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Keywords: Electronic cooling
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. August 2025, 17(8): 081006.
Paper No: TSEA-25-1060
Published Online: May 20, 2025
... gray relation analysis ANOVA electronic cooling heat exchangers thermal systems Electronic components such as central process units (CPUs) and graphics processing units (GPUs) reach high temperatures during their operation, and their performance decreases with temperature increase. Also...
Journal Articles
Accepted Manuscript
Publisher: ASME
Article Type: Technical Briefs
J. Thermal Sci. Eng. Appl.
Paper No: TSEA-25-1080
Published Online: May 13, 2025
...@haut.edu.cn Electronic Cooling Energy Efficiency Energy Systems Low Temperature Heat Transfer Thermophysical Properties Accepted Manuscript Not Copyedited Journal of Thermal Science and Engineering Applications. Received February 07, 2025; Accepted manuscript posted May 13, 2025. doi:10.1115...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. July 2025, 17(7): 071003.
Paper No: TSEA-25-1057
Published Online: April 10, 2025
...Mulani Feroz Osman; M. Deepu Latent energy storages associated with renewable energy devices and electronics cooling systems generally experience irregular heat transfer supplies leading to large temperature or heat flux variations in the heat transfer boundary. Wavy heat transfer surfaces...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2025, 17(6): 061007.
Paper No: TSEA-24-1576
Published Online: March 20, 2025
... length [mm] Δ P = Pressure drop [kPa] power motor oil cooling structure design channel optimization electronic cooling energy efficiency heat exchangers heat transfer enhancement References [1] Breban , S. , Dranca , M. , Chirca , M...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. April 2025, 17(4): 041004.
Paper No: TSEA-24-1360
Published Online: February 21, 2025
... Electronic Cooling Using Flat and Enhanced Surfaces ,” IEEE Trans. Compon. Packag. Technol. , 26 ( 1 ), pp. 99 – 109 . 10.1109/TCAPT.2003.811478 [15] Lamaison , N. , Ong , C. L. , Marcinichen , J. B. , and Thome , J. R. , 2017 , “ Two-Phase Mini-Thermosyphon Electronics Cooling...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. May 2025, 17(5): 051001.
Paper No: TSEA-23-1566
Published Online: February 20, 2025
... and optimized design of TPMS structural heat sink model Fluid dynamics simulation and optimized design of TPMS structural heat sink model liquid-cooled IGBT TPMS structure thermal analysis conduction electronic cooling forced convection heat and mass transfer porous media National...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2024, 16(12): 121004.
Paper No: TSEA-24-1163
Published Online: October 15, 2024
... battery charging electric vehicles energy optimization phase change material (PCM) electronic cooling melting and solidification natural and mixed convection thermal systems Birla Institute of Technology and Science, Pilani 10.13039/501100006464 Research Initiation Grant (RIG...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2024, 16(12): 121006.
Paper No: TSEA-24-1295
Published Online: October 15, 2024
... , “ A Review of the State-of-the-Art in Electronic Cooling ,” e-Prime-Adv. Electr. Eng. Electron. Energy , 1 , p. 100009 . 10.1016/j.prime.2021.100009 [4] Dahir , N. , Karkar , A. , Palesi , M. , Mak , T. , and Yakovlev , A. , 2021 , “ Power Density Aware Application Mapping...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. November 2024, 16(11): 111008.
Paper No: TSEA-24-1211
Published Online: September 24, 2024
... and Transversal-Wavy Microchannel Heat Sinks for Electronic Cooling ,” ASME J. Electron. Packag. , 135 ( 2 ), p. 021008 . 10.1115/1.4023530 [16] Rostami , J. , Abbassi , A. , and Saffar-Avval , M. , 2015 , “ Optimization of Conjugate Heat Transfer in Wavy Walls Microchannels ,” Appl...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. November 2024, 16(11): 111001.
Paper No: TSEA-24-1253
Published Online: September 10, 2024
... 07 08 2024 09 08 2024 10 09 2024 Graphical Abstract Figure pool boiling stacking ensemble Random Forest CHF BHTC electronic cooling heat transfer enhancement In heat transfer, pool boiling is extremely efficient for various industrial applications like...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2024, 16(9): 091009.
Paper No: TSEA-24-1105
Published Online: July 12, 2024
...@cec.sc.edu 09 03 2024 09 06 2024 12 06 2024 12 07 2024 Graphical Abstract Figure heat pipe 3D printing flexible polymer dielectric electronic cooling Heat pipes are highly efficient thermal transfer devices that utilize the two-phase heat and mass...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2024, 16(9): 091006.
Paper No: TSEA-23-1499
Published Online: June 13, 2024
... 2023 03 05 2024 06 05 2024 13 06 2024 Graphical Abstract Figure capillary pumped loop pump-assisted cooling high heat flux evaporator electronics thermal management capillary-fed boiling two-phase flow electronic cooling evaporation porous media two-phase flow...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. August 2024, 16(8): 081002.
Paper No: TSEA-23-1589
Published Online: May 23, 2024
... optimization electronic cooling energy systems The demand for renewable energy is increasing rapidly due to the vigorous development of the new energy industry. Renewable energy sources, such as solar and wind energy, are characterized by their intermittency and lack of dispatchability. Consequently...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. July 2024, 16(7): 071008.
Paper No: TSEA-23-1571
Published Online: May 10, 2024
...: amohanty_me@vssut.ac.in 08 12 2023 05 04 2024 14 04 2024 10 05 2024 Graphical Abstract Figure free convection heat sink design rectangular slots Nusselt number heat transfer neck position conduction electronic cooling extended surfaces/fins heat and mass...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. July 2024, 16(7): 071010.
Paper No: TSEA-24-1018
Published Online: May 10, 2024
... , V. V. , and Mahajan , R. L. , 2000 , “ Forced Convection in High Porosity Metal Foams ,” ASME J. Heat Transfer , 122 ( 3 ), pp. 557 – 565 . 10.1115/1.1287793 [2] Bhattacharya , A. , and Mahajan , R. L. , 2002 , “ Finned Metal Foam Heat Sinks for Electronics Cooling...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2024, 16(6): 061010.
Paper No: TSEA-23-1568
Published Online: April 16, 2024
... boiling microchannel two-phase flow multiple cavity bubbles electronic cooling heat transfer enhancement The continuous advancement in the functionality and miniaturization of electronic components facilitates a rapid surge in transistor counts within microprocessors, doubling every 2 years...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. April 2024, 16(4): 041009.
Paper No: TSEA-23-1373
Published Online: February 19, 2024
... a significant role in improving the efficiency and reliability of electronic components. These findings demonstrate the potential of using the nanofluids in thermosyphons to enhance their thermal performance in electronic cooling applications. Email: jobin.jose@vit.ac.in 1 Corresponding author. Email...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. April 2024, 16(4): 041004.
Paper No: TSEA-23-1360
Published Online: February 16, 2024
... 16 02 2024 Al 2 O 3 –water nanofluids branch angle performance factor branched wavy heat sink RNG k–ɛ model secondary width electronic cooling extended surfaces/fins forced convection heat and mass transfer heat transfer enhancement Electrical power equipment...