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1-7 of 7
Y. K. Joshi
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Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 43-50, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73040
Proceedings Papers
Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 149-156, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-33725
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 63–70.
Published Online: March 2, 2006
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 1999, 121(4): 1002–1010.
Published Online: November 1, 1999
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 108–115.
Published Online: June 1, 1999
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 40–50.
Published Online: March 1, 1997
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 294–300.
Published Online: December 1, 1995