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Journal Articles

Experimental investigation on the thermal performance of a large-size aluminum vapor chamber for multi-point heat sources

Accepted Manuscript
Jie Zhou, Dongdong Zhan, Jiyu Qian, Tao Wei
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl.
Paper No: TSEA-24-1181
https://doi.org/10.1115/1.4066377
Published Online: August 26, 2024
View Article titled, Experimental investigation on the thermal performance of a large-size aluminum vapor chamber for multi-point heat sources
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Topics: Aluminum, Heat, Vapors, Energy dissipation, Heating, Temperature, Computer cooling, Diffusion (Physics), Electronic equipment, Evaporation
Journal Articles

A Multivariable Numerical Investigation of Wavy-Based Microchannel Heat Sink Geometry Towards Optimal Thermal Performance

Accepted Manuscript
Ahmed T. Eltaweel, Ibrahim Hassan
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl.
Paper No: TSEA-24-1211
https://doi.org/10.1115/1.4066263
Published Online: August 20, 2024
View Article titled, A Multivariable Numerical Investigation of Wavy-Based Microchannel Heat Sink Geometry Towards Optimal Thermal Performance
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Topics: Computer cooling, Geometry, Heat sinks, Heat transfer, Microchannels, Thermal resistance, Design, Flow (Dynamics), Coolants, Engineering simulation
Journal Articles

Optimized design and simulation study of liquid-cooled heat sink model for IGBT module based on TPMS structure

Accepted Manuscript
Fuyin Wei, Xianglong Sun, Zhuopei Lv, Lixiang Cai, Feiqi Zhai, Chenyang Kong, Jianping Shi, Hua Zhang
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl.
Paper No: TSEA-23-1566
https://doi.org/10.1115/1.4065747
Published Online: June 17, 2024
View Article titled, Optimized design and simulation study of liquid-cooled heat sink model for IGBT module based on TPMS structure
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Topics: Design, Heat, Heat sinks, Insulated-gate bipolar transistors, Simulation, Triply periodic minimal surfaces, Pressure drop, Computer cooling, Computer software, Diamonds
Journal Articles

Experimental Research on an Embedded Heat Source Vapor Chamber for Aerospace Electronic Cooling

Lianfeng Ren, Le Zhang, Yifu Liang, Yujun Su, Xin Li, Yong Tang
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. May 2024, 16(5): 051008.
Paper No: TSEA-23-1303
https://doi.org/10.1115/1.4064984
Published Online: March 19, 2024
View Article titled, Experimental Research on an Embedded Heat Source Vapor Chamber for Aerospace Electronic Cooling
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Topics: Aerospace industry, Copper, Environmental health and safety, Heat, Temperature, Thermal resistance, Vapors, Stress, Energy dissipation, Temperature distribution
Journal Articles

User Preference-Oriented Design of Heat Dissipating Elements for Densely Packaged Transistors With Consideration of Design Robustness

Mark Christian E. Manuel, Kuan Sung Hsu, Shu-Ping Lin, Po Ting Lin
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. June 2017, 9(2): 021012.
Paper No: TSEA-16-1057
https://doi.org/10.1115/1.4035837
Published Online: March 7, 2017
View Article titled, User Preference-Oriented Design of Heat Dissipating Elements for Densely Packaged Transistors With Consideration of Design Robustness
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Topics: Computer cooling, Design, Heat, Preferences, Response surface methodology, Robustness, Temperature, Cooling, Flow (Dynamics), Transistors
Journal Articles

Compact Gravity Driven and Capillary-Sized Thermosyphon Loop for Power Electronics Cooling

Francesco Agostini, Thomas Gradinger, Didier Cottet
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. September 2014, 6(3): 031003.
Paper No: TSEA-13-1121
https://doi.org/10.1115/1.4026184
Published Online: January 31, 2014
View Article titled, Compact Gravity Driven and Capillary-Sized Thermosyphon Loop for Power Electronics Cooling
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Topics: Computer cooling, Condensers (steam plant), Cooling, Flow (Dynamics), Fluids, Gravity (Force), Temperature, Thermal resistance, Refrigerants, Pressure drop
Journal Articles

Analysis of Liquid-Cooled Heat Sink Used for Power Electronics Cooling

Hemin Hu, Jiahui Zhang, Xiaoze Du, Lijun Yang
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2011, 3(2): 021001.
https://doi.org/10.1115/1.4004079
Published Online: July 13, 2011
View Article titled, Analysis of Liquid-Cooled Heat Sink Used for Power Electronics Cooling
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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Shapes, Temperature, Coolants, Pressure drop, Computer cooling, Density, Heat
Journal Articles

Nanofluid Properties and Their Effects on Convective Heat Transfer in an Electronics Cooling Application

Jessica Townsend, Rebecca J. Christianson
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2009, 1(3): 031006.
https://doi.org/10.1115/1.4001123
Published Online: March 16, 2010
View Article titled, Nanofluid Properties and Their Effects on Convective Heat Transfer in an Electronics Cooling Application
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Topics: Computer cooling, Nanofluids, Thermal conductivity, Viscosity, Water, Temperature, Fluids, Nanoparticles, Particulate matter, Flow (Dynamics)