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R. L. Mahajan
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Proceedings Papers

The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints

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Y. Li, R. L. Mahajan, G. Subbarayan
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 119-129, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0782
https://doi.org/10.1115/IMECE1996-0782
View Paper titled, The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints
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Topics: Optimization, Printing, Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Ceramics, Fatigue life, Cycles, Design
Proceedings Papers

On-Line Prediction and Optimization of a CVD Barrel Reactor: An Experimental Study

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R. L. Mahajan, K. J. Walker
Proc. ASME. IMECE96, Fluids Engineering, 69-80, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0956
https://doi.org/10.1115/IMECE1996-0956
View Paper titled, On-Line Prediction and Optimization of a CVD Barrel Reactor: An Experimental Study
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Topics: Chemical vapor deposition, Optimization, Temperature, Artificial neural networks, Flow (Dynamics), Neural network models, Nozzles, Algorithms, Data acquisition systems, Experimental design
Proceedings Papers

CBGA Solder Fillet Shape Prediction and Design Optimization

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Y. Li, R. L. Mahajan
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 431-438, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1120
https://doi.org/10.1115/IMECE1997-1120
View Paper titled, CBGA Solder Fillet Shape Prediction and Design Optimization
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Topics: Design, Optimization, Shapes, Solders, Mathematical analysis, Reliability, Ball-Grid-Array packaging, Ceramics, Composite materials, Experimental design
Proceedings Papers

Mechanically Aspirated Solar Radiation Shields: A CFD and Neural Network Design Analysis

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B. M. Fichera, R. L. Mahajan, T. W. Horst
Proc. ASME. IMECE2001, Heat Transfer: Volume 5 — Computational, Aerospace and Environmental Heat Transfer, 47-58, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24287
https://doi.org/10.1115/IMECE2001/HTD-24287
View Paper titled, Mechanically Aspirated Solar Radiation Shields: A CFD and Neural Network Design Analysis
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Topics: Artificial neural networks, Computational fluid dynamics, Design, Solar radiation, Errors, Radiation (Physics), Sensors, Temperature, Temperature measurement, Temperature sensors
Proceedings Papers

Strategies for Building Artificial Neural Network Models

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R. L. Mahajan
Proc. ASME. IMECE2000, Heat Transfer: Volume 3, 91-92, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1464
https://doi.org/10.1115/IMECE2000-1464
View Paper titled, Strategies for Building Artificial Neural Network Models
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Topics: Artificial neural networks, Algorithms, Experimental design, Network models, Approximation, Computation, Computer simulation, Dynamic systems, Feedforward control, Materials processing
Proceedings Papers

Applications of Artificial Neural Network Analysis in Thermal Systems

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R. L. Mahajan, K. T. Yang
Proc. ASME. IMECE2000, Heat Transfer: Volume 3, 117-118, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1469
https://doi.org/10.1115/IMECE2000-1469
View Paper titled, Applications of Artificial Neural Network Analysis in Thermal Systems
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Topics: Artificial neural networks, Thermal systems, Chemical vapor deposition, Heat exchangers, Manufacturing, Thermal management
Proceedings Papers

Transient Thermal Modeling of Pulsed Laser Irradiation of a Low Absorbing Multilayer Device Using a 2D Model

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D. Shao, R. L. Mahajan
Proc. ASME. HT2003, Heat Transfer: Volume 3, 79-86, July 21–23, 2003
Publisher: American Society of Mechanical Engineers
Paper No: HT2003-47076
https://doi.org/10.1115/HT2003-47076
View Paper titled, Transient Thermal Modeling of Pulsed Laser Irradiation of a Low Absorbing Multilayer Device Using a 2D Model
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Topics: Irradiation (Radiation exposure), Lasers, Modeling, Transients (Dynamics)
Proceedings Papers

Enhancing the Power Handling Capacity of Micro Mirrors: An Experimental and Numerical Investigation

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D. Shao, H. Panchawagh, R. L. Mahajan
Proc. ASME. IMECE2002, Heat Transfer, Volume 5, 175-180, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39181
https://doi.org/10.1115/IMECE2002-39181
View Paper titled, Enhancing the Power Handling Capacity of Micro Mirrors: An Experimental and Numerical Investigation
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Topics: Microelectromechanical systems, Mirrors
Proceedings Papers

Midstream Modulation of Nanotechnology in an Academic Research Laboratory

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E. Fisher, R. L. Mahajan
Proc. ASME. IMECE2006, Engineering Technology Management: Engineering Business Management, Safety Engineering and Risk Analysis, Technology and Society, 189-195, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-14790
https://doi.org/10.1115/IMECE2006-14790
View Paper titled, Midstream Modulation of Nanotechnology in an Academic Research Laboratory
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Topics: Nanotechnology
Journal Articles

Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection

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A. Bhattacharya, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 259–266.
https://doi.org/10.1115/1.2229225
Published Online: September 23, 2005
View Articletitled, Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection
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Topics: Aluminum, Buoyancy, Computer cooling, Convection, Heat sinks, Metal foams, Porous materials
Journal Articles

An Analytical Cure Model for Underfill Epoxies

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R. L. Mahajan, Fellow ASME, C. P. Malhotra, R. K. Sharma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 391–396.
https://doi.org/10.1115/1.1510864
Published Online: December 12, 2002
View Articletitled, An Analytical Cure Model for Underfill Epoxies
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Topics: Epoxy adhesives, Epoxy resins, Hardening (Curing), Heating, Heat transfer coefficients, Temperature
Journal Articles

Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection

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A. Bhattacharya, Research Assistant, R. L. Mahajan, Professor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 155–163.
https://doi.org/10.1115/1.1464877
Published Online: July 26, 2002
View Articletitled, Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection
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Topics: Fins, Flow (Dynamics), Heat sinks, Heat transfer coefficients, Metal foams, Forced convection, Heat transfer
Journal Articles

Forced Convection in High Porosity Metal Foams

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V. V. Calmidi, R. L. Mahajan
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. August 2000, 122(3): 557–565.
https://doi.org/10.1115/1.1287793
Published Online: February 14, 2000
View Articletitled, Forced Convection in High Porosity Metal Foams
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Topics: Aluminum, Fluids, Forced convection, Heat transfer, Metal foams, Porosity, Thermal conductivity, Porous materials, Flow (Dynamics), Temperature
Journal Articles

Alternative Curing Methods for FCOB Underfill

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M. M. Merton, C. P. Malhotra, N. Nikmanesh, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 249–254.
https://doi.org/10.1115/1.2793848
Published Online: December 1, 1999
View Articletitled, Alternative Curing Methods for FCOB Underfill
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Topics: Hardening (Curing), Condensation, Failure mechanisms, Heat transfer, Vapors, Delamination, Failure, Fatigue failure, Flip-chip, Heating
Journal Articles

Mixed Convection in a Horizontal Porous Duct With a Sudden Expansion and Local Heating From Below

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Y. Yokoyama, F. A. Kulacki, R. L. Mahajan
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1999, 121(3): 653–661.
https://doi.org/10.1115/1.2826029
Published Online: August 1, 1999
View Articletitled, Mixed Convection in a Horizontal Porous Duct With a Sudden Expansion and Local Heating From Below
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Topics: Ducts, Heat transfer, Heating, Mixed convection, Glass, Heat, Heat exchangers, Water, Convection, Forced convection
Journal Articles

The Effective Thermal Conductivity of High Porosity Fibrous Metal Foams

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V. V. Calmidi, R. L. Mahajan
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. May 1999, 121(2): 466–471.
https://doi.org/10.1115/1.2826001
Published Online: May 1, 1999
View Articletitled, The Effective Thermal Conductivity of High Porosity Fibrous Metal Foams
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Topics: Heat conduction, Metal foams, Porosity, Porous materials, Thermal conductivity
Journal Articles

CBGA Solder Fillet Shape Prediction and Design Optimization

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Y. Li, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 118–122.
https://doi.org/10.1115/1.2792592
Published Online: June 1, 1998
View Articletitled, CBGA Solder Fillet Shape Prediction and Design Optimization
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Topics: Design, Optimization, Shapes, Solders, Reliability, Fatigue life, Ball-Grid-Array packaging, Ceramics, Composite materials, Engineering simulation
Journal Articles

Analysis of Tombstoning Phenomenon During Reflow

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Q. Qi, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 61–67.
https://doi.org/10.1115/1.2792287
Published Online: March 1, 1998
View Articletitled, Analysis of Tombstoning Phenomenon During Reflow
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Topics: Algebra, Dynamic models, Equations of motion, Geometry, Gravity (Force), Solders
Journal Articles

The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints

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Y. Li, R. L. Mahajan, G. Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 54–60.
https://doi.org/10.1115/1.2792286
Published Online: March 1, 1998
View Articletitled, The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints
Open the PDF for The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints in another window
Topics: Optimization, Printing, Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Ceramics, Fatigue life, Cycles, Design
Journal Articles

Maximizing Solder Joint Reliability Through Optimal Shape Design

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A. M. Deshpande, G. Subbarayan, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 149–155.
https://doi.org/10.1115/1.2792227
Published Online: September 1, 1997
View Articletitled, Maximizing Solder Joint Reliability Through Optimal Shape Design
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Topics: Reliability, Shape optimization, Solder joints, Optimization, Approximation, Design, Electronic packages, Fatigue life, Artificial neural networks, Ball-Grid-Array packaging