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Journal Articles

Modeling Microwave-Enhanced Chemical Vapor Infiltration Process for Preventing Premature Pore Closure

Accepted Manuscript
Wenjun Ge, Vimal Ramanuj, Mengnan Li, Ramanan Sankaran, Ying She, Zissis Dardas
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer.
Paper No: HT-24-1222
https://doi.org/10.1115/1.4067067
Published Online: November 2, 2024
View Article titled, Modeling Microwave-Enhanced Chemical Vapor Infiltration Process for Preventing Premature Pore Closure
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Topics: Microwaves, Modeling, Vapors, Preforms, Temperature, Microwave heating, Composite materials, Gases, Ceramics, Chemistry
Proceedings Papers

Modeling Microwave-Enhanced Chemical Vapor Infiltration Process for Preventing Premature Pore Closure

Wenjun Ge, Vimal Ramanuj, Mengnan Li, Ramanan Sankaran, Ying She, Zissis Dardas
Proc. ASME. HT2024, ASME 2024 Heat Transfer Summer Conference, V001T10A001, July 15–17, 2024
Publisher: American Society of Mechanical Engineers
Paper No: HT2024-130666
https://doi.org/10.1115/HT2024-130666
View Paper titled, Modeling Microwave-Enhanced Chemical Vapor Infiltration Process for Preventing Premature Pore Closure
Open the PDF for Modeling Microwave-Enhanced Chemical Vapor Infiltration Process for Preventing Premature Pore Closure in another window
Topics: Microwaves, Modeling, Vapors, Preforms, Temperature, Microwave heating, Composite materials, Gases, Ceramics, Chemistry
Journal Articles

Challenges in Three-Dimensional Printing of High-Conductivity Copper

Tahany I. El-Wardany, Ying She, Vijay N. Jagdale, Jacquelynn K. Garofano, Joe J. Liou, Wayde R. Schmidt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020907.
Paper No: EP-17-1104
https://doi.org/10.1115/1.4039974
Published Online: May 9, 2018
View Article titled, Challenges in Three-Dimensional Printing of High-Conductivity Copper
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Topics: Copper, Copper powders, Lasers, Porosity, Electrical conductivity, Additive manufacturing, Density, Modeling, Thermal conductivity
Proceedings Papers

Challenges in 3D Printing of High Conductivity Copper

Tahany El-Wardany, Ying She, Vijay Jagdale, Jacquelynn K. Garofano, Joe Liou, Wayde Schmidt
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74306
https://doi.org/10.1115/IPACK2017-74306
View Paper titled, Challenges in 3D Printing of High Conductivity Copper
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Topics: Additive manufacturing, Copper, Electrical conductivity, Thermal conductivity, Engines, Motors, Electromagnetic induction, Machinery, Aerospace industry, Electric vehicles