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Journal Articles

Effect of Cyclic Stress on Electrochemical Corrosion Behavior of SAC305 Solder

G. Chen, Y. Y. Wang, X. H. Wang, Y. Cui, S. W. Shi, J. Yang, W. L. Xu, Q. Lin
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031003.
Paper No: EP-20-1130
DOI: https://doi.org/10.1115/1.4051753
Published Online: September 15, 2021
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Topics: Corrosion, Polarization (Electricity), Polarization (Light), Polarization (Waves), Stress
Proceedings Papers

An Investigation of Flow Characteristics and Parameter Effects for a New Concept of Hybrid SVC Nozzle

F. Song, J. W. Shi, L. Zhou, Z. X. Wang, X. B. Zhang
Proc. ASME. GT2018, Volume 1: Aircraft Engine; Fans and Blowers; Marine, V001T01A009, June 11–15, 2018
Paper No: GT2018-75511
DOI: https://doi.org/10.1115/GT2018-75511
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Topics: Flow (Dynamics), Nozzles, Thrust, Pressure, Valves, Aircraft engines, Deflection, Exhaust systems, Weight (Mass)
Proceedings Papers

Investigation on Fluidic Throat Control of Fixed Geometric Nozzle and Coupling Performance With Aero-Engine

Z. X. Wang, J. W. Shi, L. Zhou, X. B. Zhang, X. L. Sun, H. Zan
Proc. ASME. GT2015, Volume 1: Aircraft Engine; Fans and Blowers; Marine, V001T01A019, June 15–19, 2015
Paper No: GT2015-43162
DOI: https://doi.org/10.1115/GT2015-43162
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Topics: Aircraft engines, Nozzles, Flow (Dynamics), High pressure (Physics), Simulation models, Compressors, Computational fluid dynamics, Computer simulation, Design, Geometry
Proceedings Papers

The Study of Wing-Rock Motions of Wing/Body Model With Chined Forebody and Their Flow Mechanism

X. Y. Deng, W. Shi
Proc. ASME. FEDSM2014, Volume 1C, Symposia: Fundamental Issues and Perspectives in Fluid Mechanics; Industrial and Environmental Applications of Fluid Mechanics; Issues and Perspectives in Automotive Flows; Gas-Solid Flows: Dedicated to the Memory of Professor Clayton T. Crowe; Numerical Methods for Multiphase Flow; Transport Phenomena in Energy Conversion From Clean and Sustainable Resources; Transport Phenomena in Materials Processing and Manufacturing Processes, V01CT15A006, August 3–7, 2014
Paper No: FEDSM2014-21345
DOI: https://doi.org/10.1115/FEDSM2014-21345
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Topics: Flow (Dynamics), Rocks, Wings, Vortices, Boundary-value problems, Fluids, Hydrodynamic stability, Reynolds number, Wind tunnels
Proceedings Papers

Novel Process Techniques to Reduce Voids in Solder Thermal Interface Materials Used for Flip-Chip Package Applications

M. Montano, J. Garcia, W. Shi, M. T. Reiter, U. Vadakkan, K. L. Phillippe, B. Clark, M. Valles, C. Deppisch, J. D. Ferrara-Brown, S. G. Jadhav, E. Bernal, M. K. Kuan
Proc. ASME. HT2005, Heat Transfer: Volume 4, 885-890, July 17–22, 2005
Paper No: HT2005-72747
DOI: https://doi.org/10.1115/HT2005-72747
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Topics: Electronic packages, Flip-chip, Flip-chip packages, Solders
Proceedings Papers

Enhanced Industrial Applicability of Aluminum Alloy by Coating Technique With Titanium/Carbon Compositionally Gradient Film Using Magnetron Co-Sputtering

T. Sonoda, A. Watazu, J. Zhu, W. Shi, A. Kamiya, K. Kato, T. Asahina
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 535-537, November 17–22, 2002
Paper No: IMECE2002-39382
DOI: https://doi.org/10.1115/IMECE2002-39382
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Topics: Aluminum alloys, Carbon, Coatings, Sputtering (Irradiation), Titanium, Alloys, Abrasion, Adhesion, Adhesives, Ceramic coatings