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Journal Articles

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part II: Application to 3D Ultrathin Stacked-Die Chip Scale Packages

B. Xie, X. J. Fan, X. Q. Shi, H. Ding
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031011.
https://doi.org/10.1115/1.3144154
Published Online: July 31, 2009
View Article titled, Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part II: Application to 3D Ultrathin Stacked-Die Chip Scale Packages
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Topics: Diffusion (Physics), Vapor pressure, Failure, Modeling
Journal Articles

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation

B. Xie, X. J. Fan, X. Q. Shi, H. Ding
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031010.
https://doi.org/10.1115/1.3144147
Published Online: July 31, 2009
View Article titled, Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation
Open the PDF for Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation in another window
Topics: Diffusion (Physics), Modeling, Temperature, Vapor pressure, Electronic packages
Journal Articles

Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly

B. L. Chen, X. Q. Shi, G. Y. Li, K. H. Ang, Jason P. Pickering
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 466–473.
https://doi.org/10.1115/1.2056574
Published Online: February 24, 2005
View Article titled, Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly
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Topics: Rapid tooling, Reliability, Temperature, Failure, Ball-Grid-Array packaging, Solder joints, Manufacturing, Solders, Testing
Journal Articles

Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy

X. Q. Shi, Z. P. Wang, Q. J. Yang, H. L. J. Pang
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. January 2003, 125(1): 81–88.
https://doi.org/10.1115/1.1525254
Published Online: December 31, 2002
View Article titled, Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy
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Topics: Creep, Solders, Temperature, Dislocations, Stress, Alloys, Diffusion (Physics), Tin
Journal Articles

A New Creep Constitutive Model for Eutectic Solder Alloy

X. Q. Shi, Z. P. Wang, W. Zhou, H. L. J. Pang, Q. J. Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 85–90.
https://doi.org/10.1115/1.1462624
Published Online: May 2, 2002
View Article titled, A New Creep Constitutive Model for Eutectic Solder Alloy
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Topics: Constitutive equations, Creep, Solders, Stress, Temperature
Journal Articles

Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121 , pp. 179–185]

X. Q. Shi,, W. Zhou,, H. L. J. Pang, and, Z. P. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2000, 122(1): 74.
https://doi.org/10.1115/1.483136
Published Online: March 1, 2000
View Article titled, Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121 , pp. 179–185]
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Topics: Alloys, Electrons, Mechanical properties, Solders, Temperature, Eutectic alloys, Soldering, Stress-strain relations, Thermomechanical treatment
Journal Articles

Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy

X. Q. Shi, W. Zhou, H. L. J. Pang, Z. P. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 179–185.
https://doi.org/10.1115/1.2792681
Published Online: September 1, 1999
View Article titled, Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy
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Topics: Alloys, Mechanical properties, Solders, Temperature, Testing