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Proceedings Papers

Study on Reverse Heat Transfer Phenomenon of Steam Generator in Station Blackout Accident

Yu-sheng Liu, Shao-xin Zhuang, Chao Xu, Jian-ping Jing, Si-chao Tan

Proc. ASME. ICONE29, Volume 7A: Thermal-Hydraulics and Safety Analysis, V07AT07A078, August 8–12, 2022

Paper No: ICONE29-92316

DOI: https://doi.org/10.1115/ICONE29-92316

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Topics: Accidents, Boilers, Cooling, Heat transfer

Proceedings Papers

Modeling and Analysis of Uncertain Static Contact Characteristics for Revolute Clearance Joints

Sheng Liu, Haidong Yu, Bin Gu, Yong Zhao

Proc. ASME. IDETC-CIE2022, Volume 9: 18th International Conference on Multibody Systems, Nonlinear Dynamics, and Control (MSNDC), V009T09A002, August 14–17, 2022

Paper No: DETC2022-88965

DOI: https://doi.org/10.1115/DETC2022-88965

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Topics: Clearances (Engineering), Modeling, Uncertainty

Proceedings Papers

Improving the Snap-Off Process in Solder Paste Stencil Printing via the Enhancement of Wall Slip

Toshinori Mimura, Sheng Liu, Haruhiko Asada

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 219-225, November 16–21, 1997

Paper No: IMECE1997-0821

DOI: https://doi.org/10.1115/IMECE1997-0821

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Topics: Printing, Solders, Flow (Dynamics), Printed circuit boards, Temperature, Visualization

Proceedings Papers

Sequential Processing Mechanics Modeling for a Model IC Package

Jianjun Wang, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 401-410, November 16–21, 1997

Paper No: IMECE1997-1117

DOI: https://doi.org/10.1115/IMECE1997-1117

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Topics: Modeling, Stress, Manufacturing, Solders, Temperature, Finite element analysis, Finite element methods, Finite element model, Silicon chips, Bonding

Proceedings Papers

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Jianjun Wang, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 411-421, November 16–21, 1997

Paper No: IMECE1997-1118

DOI: https://doi.org/10.1115/IMECE1997-1118

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Topics: Fracture toughness, Fracture (Materials), Temperature, Stress, Displacement, Finite element analysis, Interferometry, Molding, Silicon, Density

Proceedings Papers

Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity

Zhengfang Qian, Minfu Lu, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 377-382, November 16–21, 1997

Paper No: IMECE1997-1113

DOI: https://doi.org/10.1115/IMECE1997-1113

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Topics: Modeling, Polymer films, Viscoelasticity, Viscoplasticity, Deformation, Stress, Chain, Constitutive equations, Drag (Fluid dynamics), Temperature effects

Proceedings Papers

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Jiansen Zhu, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 361-368, November 16–21, 1997

Paper No: IMECE1997-1111

DOI: https://doi.org/10.1115/IMECE1997-1111

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Topics: Simulation, Thermal deformation, Temperature, Finite element analysis, Interferometry, Diffraction patterns, Electronic packaging, Packaging, Reliability, Diffraction gratings

Proceedings Papers

A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry

Xiaoyuan He, Daqing Zou, Sheng Liu, Yifan Guo

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 97-103, November 16–21, 1997

Paper No: IMECE1997-1233

DOI: https://doi.org/10.1115/IMECE1997-1233

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Topics: Interferometry, Displacement, Computer software, Phase diagrams, Computer programming, Deformation, Diffraction gratings, Electronic packages, Flip-chip

Proceedings Papers

Testing and Constitutive Modeling of Thin Polymer Films and Underfills by a 6-Axis Submicron Tester

Zhengfang Qian, Minfu Lu, Jianjun Wang, Sheng Liu

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 105-112, November 16–21, 1997

Paper No: IMECE1997-1234

DOI: https://doi.org/10.1115/IMECE1997-1234

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Topics: Modeling, Polymer films, Testing, Thermomechanics, Nylon film

Proceedings Papers

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

Daqing Zou, Xiaoyuan He, Sheng Liu, Yifan Guo, Fulong Dai

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 69-76, November 16–21, 1997

Paper No: IMECE1997-1229

DOI: https://doi.org/10.1115/IMECE1997-1229

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Topics: Corners (Structural elements), Deformation, Interferometry, Computer software, Electronic packaging, Failure, Flip-chip, Flip-chip packages, Image processing, Nanoscale phenomena

Proceedings Papers

Thermal Mechanical Properties of Two Solder Alloys

Wei Ren, Zhengfang Qian, Minfu Lu, Sheng Liu, Dongkai Shangguan

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 125-130, November 16–21, 1997

Paper No: IMECE1997-1237

DOI: https://doi.org/10.1115/IMECE1997-1237

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Topics: Alloys, Mechanical properties, Solders, Fatigue, Lead-free solders, Computers, Creep, Electronic packaging, Strips, Testing

Proceedings Papers

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

Daqing Zou, Jianjun Wang, Minfu Lu, Sheng Liu

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 51-57, November 16–21, 1997

Paper No: IMECE1997-1227

DOI: https://doi.org/10.1115/IMECE1997-1227

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Topics: Creep, Finite element methods, Finite element model, Interferometry, Modeling, Epoxy adhesives, Epoxy resins, Molding, Constitutive equations, Deformation

Proceedings Papers

Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load

Jianjun Wang, Minfu Lu, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 103-113, November 16–21, 1997

Paper No: IMECE1997-0505

DOI: https://doi.org/10.1115/IMECE1997-0505

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Topics: Flip-chip packages, Fracture (Materials), Stress, Crack propagation, Fracture toughness, Silicon chips, Deflection, Displacement, Interferometry, Density

Proceedings Papers

A Singular Perturbation Approach for Modeling Differential-Algebraic Systems

Brandon W. Gordon, Sheng Liu, Haruhiko Asada

Proc. ASME. IMECE98, Dynamic Systems and Control, 31-35, November 15–20, 1998

Paper No: IMECE1998-0230

DOI: https://doi.org/10.1115/IMECE1998-0230

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Topics: Algebra, Modeling, Approximation, Control systems, Dynamic systems, Dynamics (Mechanics), Heat exchangers, Simulation, Two-phase flow

Proceedings Papers

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Daqing Zou, Xiaoyuan He, Minfu Lu, Sheng Liu, Yifan Guo

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 59-64, November 15–20, 1998

Paper No: IMECE1998-0429

DOI: https://doi.org/10.1115/IMECE1998-0429

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Topics: Circuits, Control equipment, Corners (Structural elements), Deformation, Density, Displacement, Electronic packages, Flip-chip, Flip-chip packages, Interferometers

Proceedings Papers

On the Life Prediction and Accelerated Testing of Solder Joints

Zhengfang Qian, Sheng Liu

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 1-11, November 15–20, 1998

Paper No: IMECE1998-0422

DOI: https://doi.org/10.1115/IMECE1998-0422

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Topics: Solder joints, Testing, Fatigue life, Flip-chip packages, Constitutive equations, Finite element analysis, Finite element model, Modeling, Solders, Temperature

Proceedings Papers

Automatic Warpage Measurement of Advanced Packages by Optical Method

Xiaoyuan He, Jiabin Dai, Sheng Liu

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 65-70, November 15–20, 1998

Paper No: IMECE1998-0430

DOI: https://doi.org/10.1115/IMECE1998-0430

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Topics: Warping, Deformation, Ball-Grid-Array packaging, Shapes, Computer software, Diffraction gratings, Imaging, Manufacturing, Modeling, Packaging

Proceedings Papers

Effect of Manufacturing Induced Defects on the Reliability of Flip-Chip Packages

Jianjun Wang, Daqing Zou, Zhengfang Qian, Wei Ren, Sheng Liu

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 35-42, November 15–20, 1998

Paper No: IMECE1998-0426

DOI: https://doi.org/10.1115/IMECE1998-0426

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Topics: Flip-chip packages, Manufacturing, Reliability, Solders, Simulation results, Finite element analysis, Finite element model, Interferometry, Warping, Contamination

Proceedings Papers

A Linear Motor Driven Mini Tester and its Application to Thermal/Mechanical Fatigue Testing of Solder Joint Specimen

Minfu Lu, Zhengfang Qian, Sheng Liu, Jianhau Wu

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 43-49, November 15–20, 1998

Paper No: IMECE1998-0427

DOI: https://doi.org/10.1115/IMECE1998-0427

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Topics: Fatigue testing, Linear motors, Solder joints, Fatigue, Damage, Engines, Motors, Solders, Failure, Fracture (Materials)

Proceedings Papers

Effect of Circuit Arrangement on the Performance of Plate Finned Tube Heat Exchangers Under Dehumidifying Conditions

Min-Sheng Liu, Jin-Sheng Leu, Chi-Chuan Wang, Vince C. Mei

Proc. ASME. IMECE99, Advanced Energy Systems, 627-633, November 14–19, 1999

Paper No: IMECE1999-0875

DOI: https://doi.org/10.1115/IMECE1999-0875

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Topics: Circuits, Dehumidification, Heat exchangers, Flow (Dynamics), Pressure drop, Refrigerants, Fins, Heat, Heat conduction, Shapes

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Journal citation

NARROW

Study on Reverse Heat Transfer Phenomenon of Steam Generator in Station Blackout Accident

Modeling and Analysis of Uncertain Static Contact Characteristics for Revolute Clearance Joints

Improving the Snap-Off Process in Solder Paste Stencil Printing via the Enhancement of Wall Slip

Sequential Processing Mechanics Modeling for a Model IC Package

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry

Testing and Constitutive Modeling of Thin Polymer Films and Underfills by a 6-Axis Submicron Tester

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

Thermal Mechanical Properties of Two Solder Alloys

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load

A Singular Perturbation Approach for Modeling Differential-Algebraic Systems

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

On the Life Prediction and Accelerated Testing of Solder Joints

Automatic Warpage Measurement of Advanced Packages by Optical Method

Effect of Manufacturing Induced Defects on the Reliability of Flip-Chip Packages

A Linear Motor Driven Mini Tester and its Application to Thermal/Mechanical Fatigue Testing of Solder Joint Specimen

Effect of Circuit Arrangement on the Performance of Plate Finned Tube Heat Exchangers Under Dehumidifying Conditions

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