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1-5 of 5
Unnikrishnan Vadakkan
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Proceedings Papers
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 261-268, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2272
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 197-203, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73131
Proceedings Papers
Proc. ASME. HT2003, Heat Transfer: Volume 3, 507-517, July 21–23, 2003
Publisher: American Society of Mechanical Engineers
Paper No: HT2003-47349
Proceedings Papers
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 741-751, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42444
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. June 2004, 126(3): 347–354.
Published Online: June 16, 2004