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Z. P. Wang
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Proceedings Papers

Low Temperature Anodic Bonding for MEMS Applications

J. Wei, Z. P. Wang, L. Wang, G. Y. Li, Z. Q. Mo
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 61-66, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39272
https://doi.org/10.1115/IMECE2002-39272
View Paper titled, Low Temperature Anodic Bonding for MEMS Applications
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Topics: Bonding, Low temperature, Microelectromechanical systems, Taguchi methods
Proceedings Papers

Gold to Gold Thermosonic Flip Chip Bonding on Ceramic Substrate

J. Wei, Z. P. Wang, Y. M. Tan
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 431-436, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39685
https://doi.org/10.1115/IMECE2002-39685
View Paper titled, Gold to Gold Thermosonic Flip Chip Bonding on Ceramic Substrate
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Topics: Bonding, Ceramics, Flip-chip, Flip-chip devices, Shear (Mechanics)
Journal Articles

Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy

X. Q. Shi, Z. P. Wang, Q. J. Yang, H. L. J. Pang
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. January 2003, 125(1): 81–88.
https://doi.org/10.1115/1.1525254
Published Online: December 31, 2002
View Article titled, Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy
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Topics: Creep, Solders, Temperature, Dislocations, Stress, Alloys, Diffusion (Physics), Tin
Journal Articles

A New Creep Constitutive Model for Eutectic Solder Alloy

X. Q. Shi, Z. P. Wang, W. Zhou, H. L. J. Pang, Q. J. Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 85–90.
https://doi.org/10.1115/1.1462624
Published Online: May 2, 2002
View Article titled, A New Creep Constitutive Model for Eutectic Solder Alloy
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Topics: Constitutive equations, Creep, Solders, Stress, Temperature
Journal Articles

CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis

John H. L. Pang, C. W. Seetoh, Z. P. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 255–261.
https://doi.org/10.1115/1.1286120
Published Online: September 1, 2000
View Article titled, CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis
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Topics: Creep, Finite element analysis, Solder joints, Temperature, Stress, Solders
Journal Articles

Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121 , pp. 179–185]

X. Q. Shi,, W. Zhou,, H. L. J. Pang, and, Z. P. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2000, 122(1): 74.
https://doi.org/10.1115/1.483136
Published Online: March 1, 2000
View Article titled, Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121 , pp. 179–185]
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Topics: Alloys, Electrons, Mechanical properties, Solders, Temperature, Eutectic alloys, Soldering, Stress-strain relations, Thermomechanical treatment
Journal Articles

Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy

X. Q. Shi, W. Zhou, H. L. J. Pang, Z. P. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 179–185.
https://doi.org/10.1115/1.2792681
Published Online: September 1, 1999
View Article titled, Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy
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Topics: Alloys, Mechanical properties, Solders, Temperature, Testing