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Journal Articles

Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals

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Abhishek Deshpande, Aniket Bharamgonda, Qian Jiang, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041102.
Paper No: EP-23-1038
https://doi.org/10.1115/1.4063325
Published Online: October 5, 2023
View Articletitled, Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals
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Topics: Anisotropy, Cooling, Crystals, Finite element analysis, Grain size, Shear (Mechanics), Solder joints, Solders, Stress, Tin
Proceedings Papers

Anisotropic Plastic Constitutive Properties of SAC305 Single Crystal Solder Joints

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Abhishek Deshpande, Qian Jiang, Abhijit Dasgupta
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-94505
https://doi.org/10.1115/IPACK2022-94505
View Paper titled, Anisotropic Plastic Constitutive Properties of SAC305 Single Crystal Solder Joints
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Topics: Anisotropy, Crystals, Electron backscatter diffraction, Shear (Mechanics), Solder joints
Journal Articles

Research on Heat Transfer Characteristics and Typical Parameters Sensitivity Analysis of the Deep Borehole Heat Exchanger Combined With the Geothermal Wells

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Jiuchen Ma, QiuLi Zhang, Feiyu Yi, Qian Jiang, Yacheng Xie, Yahui Wang
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2022, 14(6): 061008.
Paper No: TSEA-21-1151
https://doi.org/10.1115/1.4052345
Published Online: October 13, 2021
View Articletitled, Research on Heat Transfer Characteristics and Typical Parameters Sensitivity Analysis of the Deep Borehole Heat Exchanger Combined With the Geothermal Wells
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Topics: Geothermal engineering, Heat transfer, Temperature, Water, Wells, Sensitivity analysis, Reservoirs, Pipes, Soil, Heat exchangers
Journal Articles

Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints

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Abhishek Deshpande, Qian Jiang, Abhijit Dasgupta, Ulrich Becker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031006.
Paper No: EP-21-1025
https://doi.org/10.1115/1.4051647
Published Online: September 15, 2021
View Articletitled, Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints
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Topics: Damage, Durability, Fatigue, Shear (Mechanics), Solder joints, Solders, Stress, Finite element analysis, Fatigue damage, Hydrostatics
Proceedings Papers

Flutter Study on High Speed Train External Windshield by a Tight Coupling Method

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Qian Jiang, Guannan Zheng, Guilin Zhao
Proc. ASME. AJKFluids2019, Volume 2: Computational Fluid Dynamics, V002T02A050, July 28–August 1, 2019
Publisher: American Society of Mechanical Engineers
Paper No: AJKFluids2019-5422
https://doi.org/10.1115/AJKFluids2019-5422
View Paper titled, Flutter Study on High Speed Train External Windshield by a Tight Coupling Method
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Topics: Flutter (Aerodynamics), Trains, Vibration
Proceedings Papers

Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)

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Hao Huang, Qian Jiang, Abhijit Dasgupta, Ehsan Mirbagheri, Krishna Darbha
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8345
https://doi.org/10.1115/IPACK2018-8345
View Paper titled, Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)
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Topics: Adhesives, Creep, Pressure, Stress, Bonding, Hydrostatics, Temperature, Cavitation, Cavities, Design
Proceedings Papers

Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

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Qian Jiang, Abhishek Deshpande, Abhijit Dasgupta
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74133
https://doi.org/10.1115/IPACK2017-74133
View Paper titled, Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?
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Topics: Solders, Anisotropy, Tin, Solder joints, Ball-Grid-Array packaging, Crystals, Temperature, Alloys, Composite materials, Cooling
Proceedings Papers

Mechanical Constitutive Properties of Two High-Temperature Lead-Rich Solders

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Qian Jiang, Subhasis Mukherjee, Bastian Vogt, Abhijit Dasgupta, David Shaddock, Liang Yin
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48708
https://doi.org/10.1115/IPACK2015-48708
View Paper titled, Mechanical Constitutive Properties of Two High-Temperature Lead-Rich Solders
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Topics: High temperature, Solders, Temperature, Stress, Creep, Equipment performance, Mechanical properties, Melting, Wire