 2010, 132(4): 041605 (6 pages)
Published Online: October 7, 2010
Article history
Received:
November 16, 2009
Revised:
June 12, 2010
Online:
October 7, 2010
Published:
October 7, 2010
Citation
Xin, J. (October 7, 2010). "Coffee Stain Ring Effect and Nonuniform Material Removal in Chemical Mechanical Polishing." ASME. J. Tribol. October 2010; 132(4): 041605. https://doi.org/10.1115/1.4002108
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