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Wataru Nakayama
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Proceedings Papers

Effect of Condenser Location and Tubing Length on the Performance of a Compact Two-Phase Thermosyphon

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Lang Yuan, Yogendra K. Joshi, Wataru Nakayama
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 291-299, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24406
https://doi.org/10.1115/IMECE2001/HTD-24406
View Paper titled, Effect of Condenser Location and Tubing Length on the Performance of a Compact Two-Phase Thermosyphon
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Topics: Condensers (steam plant), Tubing, Thermal resistance, Boiling, Coolants, Cooling, Copper, Degrees of freedom, Design, Dimensions
Proceedings Papers

A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling

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S. I. Haider, Yogendra K. Joshi, Wataru Nakayama
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 209-218, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24395
https://doi.org/10.1115/IMECE2001/HTD-24395
View Paper titled, A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling
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Topics: Computer cooling, Two-phase flow, Condensers (steam plant), Temperature, Heat transfer coefficients, Condensation, Heat, Heat pipes, Boiling, Fluids
Proceedings Papers

Paradigm Shift in Engineering Design Precipitated by the Advent of Miniaturized Systems

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Wataru Nakayama
Proc. ASME. IMECE2000, Successfully Managing the Risk and Development of Your Business and Technology, 11-14, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1170
https://doi.org/10.1115/IMECE2000-1170
View Paper titled, Paradigm Shift in Engineering Design Precipitated by the Advent of Miniaturized Systems
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Topics: Engineering design, Design, Uncertainty, Computer simulation
Journal Articles

Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management

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Wataru Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2017, 139(1): 010801.
Paper No: EP-16-1092
https://doi.org/10.1115/1.4035019
Published Online: November 23, 2016
View Articletitled, Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management
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Topics: Circuits, Computers, Printed circuit boards, Hardware
Journal Articles

Heat in Computers: Applied Heat Transfer in Information Technology

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Wataru Nakayama
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. January 2014, 136(1): 013001.
Paper No: HT-13-1378
https://doi.org/10.1115/1.4025377
Published Online: October 21, 2013
View Articletitled, Heat in Computers: Applied Heat Transfer in Information Technology
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Topics: Computers, Cooling, Design, Heat, Heat transfer, Temperature, Circuits, Hardware, Computational fluid dynamics, Flow (Dynamics)
Journal Articles

Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model

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Wataru Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2013, 135(3): 034501.
Paper No: EP-11-1100
https://doi.org/10.1115/1.4024367
Published Online: June 4, 2013
View Articletitled, Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model
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Topics: Heat, Heat conduction, Temperature, Thermal conductivity, Electronic equipment
Journal Articles

Study on Heat Conduction in a Simulated Multicore Processor Chip—Part II: Case Studies

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Wataru Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021003.
Paper No: EP-12-1032
https://doi.org/10.1115/1.4023292
Published Online: March 28, 2013
View Articletitled, Study on Heat Conduction in a Simulated Multicore Processor Chip—Part II: Case Studies
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Topics: Cooling, Heat, Heat transfer coefficients, Temperature, Heat conduction, Heat sinks, Dimensions
Journal Articles

Study on Heat Conduction in a Simulated Multicore Processor Chip—Part I: Analytical Modeling

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Wataru Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021002.
Paper No: EP-12-1031
https://doi.org/10.1115/1.4023291
Published Online: March 28, 2013
View Articletitled, Study on Heat Conduction in a Simulated Multicore Processor Chip—Part I: Analytical Modeling
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Topics: Heat, Temperature, Heat conduction
Proceedings Papers

The Liquid Bridge Heat Switch Design With Considering the Pressure Behavior to Regulate the Thermal Resistance for the Temperature Control

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Su-Heon Jeong, Wataru Nakayama, Sun-Kyu Lee
Proc. ASME. IMECE2010, Volume 7: Fluid Flow, Heat Transfer and Thermal Systems, Parts A and B, 1345-1348, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40336
https://doi.org/10.1115/IMECE2010-40336
View Paper titled, The Liquid Bridge Heat Switch Design With Considering the Pressure Behavior to Regulate the Thermal Resistance for the Temperature Control
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Topics: Bridges (Structures), Design, Heat, Pressure, Switches, Temperature control, Thermal resistance, Plates (structures), Temperature, Flow (Dynamics)
Proceedings Papers

Resistance Network Analysis of Airflow and Heat Transfer in a Thin Electronic Equipment Enclosure With a Localized Finned Heat Sink

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Takashi Fukue, Masaru Ishizuka, Shinji Nakagawa, Tomoyuki Hatakeyama, Wataru Nakayama
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 657-664, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22979
https://doi.org/10.1115/IHTC14-22979
View Paper titled, Resistance Network Analysis of Airflow and Heat Transfer in a Thin Electronic Equipment Enclosure With a Localized Finned Heat Sink
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Topics: Air flow, Electronic equipment, Heat sinks, Heat transfer, Network analysis, Electrical components, Design, Computational fluid dynamics, Design methodology, Flow (Dynamics)
Proceedings Papers

Estimation of Thermal Parameters of the Compact Electronic Enclosure Using Dynamic Thermal Response

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Jung-Kyun Kim, Wataru Nakayama, Sun-Kyu Lee
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 103-111, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89033
https://doi.org/10.1115/InterPACK2009-89033
View Paper titled, Estimation of Thermal Parameters of the Compact Electronic Enclosure Using Dynamic Thermal Response
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Topics: Contact resistance, Electronic packages, Heat, Modeling, System dynamics, Temperature, Transients (Dynamics)
Proceedings Papers

Thermal Characterization of High-Density Interconnects in the Form of Equivalent Thermal Conductivity

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Wataru Nakayama, Katsuhiro Koizumi, Takashi Fukue, Masaru Ishizuka, Tatsuya Nakajima, Hiroko Koike, Ryuichi Matsuki
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 297-310, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89086
https://doi.org/10.1115/InterPACK2009-89086
View Paper titled, Thermal Characterization of High-Density Interconnects in the Form of Equivalent Thermal Conductivity
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Topics: Density, Thermal characterization, Thermal conductivity, Metals, Flow (Dynamics), Heat, Heat conduction, Copper, Electrical wires, Japan Society of Mechanical Engineers
Proceedings Papers

Heat Switch to Control the Local Thermal Resistance Using Liquid Pillar Control

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Su-Heon Jeong, Wataru Nakayama, Sun-Kyu Lee
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1021-1024, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89368
https://doi.org/10.1115/InterPACK2009-89368
View Paper titled, Heat Switch to Control the Local Thermal Resistance Using Liquid Pillar Control
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Topics: Columns (Structural), Heat, Switches, Thermal resistance, Electronic packages, Temperature, Flow (Dynamics), Geometry, Plates (structures), Reservoirs
Proceedings Papers

Heat Conduction in Printed Circuit Boards: Part I — Overview and the Case of a JEDEC Test Board

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Wataru Nakayama, Tatsuya Nakajima, Hiroko Koike, Ryuichi Matsuki
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 645-652, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33605
https://doi.org/10.1115/IPACK2007-33605
View Paper titled, Heat Conduction in Printed Circuit Boards: Part I — Overview and the Case of a JEDEC Test Board
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Topics: Heat conduction, Printed circuit boards, Modeling, Temperature, Ball-Grid-Array packages, Composite materials, Computation, Convection, Electronic equipment, Heat transfer
Proceedings Papers

Heat Conduction in Printed Circuit Boards: Part II — Small PCBs Connected to Large Thermal Mass at Their Edge

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Wataru Nakayama, Tatsuya Nakajima, Hiroko Koike, Ryuichi Matsuki
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 653-661, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33606
https://doi.org/10.1115/IPACK2007-33606
View Paper titled, Heat Conduction in Printed Circuit Boards: Part II — Small PCBs Connected to Large Thermal Mass at Their Edge
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Topics: Heat conduction, Printed circuit boards, Heat sinks, Convection, Copper, Density, Flow (Dynamics), Heat, Modeling, Numerical analysis
Proceedings Papers

Synthesis of CFD Analyses and Experiments in Developing a Thermal Network Model of a Simulated Heat Spreader Panel

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Masaru Ishizuka, Shinji Nakagawa, Tatsuro Yoshida, Wataru Nakayama
Proc. ASME. IMECE2008, Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C, 1471-1478, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-66091
https://doi.org/10.1115/IMECE2008-66091
View Paper titled, Synthesis of CFD Analyses and Experiments in Developing a Thermal Network Model of a Simulated Heat Spreader Panel
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Topics: Computational fluid dynamics, Flat heat pipes, Network models, Heat, Temperature, Uncertainty, Computation, Corners (Structural elements), Design, Electronic products
Proceedings Papers

Educational Effects of Industry-Academia Joint Projects on the Development of Microelectronic Packaging Technologies: Recent Experiences in Japan

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Wataru Nakayama, Masaki Shiratori, Noriyuki Miyazaki
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 1-6, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35122
https://doi.org/10.1115/IPACK2003-35122
View Paper titled, Educational Effects of Industry-Academia Joint Projects on the Development of Microelectronic Packaging Technologies: Recent Experiences in Japan
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Topics: Microelectronic packaging, Education, Engineers, Arches, Engineering teachers, Governments, Japan Society of Mechanical Engineers
Proceedings Papers

Electronic Packaging Education Through Internet: A Plan at Tohoku University and Some Challenges in Sight

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Ryuzo Watanabe, Wataru Nakayama, Masaru Ishizuka, Shigenao Maruyama, Masud Behnia
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 7-10, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35333
https://doi.org/10.1115/IPACK2003-35333
View Paper titled, Electronic Packaging Education Through Internet: A Plan at Tohoku University and Some Challenges in Sight
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Topics: Education, Electronic packaging, Internet, Columns (Structural), Electronic equipment, Thermal management
Journal Articles

Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach

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Wataru Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041106.
https://doi.org/10.1115/1.2993126
Published Online: November 14, 2008
View Articletitled, Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach
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Topics: Copper, Flow (Dynamics), Heat, Heat conduction, Insulation, Laminates, Modeling, Printed circuit boards, Resins, Temperature
Journal Articles

Design of Heat Conduction Panel: The Case of Multiple Heating Elements Cooled by a Displaced Heat Sink

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Wataru Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041108.
https://doi.org/10.1115/1.2993137
Published Online: November 14, 2008
View Articletitled, Design of Heat Conduction Panel: The Case of Multiple Heating Elements Cooled by a Displaced Heat Sink
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Topics: Design, Heat, Heat conduction, Heat sinks, Temperature, Tiles, Genetic algorithms