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Yi-Hsin Pao
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Journal Articles

A Damage Evolution Model for Thermal Fatigue Analysis of Solder Joints

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Xiaowu Zhang, S-W. Ricky Lee, Mem. ASME,, Yi-Hsin Pao, Mem. ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 200–206.
https://doi.org/10.1115/1.1286121
Published Online: October 31, 1999
View Articletitled, A Damage Evolution Model for Thermal Fatigue Analysis of Solder Joints
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Topics: Creep, Damage, Solder joints, Solders, Fatigue life, Manufacturing, Density, Materials properties, Finite element analysis, Stress
Journal Articles

Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints

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Z. Guo, Yi-Hsin Pao, H. Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 100–104.
https://doi.org/10.1115/1.2792074
Published Online: June 1, 1995
View Articletitled, Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints
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Topics: Deformation, Solder joints, Temperature, Shear rate, Shear stress, Creep, Diffusion (Physics), Dislocations, Grain size, High temperature
Journal Articles

Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints

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Edward Jih, Yi-Hsin Pao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 94–99.
https://doi.org/10.1115/1.2792087
Published Online: June 1, 1995
View Articletitled, Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints
Open the PDF for Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints in another window
Topics: Design, Resistors, Solder joints, Finite element analysis, Capacitors, Cracking (Materials), Creep, Electronic packaging, Failure, Fatigue
Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

Free
Donald Barker, Hans Conrad, Peter Engel, Tai-Ran Hsu, John Lau, Yi-Hsin Pao, Anthony Rafanelli, Harvey Solomon, Donald Stone, Frank Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 1993, 115(2): 139–140.
https://doi.org/10.1115/1.2909308
Published Online: June 1, 1993
View Articletitled, Special Issue on Mechanics of Surface Mount Assemblies
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Topics: Surface mount assemblies
Journal Articles

An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints

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Yi-Hsin Pao, Ratan Govila, Scott Badgley, Edward Jih
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 1–8.
https://doi.org/10.1115/1.2909296
Published Online: March 1, 1993
View Articletitled, An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints
Open the PDF for An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints in another window
Topics: Fatigue, Finite element analysis, Fracture (Materials), Solder joints, Solders, Stress, Creep, Alloys, Cycles, Failure
Journal Articles

A Note on the Implementation of Temperature Dependent Coefficient of Thermal Expansion (CTE) in ABAQUS

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Yi-Hsin Pao, Edward Jih, Bruce E. Artz, Larry W. Cathey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1992, 114(4): 470–472.
https://doi.org/10.1115/1.2905483
Published Online: December 1, 1992
View Articletitled, A Note on the Implementation of Temperature Dependent Coefficient of Thermal Expansion (CTE) in ABAQUS
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Topics: Temperature, Thermal expansion, Errors, Electronic packages, Engineers, Error analysis, Finite element analysis, Finite element model, Modeling, Temperature effects
Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

Free
Donald Barker, Hans Conrad, Peter Engel, John Lan, Yi-Hsin Pao, Anthony Rafanelli, Harvey Solomon, Donald Stone
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 1992, 114(2): 103.
https://doi.org/10.1115/1.2906403
Published Online: June 1, 1992
View Articletitled, Special Issue on Mechanics of Surface Mount Assemblies
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Topics: Surface mount assemblies
Journal Articles

Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling

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Yi-Hsin Pao, Scott Badgley, Ratan Govila, Linda Baumgartner, Richard Allor, Ron Cooper
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 135–144.
https://doi.org/10.1115/1.2906410
Published Online: June 1, 1992
View Articletitled, Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling
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Topics: Mechanical behavior, Solder joints, Fracture (Process), Solders, Stress, Creep, Fatigue, Shear stress, Adhesives, Alloys
Journal Articles

Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading

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Yi-Hsin Pao, Ellen Eisele
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 164–172.
https://doi.org/10.1115/1.2905382
Published Online: June 1, 1991
View Articletitled, Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading
Open the PDF for Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading in another window
Topics: Shear (Mechanics), Stress, Solder joints, Deflection, Differential equations, Dimensions, Materials properties, Shear stress, Temperature, Temperature controls
Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

Free
Peter A. Engel, John H. Lau, Yi-Hsin Pao, Anthony J. Rafanelli, Mohamed Zarrugh, Alex Zubelewicz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 1991, 113(2): 91.
https://doi.org/10.1115/1.2905389
Published Online: June 1, 1991
View Articletitled, Special Issue on Mechanics of Surface Mount Assemblies
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Topics: Surface mount assemblies
Journal Articles

Determination of Stress Intensity Factors for Interfacial Cracks in Bimaterial Systems

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Yi-Hsin Pao, Tsung-Yu Pan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 154–161.
https://doi.org/10.1115/1.2904356
Published Online: June 1, 1990
View Articletitled, Determination of Stress Intensity Factors for Interfacial Cracks in Bimaterial Systems
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Topics: Fracture (Materials), Stress, Finite element methods, Geometry, Numerical analysis, Shear (Mechanics)
Journal Articles

Deformation in Multilayer Stacked Assemblies

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Tsung-Yu Pan, Yi-Hsin Pao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 30–34.
https://doi.org/10.1115/1.2904337
Published Online: March 1, 1990
View Articletitled, Deformation in Multilayer Stacked Assemblies
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Topics: Deformation, Finite element analysis, Geometry, Manufacturing, Polynomials, Silicon, Solders, Stress, Temperature controls, Transistors