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Scott N. Schiffres
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Journal Articles

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021001.
Paper No: EP-22-1003
https://doi.org/10.1115/1.4054972
Published Online: August 8, 2022
View Article titled, Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
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Topics: Computers, Cooling, Copper, Corrosion, Nickel plating, Plates (structures), Pressure drop, Temperature, Thermal resistance, Flow (Dynamics)
Journal Articles

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Ahmad R. Gharaibeh, Yaman M. Manaserh, Mohammad I. Tradat, Firas W. AlShatnawi, Scott N. Schiffres, Bahgat G. Sammakia
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031017.
Paper No: EP-21-1164
https://doi.org/10.1115/1.4054461
Published Online: May 19, 2022
View Article titled, Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink
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Topics: Flow (Dynamics), Heat sinks, Manifolds, Pressure drop, Thermal resistance, Design, Computer simulation, Fluids, Temperature, Heat transfer
Proceedings Papers

A New Device and Technique for Thermal Conductivity Measurements of Glass-Forming Materials With Application to Cryopreservation

Lili E. Ehrlich, Justin S. G. Feig, Scott N. Schiffres, Jonathan A. Malen, Yoed Rabin
Proc. ASME. HT2013, Volume 2: Heat Transfer Enhancement for Practical Applications; Heat and Mass Transfer in Fire and Combustion; Heat Transfer in Multiphase Systems; Heat and Mass Transfer in Biotechnology, V002T11A004, July 14–19, 2013
Paper No: HT2013-17473
https://doi.org/10.1115/HT2013-17473
View Paper titled, A New Device and Technique for Thermal Conductivity Measurements of Glass-Forming Materials With Application to Cryopreservation
Open the PDF for A New Device and Technique for Thermal Conductivity Measurements of Glass-Forming Materials With Application to Cryopreservation in another window
Topics: Cryonics, Glass, Thermal conductivity, Ice, Low temperature, Temperature distribution, Biomaterials, Crystallization, Performance, Preservation
Proceedings Papers

Thermal Conductivity of Carbon Nanotube Aerogels With Different Filling Gases

Scott N. Schiffres, Kyu Hun Kim, Youngseok Oh, Mohammad F. Islam, Jonathan A. Malen
Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 591-595, March 3–6, 2012
Paper No: MNHMT2012-75122
https://doi.org/10.1115/MNHMT2012-75122
View Paper titled, Thermal Conductivity of Carbon Nanotube Aerogels With Different Filling Gases
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Topics: Carbon nanotubes, Gases, Thermal conductivity, Single-walled carbon nanotubes, Vacuum, Helium, Atmospheric pressure, Collisions (Physics), Electrical properties, Fittings
Proceedings Papers

A Modified 3-Omega Technique to Measure Thermal Conductivity in Liquids, Gases, and Powders

Scott N. Schiffres, Jonathan A. Malen
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T30044, March 13–17, 2011
Paper No: AJTEC2011-44110
https://doi.org/10.1115/AJTEC2011-44110
View Paper titled, A Modified 3-Omega Technique to Measure Thermal Conductivity in Liquids, Gases, and Powders
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Topics: Gases, Thermal conductivity, Metals, Fluids, Glass fibers, Heat, Heating, Interfacial thermal resistance, Oscillations, Signals