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1-4 of 4
R. G. Ross
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Journal Articles
Solder Joint Creep and Stress Relaxation Dependence on Construction and Environmental-Stress Parameters
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 165–172.
Published Online: June 1, 1993
Journal Articles
Solder Creep-Fatigue Interactions With Flexible Leaded Parts
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 185–192.
Published Online: June 1, 1992
Journal Articles
A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging
Available to Purchase
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 121–128.
Published Online: June 1, 1991
Journal Articles
Solar-Cell Interconnect Design for Terrestrial Photovoltaic Modules
Available to Purchase
Journal:
Journal of Solar Energy Engineering
Publisher: ASME
Article Type: Research Papers
J. Sol. Energy Eng. November 1984, 106(4): 379–386.
Published Online: November 1, 1984