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Y.-W. Mai
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Proceedings Papers

Understanding and Testing for Drop Impact Failure

S. K. W. Seah, E. H. Wong, R. Ranjan, C. T. Lim, Y.-W. Mai
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1089-1094, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73047
https://doi.org/10.1115/IPACK2005-73047
View Paper titled, Understanding and Testing for Drop Impact Failure
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Topics: Failure, Testing, Inertia (Mechanics), Solder joints, Ball-Grid-Array packages, Electronics, Impact testing, Printed circuit boards, Shock (Mechanics), Stress
Journal Articles

Modeling Surface Electrodes on a Piezoelectric Layer

B.-L. Wang, Y.-W. Mai
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. March 2008, 75(2): 021007.
https://doi.org/10.1115/1.2775504
Published Online: February 20, 2008
View Article titled, Modeling Surface Electrodes on a Piezoelectric Layer
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Topics: Electrodes, Electric fields
Proceedings Papers

Nanoscratching of Nylon-Based Ternary Nanocomposites

A. Dasari, Z.-Z. Yu, Y.-W. Mai
Proc. ASME. IMECE2005, Materials, 585-588, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-82205
https://doi.org/10.1115/IMECE2005-82205
View Paper titled, Nanoscratching of Nylon-Based Ternary Nanocomposites
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Topics: Nanocomposites, Nylon fabrics, Stress, Cavitation, Microelectromechanical systems, Nanoscale phenomena, Atomic force microscopy, Diamonds, Fracture (Materials), Manganese (Metal)
Journal Articles

Board Level Drop Impact—Fundamental and Parametric Analysis

E. H. Wong, Y-W Mai, S. K. W. Seah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 496–502.
https://doi.org/10.1115/1.2065747
Published Online: March 30, 2005
View Article titled, Board Level Drop Impact—Fundamental and Parametric Analysis
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Topics: Stress, Dynamics (Mechanics), Springs, Manufacturing
Journal Articles

Periodic Antiplane Cracks in Graded Coatings Under Static or Transient Loading

B. L. Wang, Y.-W. Mai
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Additional Technical Papers
J. Appl. Mech. January 2006, 73(1): 134–142.
https://doi.org/10.1115/1.2043190
Published Online: March 8, 2005
View Article titled, Periodic Antiplane Cracks in Graded Coatings Under Static or Transient Loading
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Topics: Coatings, Fracture (Materials), Stress, Transients (Dynamics), Integral equations
Journal Articles

Rate-Dependent Transition From Thermal Softening to Hardening in Elastomers

Z. Chen, Mem. ASME, J. L. Atwood, Y.-W. Mai, Fellow ASME
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Brief Notes
J. Appl. Mech. July 2003, 70(4): 611–612.
https://doi.org/10.1115/1.1571860
Published Online: August 25, 2003
View Article titled, Rate-Dependent Transition From Thermal Softening to Hardening in Elastomers
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Topics: Elastic moduli, Elasticity, Elastomers, Hardening, Temperature, Viscosity, Packaging, Physics
Journal Articles

A Cracked Piezoelectric Material Strip Under Transient Thermal Loading

B. L. Wang, Y. W. Mai
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. July 2002, 69(4): 539–546.
https://doi.org/10.1115/1.1429935
Published Online: June 20, 2002
View Article titled, A Cracked Piezoelectric Material Strip Under Transient Thermal Loading
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Topics: Boundary-value problems, Fracture (Materials), Piezoelectric materials, Strips, Thermal stresses, Transients (Dynamics), Stress, Temperature
eBook Chapter

Two-Parameter (J-Q) Fracture Characterization of Ductile Tearing

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1995
ISBN-10: 0-8031-1996-8
ISBN: 978-0-8031-1996-3
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eBook Chapter

Cyclic Fatigue Mechanisms in Partially Stabilised Zirconia

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1995
ISBN-10: 0-8031-1996-8
ISBN: 978-0-8031-1996-3
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eBook Chapter

Constraint Effect on Fracture Behaviour of Adhesive Joints with Different Bond Thickness

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1995
ISBN-10: 0-8031-1996-8
ISBN: 978-0-8031-1996-3
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eBook Chapter

In-Plane Fracture Toughness Measurement of Paper

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1995
ISBN-10: 0-8031-1996-8
ISBN: 978-0-8031-1996-3
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eBook Chapter

Fracture-Resistance Curve Characteristic of a Sintered Al 2 O 3 /Zro 2 Ceramic

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1995
ISBN-10: 0-8031-1882-1
ISBN: 978-0-8031-1882-9
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eBook Chapter

Micromechanics of Fiber-Matrix Interface and Fracture of Advanced Composites with Engineered Interfaces

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1995
ISBN-10: 0-8031-1882-1
ISBN: 978-0-8031-1882-9
Open the PDF for Micromechanics of Fiber-Matrix Interface and Fracture of Advanced Composites with Engineered Interfaces in another window
eBook Chapter

Ductile-Brittle Fracture Transition as a Result of Increasing In-Plane Constraint in a Medium Carbon Steel

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1994
ISBN-10: 0-8031-1990-9
ISBN: 978-0-8031-1990-1
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eBook Chapter

Static Fatigue in Dilatant-Zone-Toughened Ceramics

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1993
ISBN-10: 0-8031-1867-8
ISBN: 978-0-8031-1867-6
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Journal Articles

Plastic Rotation Factors of Three-Point Bend and Compact Tension Specimens

S-X Wu, Y-W Mai, B Cotterell
Journal: Journal of Testing and Evaluation
Publisher: ASTM International
Article Type: Technical Notes
J. Test. Eval.. November 1988, 16(6): 555–557.
https://doi.org/10.1520/JTE11276J
Published Online: November 1, 1988
View Article titled, Plastic Rotation Factors of Three-Point Bend and Compact Tension Specimens
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