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Journal Articles

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

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Hsien-Chie Cheng, Ruei-You Hong, Wen-Hwa Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041007.
Paper No: EP-18-1041
https://doi.org/10.1115/1.4041014
Published Online: September 10, 2018
View Articletitled, Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics
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Topics: Dimensional analysis, Electrical properties, Finite element analysis, Flexible electronics, Inks, Modeling, Plasticity, Silver, Simulation, Stress
Proceedings Papers

Effective Thermal-Mechanical Modeling of Solder Joints

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Hsien-Chie Cheng, Chin-Yin Yu, Wen-Hwa Chen
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 345-352, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39678
https://doi.org/10.1115/IMECE2002-39678
View Paper titled, Effective Thermal-Mechanical Modeling of Solder Joints
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Topics: Modeling, Solder joints, Finite element model, Temperature, Constitutive equations, Elastoplasticity, Finite element analysis, Solders, Viscoelasticity
Journal Articles

Predicting the Liquid Formation for the Solder Joints in Flip Chip Technology

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Wen-Hwa Chen, Shu-Ru Lin, Kuo-Ning Chiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 331–338.
https://doi.org/10.1115/1.2229216
Published Online: September 29, 2005
View Articletitled, Predicting the Liquid Formation for the Solder Joints in Flip Chip Technology
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Topics: Flip-chip devices, Solder joints, Solders, Surface tension, Shapes, Flip-chip
Journal Articles

On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules

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Wen-Hwa Chen, ASME Fellow, Professor, Hsien-Chie Cheng, ASME Member, Associate Professor, Chih-Han Lin, Graduate Student
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 374–383.
https://doi.org/10.1115/1.1773198
Published Online: October 6, 2004
View Articletitled, On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules
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Topics: Design, Finite element analysis, Finite element model, Heat, Heat conduction, Junctions, Manufacturing, Modeling, Multi-chip modules, Natural convection
Journal Articles

Prediction of Liquid Formation for Solder and Non-Solder Mask Defined Array Packages

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Wen-Hwa Chen, Professor, Kuo-Ning Chiang, Associate Professor, Shu-Ru Lin, Graduate Student
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 37–44.
https://doi.org/10.1115/1.1401738
Published Online: August 18, 1999
View Articletitled, Prediction of Liquid Formation for Solder and Non-Solder Mask Defined Array Packages
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Topics: Solder joints, Solders, Surface mount devices
Journal Articles

Stress Singularity of Edge Delamination in Angle-Ply and Cross-Ply Laminates

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Wen-Hwa Chen, Tain-Fu Huang
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. September 1997, 64(3): 525–531.
https://doi.org/10.1115/1.2788924
Published Online: September 1, 1997
View Articletitled, Stress Singularity of Edge Delamination in Angle-Ply and Cross-Ply Laminates
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Topics: Delamination, Laminates, Stress singularity, Fibers, Shear stress
Journal Articles

The Torsion Effect on Fully Developed Laminar Flow in Helical Square Ducts

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Wen-Hwa Chen, Ray Jan
Journal: Journal of Fluids Engineering
Publisher: ASME
Article Type: Research Papers
J. Fluids Eng. June 1993, 115(2): 292–301.
https://doi.org/10.1115/1.2910138
Published Online: June 1, 1993
View Articletitled, The Torsion Effect on Fully Developed Laminar Flow in Helical Square Ducts
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Topics: Ducts, Laminar flow, Torsion, Flow (Dynamics), Friction, Axial flow, Exterior walls, Finite element methods, Navier-Stokes equations, Pressure gradient
Journal Articles

Finite Element Analysis of an Involute Gear Drive Considering Friction Effects

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Wen-Hwa Chen, Pwu Tsai
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. February 1989, 111(1): 94–100.
https://doi.org/10.1115/1.3188738
Published Online: February 1, 1989
View Articletitled, Finite Element Analysis of an Involute Gear Drive Considering Friction Effects
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Topics: Finite element analysis, Friction, Mechanical drives, Gears, Cycles, Deformation, Finite element model, Stress, Torque