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Swapan K. Bhattacharya
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Proceedings Papers

In-Situ Warpage Measurement During Thermal Cycling of Dielectric Coated SS Substrate for Large Area MCM-D Packaging

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Anh X. H. Dang, I. Charles Ume, Swapan K. Bhattacharya
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 169-179, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0930
https://doi.org/10.1115/IMECE1999-0930
View Paper titled, In-Situ Warpage Measurement During Thermal Cycling of Dielectric Coated SS Substrate for Large Area MCM-D Packaging
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Topics: Packaging, Warping, Dielectric materials, Lasers, Stainless steel, Temperature, Thin films, Vehicles
Journal Articles

Epoxy Nanocomposite Capacitors for Application as MCM-L Compatible Integral Passives

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Swapan K. Bhattacharya, Faculty of Research, Rao R. Tummala, Director
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 1–6.
https://doi.org/10.1115/1.1400751
Published Online: January 12, 2001
View Articletitled, Epoxy Nanocomposite Capacitors for Application as MCM-L Compatible Integral Passives
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Topics: Capacitors, Epoxy adhesives, Epoxy resins, Manufacturing, Nanocomposites, Composite materials, Ceramics, Polymers, Fillers (Materials), Particulate matter
Journal Articles

A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging

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Anh X. H. Dang, I. Charles Ume, Swapan K. Bhattacharya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 86–91.
https://doi.org/10.1115/1.483152
Published Online: December 29, 1999
View Articletitled, A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging
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Topics: Warping, Coating processes, Packaging, Temperature, Shades and shadows, Stainless steel
Journal Articles

Measurement of Dynamic Warpage During Thermal Cycling of Dielectric Coated SS Substrates for Large Area MCM-D Packaging

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Anh X. H. Dang, I. Charles Ume, Swapan K. Bhattacharya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 77–85.
https://doi.org/10.1115/1.483138
Published Online: November 22, 1999
View Articletitled, Measurement of Dynamic Warpage During Thermal Cycling of Dielectric Coated SS Substrates for Large Area MCM-D Packaging
Open the PDF for Measurement of Dynamic Warpage During Thermal Cycling of Dielectric Coated SS Substrates for Large Area MCM-D Packaging in another window
Topics: Temperature, Warping, Stainless steel