1-7 of 7
Rao R. Tummala
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes

Justin Broughton, Vanessa Smet, Rao R. Tummala, Yogendra K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2018, 140(4): 040801.
Paper No: EP-17-1128
https://doi.org/10.1115/1.4040828
Published Online: August 20, 2018
View Article titled, Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes
Open the PDF for Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes in another window
Topics: Cooling, Electronics, Packaging, Temperature, Silicon, High temperature, Heat
Journal Articles

Determination of Energy Release Rate Through Sequential Crack Extension

Scott McCann, Gregory T. Ostrowicki, Anh Tran, Timothy Huang, Tobias Bernhard, Rao R. Tummala, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041003.
Paper No: EP-17-1033
https://doi.org/10.1115/1.4037334
Published Online: August 25, 2017
View Article titled, Determination of Energy Release Rate Through Sequential Crack Extension
Open the PDF for Determination of Energy Release Rate Through Sequential Crack Extension in another window
Topics: Fracture (Materials), Thin films, Copper
Journal Articles

Ultraminiaturized Three-Dimensional IPAC Packages With 100 μ m Thick Glass Substrates for Radio Frequency Front-End Modules

Zihan Wu, Junki Min, Vanessa Smet, Markondeya Raj Pulugurtha, Venky Sundaram, Rao R. Tummala
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041001.
Paper No: EP-16-1151
https://doi.org/10.1115/1.4037221
Published Online: July 27, 2017
View Article titled, Ultraminiaturized Three-Dimensional IPAC Packages With 100 μ m Thick Glass Substrates for Radio Frequency Front-End Modules
Open the PDF for Ultraminiaturized Three-Dimensional IPAC Packages With 100 μ m Thick Glass Substrates for Radio Frequency Front-End Modules in another window
Topics: Glass, Manufacturing, Filters
Proceedings Papers

Reliable Design of Electroplated Copper Through Silicon Vias

Xi Liu, Qiao Chen, Venkatesh Sundaram, Sriram Muthukumar, Rao R. Tummala, Suresh K. Sitaraman
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 497-506, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-39283
https://doi.org/10.1115/IMECE2010-39283
View Paper titled, Reliable Design of Electroplated Copper Through Silicon Vias
Open the PDF for Reliable Design of Electroplated Copper Through Silicon Vias in another window
Topics: Copper, Design, Silicon, Stress, Reliability, Manufacturing, Thermomechanics, Cracking (Materials), Deformation, Electroplating
Proceedings Papers

SOP Embedded Thin Film Resistors on High and Low Loss Thin Film Dielectrics

Swapan Bhattacharya, Mahesh Varadarajan, Premjeet Chahal, K. J. Lee, Ajanta Bhattacharjee, Rao R. Tummala, Suresh Sitaraman, John Papapolymerou, Manos Tentzeris, Joy Laskar
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1999-2004, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73500
https://doi.org/10.1115/IPACK2005-73500
View Paper titled, SOP Embedded Thin Film Resistors on High and Low Loss Thin Film Dielectrics
Open the PDF for SOP Embedded Thin Film Resistors on High and Low Loss Thin Film Dielectrics in another window
Topics: Dielectric materials, Resistors, Thin films, Alloys, Electroless plating, Adhesion, Copper, Density, Electrical wires, Electroplating
Journal Articles

Epoxy Nanocomposite Capacitors for Application as MCM-L Compatible Integral Passives

Swapan K. Bhattacharya, Faculty of Research, Rao R. Tummala, Director
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 1–6.
https://doi.org/10.1115/1.1400751
Published Online: January 12, 2001
View Article titled, Epoxy Nanocomposite Capacitors for Application as MCM-L Compatible Integral Passives
Open the PDF for Epoxy Nanocomposite Capacitors for Application as MCM-L Compatible Integral Passives in another window
Topics: Capacitors, Epoxy adhesives, Epoxy resins, Manufacturing, Nanocomposites, Composite materials, Ceramics, Polymers, Fillers (Materials), Particulate matter
Journal Articles

Microelectronics Packaging Handbook

Rao R. Tummala, editor, Eugene J. Rymaszewski, editor, Y. C. Lee, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 1989, 111(3): 241–242.
https://doi.org/10.1115/1.3226540
Published Online: September 1, 1989
View Article titled, Microelectronics Packaging Handbook
Open the PDF for Microelectronics Packaging Handbook in another window
Topics: Microelectronic packaging