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Proceedings Papers

Assessment of Chip-Scale Package Design Options

Sue Y. Teng, Yifan Guo, Vijay Sarihan

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 15-20, November 16–21, 1997

Paper No: IMECE1997-0811

DOI: https://doi.org/10.1115/IMECE1997-0811

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Topics: Design, Manufacturing, Simulation, Density, Equipment performance, Finite element analysis, Flip-chip, Shrinkage (Materials), Thermal stresses

Proceedings Papers

Testing and Measurement Techniques Applied to Electronic Packaging Development

Yifan Guo, Vijay Sarihan

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 85-90, November 16–21, 1997

Paper No: IMECE1997-1231

DOI: https://doi.org/10.1115/IMECE1997-1231

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Topics: Electronic packaging, Testing, Cycles, Design, Electronic packages, Electronics, Engineering disciplines, Event history analysis, Experimental methods, Packaging

Proceedings Papers

Accelerated Reliability Testing Method for Sensors With a Pulsing Membrane Structure

Yifan Guo, Vijay Sarihan, Tom Lee

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 23-27, November 16–21, 1997

Paper No: IMECE1997-1223

DOI: https://doi.org/10.1115/IMECE1997-1223

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Topics: Accelerated life testing, Membranes, Sensors, Reliability, Testing, Failure, High temperature, Stress, Cycles, Deformation

Proceedings Papers

A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry

Xiaoyuan He, Daqing Zou, Sheng Liu, Yifan Guo

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 97-103, November 16–21, 1997

Paper No: IMECE1997-1233

DOI: https://doi.org/10.1115/IMECE1997-1233

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Topics: Interferometry, Displacement, Computer software, Phase diagrams, Computer programming, Deformation, Diffraction gratings, Electronic packages, Flip-chip

Proceedings Papers

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

Daqing Zou, Xiaoyuan He, Sheng Liu, Yifan Guo, Fulong Dai

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 69-76, November 16–21, 1997

Paper No: IMECE1997-1229

DOI: https://doi.org/10.1115/IMECE1997-1229

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Topics: Corners (Structural elements), Deformation, Interferometry, Computer software, Electronic packaging, Failure, Flip-chip, Flip-chip packages, Image processing, Nanoscale phenomena

Proceedings Papers

Die Strength Evaluation in the Presence of Edge Cracks

Betty Leung, Yifan Guo, Vijay Sarihan

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 125-131, November 16–21, 1997

Paper No: IMECE1997-0507

DOI: https://doi.org/10.1115/IMECE1997-0507

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Topics: Fracture (Materials), Reliability, Stress, Testing, Failure analysis, Finite element analysis, Manufacturing, Silicon

Proceedings Papers

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Daqing Zou, Xiaoyuan He, Minfu Lu, Sheng Liu, Yifan Guo

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 59-64, November 15–20, 1998

Paper No: IMECE1998-0429

DOI: https://doi.org/10.1115/IMECE1998-0429

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Topics: Circuits, Control equipment, Corners (Structural elements), Deformation, Density, Displacement, Electronic packages, Flip-chip, Flip-chip packages, Interferometers

Proceedings Papers

A Testing Method and Device for Intrinsic Stress Measurement in Wafer Bumping Process

Yifan Guo, Dianne Mitchell, Vijay Sarihan, Dawei Zheng

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 135-140, November 15–20, 1998

Paper No: IMECE1998-0438

DOI: https://doi.org/10.1115/IMECE1998-0438

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Topics: Semiconductor wafers, Stress, Testing, Membranes, Sensors, Pressure sensors, Deformation, Residual stresses, Signals

Proceedings Papers

Microtensile Methodology for Mechanical Characterization of Thin Films

Betty H. Yeung, Bill Lytle, Vijay Sarihan, David T. Read, Yifan Guo

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 69-72, November 11–16, 2001

Paper No: IMECE2001/EPP-24708

DOI: https://doi.org/10.1115/IMECE2001/EPP-24708

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Topics: Thin films, National Institute of Standards and Technology, Materials properties, Materials science, Metallic films, Metals, Optimization, Reliability, Silicon

Proceedings Papers

Warpage Analysis of Panelized Molding Process for Plastic IC Packages

Bhuvaneshwaran Vijayakumar, Yifan Guo

Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 139-146, November 13–19, 2004

Paper No: IMECE2004-59168

DOI: https://doi.org/10.1115/IMECE2004-59168