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Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A030, July 6–9, 2015

Paper No: IPACK2015-48503

DOI: https://doi.org/10.1115/IPACK2015-48503

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Topics: Ceramics, Cracking (Materials), Elastic moduli, Flexible electronics, Fracture (Materials), Fracture (Process), Fracture mechanics, Heat pipes, Laminates, Lamination

Proceedings Papers

Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps

Li-Anne Liew, Ching-Yi Lin, Alexander Yersak, Ryan Lewis, Collin Coolidge, Y. C. Lee

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A009, July 6–9, 2015

Paper No: IPACK2015-48814

DOI: https://doi.org/10.1115/IPACK2015-48814

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Topics: Coatings, Nanoscale phenomena, Membranes, Semiconductor wafers, Valves, Compression, Diaphragms (Mechanical devices), Diaphragms (Structural), Microelectromechanical systems, Cavities

Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee

J. Electron. Packag. December 2014, 136(4): 040201.

Paper No: EP-14-1070

DOI: https://doi.org/10.1115/1.4028390

Published Online: September 19, 2014

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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management

Journal Articles

Letter From the Editors

Bahgat G. Sammakia, Y. C. Lee

J. Electron. Packag. September 2014, 136(3): 030201.

Paper No: EP-14-1067

DOI: https://doi.org/10.1115/1.4028063

Published Online: July 24, 2014

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Topics: Actuators, Biomedicine, Computers, Data centers, Design, Electronic packaging, Electronics, Energy / power systems, Engineering teachers, Feedback

Proceedings Papers

Micro Cryogenic Coolers With Mixed Refrigerants

Ryan Lewis, Yunda Wang, Paul Schroeder, Collin Coolidge, Ray Radebaugh, Y. C. Lee

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A005, July 16–18, 2013

Paper No: IPACK2013-73290

DOI: https://doi.org/10.1115/IPACK2013-73290

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Topics: Coolers, Refrigerants, Microelectromechanical systems, Flow (Dynamics), Heat exchangers, Low temperature, Microchannel flow, Pressure, Temperature, Valves

Proceedings Papers

Final Design Parameter Settings for a Physically-Realizable Uniform Temperature Boundary Condition Specification on a Wall of an Enclosure

P. Y. C. Lee, W. H. Leong

Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A030, July 14–19, 2013

Paper No: HT2013-17213

DOI: https://doi.org/10.1115/HT2013-17213

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Topics: Boundary-value problems, Design, Temperature, Temperature nonunifomity, Errors, Natural convection, Heat flux, Heat transfer, Mathematical analysis, Temperature measurement

Proceedings Papers

Two Phase Flow Patterns and Cooling Power of Mixed Refrigerant in Micro Cryogenic Coolers

Ryan Lewis, Hayley Schneider, Yunda Wang, Ray Radebaugh, Y. C. Lee

Proc. ASME. ICNMM2012, ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels, 501-506, July 8–12, 2012

Paper No: ICNMM2012-73110

DOI: https://doi.org/10.1115/ICNMM2012-73110

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Topics: Coolers, Cooling, Refrigerants, Two-phase flow, Flow (Dynamics), Vapors, Temperature, Cycles, Slug flows, Bubbles

Journal Articles

Performance Analysis of an Integrated Micro Cryogenic Cooler and Miniature Compressor for Cooling to 200 K

Ryan Lewis, M.-H. Lin, Yunda Wang, Jill Cooper, Peter Bradley, Ray Radebaugh, Marcia Huber, Y. C. Lee

J. Thermal Sci. Eng. Appl. September 2013, 5(3): 031003.

Paper No: TSEA-12-1031

DOI: https://doi.org/10.1115/1.4023307

Published Online: June 24, 2013

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Topics: Compressors, Cooling, Flow (Dynamics), Pressure, Refrigerants, Temperature, Valves, High pressure (Physics), Pistons

Proceedings Papers

Demonstration of an Integrated Micro Cryogenic Cooler and Miniature Compressor for Cooling to 200 K

Ryan Lewis, M.-H. Lin, Yunda Wang, Jill Cooper, Peter Bradley, Ray Radebaugh, Marcia Huber, Y. C. Lee

Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 423-428, November 11–17, 2011

Paper No: IMECE2011-63908

DOI: https://doi.org/10.1115/IMECE2011-63908

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Topics: Compressors, Cooling, Temperature, Coolers, Valves, Flow (Dynamics), Glass, Glass fibers, Heat exchangers, Joules

Proceedings Papers

A Polyimide Micro Heat Exchanger With a Suspended 3D Parallel Channel Structure for Cryogenic Application

Yunda Wang, Ryan Lewis, M.-H. Lin, Yiwei Yan, Ray Radebaugh, Peter Bradley, Y. C. Lee

Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 181-186, November 11–17, 2011

Paper No: IMECE2011-62513

DOI: https://doi.org/10.1115/IMECE2011-62513

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Topics: Heat exchangers, Manufacturing, Temperature, Copper, Dimensions, Flow (Dynamics), Micromachining, Nitrogen, Pressure, Pressure drop

Proceedings Papers

Flat Polymer Heat Spreader With High Aspect Ratio Micro Hybrid Wick Operating Under Adverse Gravity

Christopher Oshman, Qian Li, Li-Anne Liew, Ronggui Yang, Y. C. Lee, Victor M. Bright

Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 601-606, November 11–17, 2011

Paper No: IMECE2011-64264

DOI: https://doi.org/10.1115/IMECE2011-64264

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Topics: Flat heat pipes, Gravity (Force), Polymers, Copper, Thermal resistance, Columns (Structural), Heat flux, Heat transfer, Condensation, Condensers (steam plant)

Proceedings Papers

Design, Fabrication of High-Throughput Microarray Microfluidic Device for Membrane Protein Polyhedra Formation

Hsin-Jui Wu, Yiwei Yan, Y. C. Lee, Michael Stowell

Proc. ASME. IMECE2011, Volume 1: Advances in Aerospace Technology; Energy Water Nexus; Globalization of Engineering; Posters, 793-794, November 11–17, 2011

Paper No: IMECE2011-62792

DOI: https://doi.org/10.1115/IMECE2011-62792

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Topics: Design, Manufacturing, Membranes, Microfluidics, Proteins, Drug delivery systems, Biomedicine, Bonding, Drugs, Geometry

Journal Articles

Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices Assembly

Ming Kong, Sungeun Jeon, Chiwon Hwang, Y. C. Lee

J. Electron. Packag. June 2012, 134(2): 021002.

DOI: https://doi.org/10.1115/1.4006513

Published Online: June 11, 2012

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Topics: Manufacturing, Optoelectronic devices, Solders, Wetting, Modeling, Vehicles

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Journal citation

NARROW

Three-Dimensional Modeling of Solder Shape for the Design of Solder Self-Assembled Micro-Electro-Mechanical Systems

Solder-Assembled MEMS Flaps to Enhance Fluid Mixing

Flexible Circuit-Based RF MEMS Switches

A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones

Characterization of Hybrid Wicking Structures for Flexible Vapor Chambers

Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology

Use of a Gel Finger to Feel the Skin Temperatures of a Smartphone

Improved Flexibility of Alumina Ultrathin Barrier Films by Nano-Lamination

Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps

Special Section on InterPACK 2013

Letter From the Editors

Micro Cryogenic Coolers With Mixed Refrigerants

Final Design Parameter Settings for a Physically-Realizable Uniform Temperature Boundary Condition Specification on a Wall of an Enclosure

Two Phase Flow Patterns and Cooling Power of Mixed Refrigerant in Micro Cryogenic Coolers

Performance Analysis of an Integrated Micro Cryogenic Cooler and Miniature Compressor for Cooling to 200 K

Demonstration of an Integrated Micro Cryogenic Cooler and Miniature Compressor for Cooling to 200 K

A Polyimide Micro Heat Exchanger With a Suspended 3D Parallel Channel Structure for Cryogenic Application

Flat Polymer Heat Spreader With High Aspect Ratio Micro Hybrid Wick Operating Under Adverse Gravity

Design, Fabrication of High-Throughput Microarray Microfluidic Device for Membrane Protein Polyhedra Formation

Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices Assembly

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