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Proceedings Papers

A Thermal Fatigue Model for Surface Mount Leadless Chip Resistor (LCR) Solder Joints

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Y.-H. Pao, E. Jih, V. Siddapureddy, X. Song, R. Liu, R. McMillan, J. M. Hu
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 1-12, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0884
https://doi.org/10.1115/IMECE1996-0884
View Paper titled, A Thermal Fatigue Model for Surface Mount Leadless Chip Resistor (LCR) Solder Joints
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Topics: Fatigue, Resistors, Solder joints, Surface mount packaging, Capacitors, Ceramics, Density, Failure, Failure analysis, Fatigue failure
Journal Articles

Vibration Mode Analysis of Frames by the Method of Reverberation Ray Matrix

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F. X. Miao, Guojun Sun, Y. H. Pao
Journal: Journal of Vibration and Acoustics
Publisher: ASME
Article Type: Research Papers
J. Vib. Acoust. October 2009, 131(5): 051005.
https://doi.org/10.1115/1.3147127
Published Online: September 10, 2009
View Articletitled, Vibration Mode Analysis of Frames by the Method of Reverberation Ray Matrix
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Topics: Finite element methods, Sound reverberation, Vibration, Displacement, Frequency response, Aluminum, Stress
Journal Articles

Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints

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W. Jung, J. H. Lau, Y.-H. Pao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 163–170.
https://doi.org/10.1115/1.2792229
Published Online: September 1, 1997
View Articletitled, Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints
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Topics: Ball-Grid-Array packaging, Solder joints, Reliability, Deformation, Finite element analysis, Manufacturing, Ball-Grid-Array packages, Ceramics, Computation, Constitutive equations
Journal Articles

Determination of Fracture Toughness of Thermally Conductive Adhesives

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E. Jih, Y.-H. Pao, X. Song, C. Larner
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 204–207.
https://doi.org/10.1115/1.2792235
Published Online: September 1, 1997
View Articletitled, Determination of Fracture Toughness of Thermally Conductive Adhesives
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Topics: Adhesives, Fracture toughness
Journal Articles

Development of an Integrated Design System for Thermal Reliability Prediction of SMT Solder Interconnects

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Y.-H. Pao, E. Jih, V. Siddapureddy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 235–243.
https://doi.org/10.1115/1.2792158
Published Online: December 1, 1996
View Articletitled, Development of an Integrated Design System for Thermal Reliability Prediction of SMT Solder Interconnects
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Topics: Design, Reliability, Solders
Journal Articles

Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack

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R. K. Govila, Y.-H. Pao, C. Larner, J. Lau, S. Twerefour, S. Erasmus, S. Dolot
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 184–190.
https://doi.org/10.1115/1.2905684
Published Online: September 1, 1994
View Articletitled, Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack
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Topics: Failure analysis, Solder joints, Water, Solders, Cycles, Crack propagation, Cracking (Materials), Failure, Failure mechanisms, Fatigue damage
Journal Articles

Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors

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R. K. Govila, E. Jih, Y.-H. Pao, C. Larner
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 83–88.
https://doi.org/10.1115/1.2905509
Published Online: June 1, 1994
View Articletitled, Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors
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Topics: Fatigue damage, Resistors, Solder joints, Solders, Damage, Stress concentration, Corners (Structural elements), Cracking (Materials), Cycles, Design
eBook Chapter

Thermomechanical and Fatigue Behavior of High-Temperature Lead and Lead-Free Solder Joints

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Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1994
https://doi.org/10.1520/STP23916S
ISBN-10: 0-8031-1994-1
ISBN: 978-0-8031-1994-9
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Journal Articles

Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints

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Y.-H. Pao, S. Badgley, E. Jih, R. Govila, J. Browning
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 147–152.
https://doi.org/10.1115/1.2909310
Published Online: June 1, 1993
View Articletitled, Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints
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Topics: Cycles, Fatigue, Solder joints, Creep, Deformation, Solders, Steady state, Cooling, Failure, Failure mechanisms
Journal Articles

Closure to “Discussion of ‘Axisymmetric Elastic Waves Excited by a Point Source in a Plate’” (1982, ASME J. Appl. Mech., 50, pp. 699–700)

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R. L. Weaver, Y. H. Pao
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Discussions
J. Appl. Mech. September 1983, 50(3): 700.
https://doi.org/10.1115/1.3167121
Published Online: September 1, 1983
View Articletitled, Closure to “Discussion of ‘Axisymmetric Elastic Waves Excited by a Point Source in a Plate’” (1982, ASME J. Appl. Mech., 50, pp. 699–700)
Open the PDF for Closure to “Discussion of ‘Axisymmetric Elastic Waves Excited by a Point Source in a Plate’” (1982, ASME J. Appl. Mech., 50, pp. 699–700) in another window
Topics: Elastic waves
Journal Articles

Seismic Migration—Imaging of Acoustic Energy by Wave Field Extrapolation

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A. J. Berkhout, Author, Y.-H. Pao, Reviewer
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Book Reviews
J. Appl. Mech. September 1982, 49(3): 682–683.
https://doi.org/10.1115/1.3162563
Published Online: September 1, 1982
View Articletitled, Seismic Migration—Imaging of Acoustic Energy by Wave Field Extrapolation
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Topics: Acoustics, Imaging, Waves
Journal Articles

Unidirectional Wave Motions

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H. Levine, Author, Y. H. Pao, Reviewer
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Book Reviews
J. Appl. Mech. December 1978, 45(4): 969.
https://doi.org/10.1115/1.3424475
Published Online: December 1, 1978
View Articletitled, Unidirectional Wave Motions
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Topics: Waves
Journal Articles

Diffraction of Elastic Waves and Dynamic Stress Concentrations

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Y.-H. Pao, Author, C.-C. Mow, Author, J. D. Achenbach, Reviewer
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Book Reviews
J. Appl. Mech. December 1973, 40(4): 872.
https://doi.org/10.1115/1.3423178
Published Online: December 1, 1973
View Articletitled, Diffraction of Elastic Waves and Dynamic Stress Concentrations
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Topics: Diffraction, Elastic waves, Stress
Journal Articles

Nonlinear Flexural Vibrations of a Clamped Circular Plate

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G. C. Kung, Y.-H. Pao
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. December 1972, 39(4): 1050–1054.
https://doi.org/10.1115/1.3422827
Published Online: December 1, 1972
View Articletitled, Nonlinear Flexural Vibrations of a Clamped Circular Plate
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Topics: Vibration, Hardening
Journal Articles

Discussion: “Application of Kirchhoff’s Integral Equation Formulation to an Elastic Wave Scattering Problem” (Ko, W. L., and Karlsson, T., 1967, ASME J. Appl. Mech., 34, pp. 921–930)

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S. A. Thau, Y. H. Pao
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Discussions
J. Appl. Mech. June 1968, 35(2): 428–429.
https://doi.org/10.1115/1.3601228
Published Online: June 1, 1968
View Articletitled, Discussion: “Application of Kirchhoff’s Integral Equation Formulation to an Elastic Wave Scattering Problem” (Ko, W. L., and Karlsson, T., 1967, ASME J. Appl. Mech., 34, pp. 921–930)
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Topics: Elastic waves, Electromagnetic scattering, Integral equations, Radiation scattering, Scattering (Physics)
Journal Articles

The Influence of the Curvature of Spherical Waves on Dynamic Stress Concentration

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F. C. Moon, Y-H. Pao
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. June 1967, 34(2): 373–379.
https://doi.org/10.1115/1.3607692
Published Online: June 1, 1967
View Articletitled, The Influence of the Curvature of Spherical Waves on Dynamic Stress Concentration
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Topics: Stress concentration, Waves, Cavities, Stress, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Wavelength