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S. Manian Ramkumar
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Proceedings Papers

Thermal Conductivity Performance Modeling and Characterization of a Novel Anisotropic Conductive Adhesive Used in Lead-Free Electronics Packaging

Matthew J. Combs, S. Manian Ramkumar, Satish Kandlikar
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1161-1166, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-89672
https://doi.org/10.1115/IMECE2012-89672
View Paper titled, Thermal Conductivity Performance Modeling and Characterization of a Novel Anisotropic Conductive Adhesive Used in Lead-Free Electronics Packaging
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Topics: Adhesives, Anisotropy, Electronic packaging, Modeling, Thermal conductivity, Particulate matter, Hardening (Curing), Manufacturing, Solders, Accelerated life testing
Proceedings Papers

Evaluation of a Novel Anisotropic Conductive Adhesive Shear Under Multiple Tin-Lead and Lead-Free Reflow Cycles for Package-on-Package (POP) Assembly

Dustin D’Angelo, S. Manian Ramkumar, Luke Wentlent, Peter Borgesen
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 475-483, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-89655
https://doi.org/10.1115/IMECE2012-89655
View Paper titled, Evaluation of a Novel Anisotropic Conductive Adhesive Shear Under Multiple Tin-Lead and Lead-Free Reflow Cycles for Package-on-Package (POP) Assembly
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Topics: Adhesives, Anisotropy, Cycles, Manufacturing, Package on package, Shear (Mechanics), Solders, Reliability, Hardening (Curing), Particulate matter
Proceedings Papers

Voiding and Thermal Resistance Modeling and Characterization for a QFN Assembly

Harish Gadepalli, Rangaraj Dhanasekaran, S. Manian Ramkumar, Tim Jensen, Ed Briggs
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 487-495, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-38391
https://doi.org/10.1115/IMECE2010-38391
View Paper titled, Voiding and Thermal Resistance Modeling and Characterization for a QFN Assembly
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Topics: Manufacturing, Modeling, Thermal resistance, Solders, Electronic packaging, Energy dissipation, Experimental design, Heat, Lead-free solders, Soldering
Proceedings Papers

Thermal Shock and Drop Test Behaviour of Area Array Packages in Forward and Backward Compatible Assemblies

Bankeem V. Chheda, Sathishkumar Sakthivelan, S. Manian Ramkumar, Reza Ghaffarian
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 309-316, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89321
https://doi.org/10.1115/InterPACK2009-89321
View Paper titled, Thermal Shock and Drop Test Behaviour of Area Array Packages in Forward and Backward Compatible Assemblies
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Topics: Thermal shock, Solders, Alloys, Failure, Chain, Manufacturing, Solder joints, Ball-Grid-Array packaging, Finishes, Lead-free solders
Proceedings Papers

Characterizing and Minimizing Voids in Quad Flat No-Lead Pack (QFN) Device Assembly Using Pb-Free Solder Alloys

Rangaraj Dhanasekaran, Harish Gadepalli, S. Manian Ramkumar, Tim Jensen, Ed Briggs
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 39-47, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89304
https://doi.org/10.1115/InterPACK2009-89304
View Paper titled, Characterizing and Minimizing Voids in Quad Flat No-Lead Pack (QFN) Device Assembly Using Pb-Free Solder Alloys
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Topics: Alloys, Lead-free solders, Manufacturing, Solders, Electronic packaging, Energy dissipation, Heat, Soldering, Surface mount assemblies
Proceedings Papers

Effect of Forward and Backward Compatibility of Solder Paste and Component Finish on Fine-Pitch Component Assemblies Using ENIG and IMAG PWB Finishes

Anand Kannabiran, Sreekanth Varma Penmatsa, S. Manian Ramkumar, Reza Ghaffarian
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 945-952, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33963
https://doi.org/10.1115/IPACK2007-33963
View Paper titled, Effect of Forward and Backward Compatibility of Solder Paste and Component Finish on Fine-Pitch Component Assemblies Using ENIG and IMAG PWB Finishes
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Topics: Finishes, Printed circuit boards, Solders, Tin, Manufacturing, Solder joints, Testing, Design, Intermetallic compounds, Surface mount packaging
Proceedings Papers

Modeling and Experimental Verification of the Contact Resistance of a Novel Anisotropic Conductive Adhesive

S. Manian Ramkumar, Krishnaswami Srihari
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 149-157, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-42931
https://doi.org/10.1115/IMECE2007-42931
View Paper titled, Modeling and Experimental Verification of the Contact Resistance of a Novel Anisotropic Conductive Adhesive
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Topics: Adhesives, Anisotropy, Contact resistance, Manufacturing, Modeling
Proceedings Papers

A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging

S. Manian Ramkumar, Krishnaswami Srihari
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 381-390, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-83021
https://doi.org/10.1115/IMECE2005-83021
View Paper titled, A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging
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Topics: Adhesives, Anisotropy, Manufacturing, Surface mount packaging, Temperature
Journal Articles

A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging

S. Manian Ramkumar, Krishnaswami Srihari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 149–156.
https://doi.org/10.1115/1.2721086
Published Online: August 14, 2006
View Article titled, A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging
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Topics: Adhesives, Anisotropy, Ball-Grid-Array packaging, Temperature, Manufacturing, Particulate matter, Shear (Mechanics), Contact resistance, Chain, Magnetic fields