1-20 of 22
Vikas Yadav
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Image-Based Flashback Detection in a Hydrogen-Fired Gas Turbine Using a Convolutional Autoencoder

Available to Purchase
Paul Porath, Vikas Yadav, Lukasz Panek, Abdulla Ghani
Journal: Journal of Engineering for Gas Turbines and Power
Publisher: ASME
Article Type: Research-Article
J. Eng. Gas Turbines Power. August 2025, 147(8): 081015.
Paper No: GTP-24-1749
https://doi.org/10.1115/1.4067298
Published Online: January 29, 2025
View Articletitled, Image-Based Flashback Detection in a Hydrogen-Fired Gas Turbine Using a Convolutional Autoencoder
Open the PDF for Image-Based Flashback Detection in a Hydrogen-Fired Gas Turbine Using a Convolutional Autoencoder in another window
Topics: Combustion, Computer-aided engineering, Engines, Flames, Gas turbines, Hydrogen, Dimensions, Errors, Combustion chambers, Fuels
Journal Articles

Evaluation of Data-Driven Classifiers for an Ignition Forecast of Large Gas Turbines

Available to Purchase
Florian Lang, Maximilian Savtschenko, Vikas Yadav, Abdulla Ghani
Journal: Journal of Engineering for Gas Turbines and Power
Publisher: ASME
Article Type: Research-Article
J. Eng. Gas Turbines Power. February 2025, 147(2): 021007.
Paper No: GTP-24-1379
https://doi.org/10.1115/1.4066293
Published Online: September 26, 2024
View Articletitled, Evaluation of Data-Driven Classifiers for an Ignition Forecast of Large Gas Turbines
Open the PDF for Evaluation of Data-Driven Classifiers for an Ignition Forecast of Large Gas Turbines in another window
Topics: Ignition, Engines, Algorithms
Proceedings Papers

Evaluation of Data-Driven Classifiers for an Ignition Forecast of Large Gas Turbines

Available to Purchase

Florian Lang, Maximilian Savtschenko, Vikas Yadav, Abdulla Ghani
Proc. ASME. GT2024, Volume 3B: Combustion, Fuels, and Emissions, V03BT04A026, June 24–28, 2024
Publisher: American Society of Mechanical Engineers
Paper No: GT2024-128055
https://doi.org/10.1115/GT2024-128055
View Paper titled, Evaluation of Data-Driven Classifiers for an Ignition Forecast of Large Gas Turbines
Open the PDF for Evaluation of Data-Driven Classifiers for an Ignition Forecast of Large Gas Turbines in another window
Topics: Gas turbines, Ignition
Proceedings Papers

Image-Based Flashback Detection in a Hydrogen-Fired Gas Turbine Using a Convolutional Autoencoder

Available to Purchase

Paul Porath, Vikas Yadav, Lukasz Panek, Abdulla Ghani
Proc. ASME. GT2024, Volume 3B: Combustion, Fuels, and Emissions, V03BT04A044, June 24–28, 2024
Publisher: American Society of Mechanical Engineers
Paper No: GT2024-128722
https://doi.org/10.1115/GT2024-128722
View Paper titled, Image-Based Flashback Detection in a Hydrogen-Fired Gas Turbine Using a Convolutional Autoencoder
Open the PDF for Image-Based Flashback Detection in a Hydrogen-Fired Gas Turbine Using a Convolutional Autoencoder in another window
Topics: Gas turbines, Hydrogen, Flames, Computer-aided engineering, Design, Combustion chambers, Errors, Fuels, Test facilities, Trains
Journal Articles

Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method

Available to Purchase
Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021004.
Paper No: EP-22-1026
https://doi.org/10.1115/1.4062868
Published Online: November 10, 2023
View Articletitled, Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method
Open the PDF for Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method in another window
Topics: Solders, Temperature, Shock (Mechanics), Alloys
Proceedings Papers

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Available to Purchase

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97452
https://doi.org/10.1115/IPACK2022-97452
View Paper titled, Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration
Open the PDF for Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration in another window
Topics: Alloys, Shock (Mechanics), Solders, Vibration, Reliability, Aerospace industry, Climate, Defense industry, Elastic moduli, Electronics
Journal Articles

Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature

Available to Purchase
Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021116.
Paper No: EP-21-1062
https://doi.org/10.1115/1.4053764
Published Online: March 11, 2022
View Articletitled, Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature
Open the PDF for Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature in another window
Topics: Solders, Stress-strain curves, Temperature, Alloys, Operating temperature, Tensile strength, Materials properties
Proceedings Papers

Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage

Available to Purchase

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A021, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74068
https://doi.org/10.1115/IPACK2021-74068
View Paper titled, Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage
Open the PDF for Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage in another window
Topics: Alloys, High temperature, Low temperature materials, Solders, Storage
Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Available to Purchase

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2658
https://doi.org/10.1115/IPACK2020-2658
View Paper titled, Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys
Open the PDF for Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys in another window
Topics: Alloys, Temperature, Operating temperature, Solders, Avionics, Constitutive equations, Electronic equipment, Electronics, Energy dissipation, Engines
Journal Articles

Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys

Available to Purchase
Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021005.
Paper No: EP-20-1080
https://doi.org/10.1115/1.4048181
Published Online: October 8, 2020
View Articletitled, Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys
Open the PDF for Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys in another window
Topics: Alloys, Solders, Temperature, Stress, Solder joints, Operating temperature
Journal Articles

Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements

Available to Purchase
Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041113.
Paper No: EP-20-1037
https://doi.org/10.1115/1.4047579
Published Online: July 10, 2020
View Articletitled, Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements
Open the PDF for Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements in another window
Topics: Cycles, Failure, Flexible electronics, Modeling, Reliability, Electronics, Regression models, Failure analysis
Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Available to Purchase

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A027, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6577
https://doi.org/10.1115/IPACK2019-6577
View Paper titled, Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys
Open the PDF for Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys in another window
Topics: Alloys, Temperature, Lead-free solders, Solders, Finite element analysis, Avionics, Constitutive equations, Density, Electronic components, Electronics
Proceedings Papers

Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements

Available to Purchase

Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6580
https://doi.org/10.1115/IPACK2019-6580
View Paper titled, Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements
Open the PDF for Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements in another window
Topics: Flexible electronics, Reliability, Electronics, Failure, Lumber, Modeling, Sensors, Statistical analysis, Testing
Proceedings Papers

Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder After High-Temperature Prolonged Storage

Available to Purchase

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8357
https://doi.org/10.1115/IPACK2018-8357
View Paper titled, Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder After High-Temperature Prolonged Storage
Open the PDF for Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder After High-Temperature Prolonged Storage in another window
Topics: Constitutive equations, High temperature, Lead-free solders, Mechanical properties, Storage, Solders, Alloys, Drilling, Electronics, Geometry
Proceedings Papers

Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments

Available to Purchase

Pradeep Lall, Vikas Yadav, Di Zhang, Jeff Suhling
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74233
https://doi.org/10.1115/IPACK2017-74233
View Paper titled, Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments
Open the PDF for Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments in another window
Topics: Alloys, High temperature, Lead-free solders, Vibration, Temperature, Electronics, Vehicles, Solder joints, Solders, Automotive industry
Proceedings Papers

New Method of Flow Maldistribution Mitigation in Parallel Microchannel Heat Sink

Available to Purchase

Vikas Yadav, Ritunesh Kumar
Proc. ASME. FEDSM2017, Volume 1B, Symposia: Fluid Measurement and Instrumentation; Fluid Dynamics of Wind Energy; Renewable and Sustainable Energy Conversion; Energy and Process Engineering; Microfluidics and Nanofluidics; Development and Applications in Computational Fluid Dynamics; DNS/LES and Hybrid RANS/LES Methods, V01BT10A004, July 30–August 3, 2017
Publisher: American Society of Mechanical Engineers
Paper No: FEDSM2017-69084
https://doi.org/10.1115/FEDSM2017-69084
View Paper titled, New Method of Flow Maldistribution Mitigation in Parallel Microchannel Heat Sink
Open the PDF for New Method of Flow Maldistribution Mitigation in Parallel Microchannel Heat Sink in another window
Topics: Flow (Dynamics), Heat sinks, Microchannels, Design, Temperature distribution, Cooling, Energy transformation, Finite volume methods, Fluid dynamics, Fluids
Proceedings Papers

A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures

Available to Purchase

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48389
https://doi.org/10.1115/IPACK2015-48389
View Paper titled, A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures
Open the PDF for A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures in another window
Topics: Alloys, Mechanical properties, Operating temperature, Temperature, Electronic systems, Solders, Vibration, Deformation, Elastic moduli, Electronics
Proceedings Papers

Wavelet Transform for Human Gait With an Asymmetric Load

Available to Purchase

Cosmin Berceanu, Dan Marghitu, Maruti Ram Gudavalli, P. K. Raju, Vikas Yadav
Proc. ASME. IMECE2014, Volume 3: Biomedical and Biotechnology Engineering, V003T03A061, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-39751
https://doi.org/10.1115/IMECE2014-39751
View Paper titled, Wavelet Transform for Human Gait With an Asymmetric Load
Open the PDF for Wavelet Transform for Human Gait With an Asymmetric Load in another window
Topics: Stress, Wavelet transforms, Wavelets, Cycles, Discrete wavelet transforms, Kinematics, Signals, Students, Weight (Mass)
Proceedings Papers

High Strain-Rate Constitutive Behavior of SAC305 Solder During Operation at High Temperature

Available to Purchase

Pradeep Lall, Di Zhang, Vikas Yadav
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A069, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-39518
https://doi.org/10.1115/IMECE2014-39518
View Paper titled, High Strain-Rate Constitutive Behavior of SAC305 Solder During Operation at High Temperature
Open the PDF for High Strain-Rate Constitutive Behavior of SAC305 Solder During Operation at High Temperature in another window
Topics: High temperature, Solders, Temperature, Deformation, Lead-free solders, Alloys, Chemical properties, Constitutive equations, Electronic components, Electronic packaging
Proceedings Papers

Biomechanics of Trunk During Walking Carrying Load on One Hand Using Nonlinear Methods

Available to Purchase

Vikas Yadav, Maruti Ram Gudavalli, P. K. Raju, Dan Marghitu
Proc. ASME. IMECE2014, Volume 3: Biomedical and Biotechnology Engineering, V003T03A022, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-39720
https://doi.org/10.1115/IMECE2014-39720
View Paper titled, Biomechanics of Trunk During Walking Carrying Load on One Hand Using Nonlinear Methods
Open the PDF for Biomechanics of Trunk During Walking Carrying Load on One Hand Using Nonlinear Methods in another window
Topics: Biomechanics, Stress, Electromyography, Muscle, Cycles, Dimensions, Entropy, Matlab, Fatigue, Musculoskeletal system