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Proc. ASME. DSCC2018, Volume 2: Control and Optimization of Connected and Automated Ground Vehicles; Dynamic Systems and Control Education; Dynamics and Control of Renewable Energy Systems; Energy Harvesting; Energy Systems; Estimation and Identification; Intelligent Transportation and Vehicles; Manufacturing; Mechatronics; Modeling and Control of IC Engines and Aftertreatment Systems; Modeling and Control of IC Engines and Powertrain Systems; Modeling and Management of Power Systems, V002T27A003, September 30–October 3, 2018

Paper No: DSCC2018-9043

DOI: https://doi.org/10.1115/DSCC2018-9043

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Topics: Dynamic programming, Energy management, Hybrid electric vehicles, Batteries, Computation, Engines, Vehicles

Journal Articles

Revisiting the Instability and Bifurcation Behavior of Soft Dielectrics

Shengyou Yang, Xuanhe Zhao, Pradeep Sharma

J. Appl. Mech. March 2017, 84(3): 031008.

Paper No: JAM-16-1595

DOI: https://doi.org/10.1115/1.4035499

Published Online: January 24, 2017

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Topics: Bifurcation, Boundary-value problems, Buckling, Deformation, Electric fields, Polarization (Electricity), Polarization (Light), Polarization (Waves), Stress, Dielectric materials

Journal Articles

Flexoelectricity: A Perspective on an Unusual Electromechanical Coupling

Sana Krichen, Pradeep Sharma

J. Appl. Mech. March 2016, 83(3): 030801.

Paper No: JAM-15-1701

DOI: https://doi.org/10.1115/1.4032378

Published Online: January 20, 2016

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Topics: Deformation, Design, Energy harvesting, Multifunctional materials, Piezoelectric materials, Piezoelectricity, Polarization (Electricity), Polarization (Light), Polarization (Waves), Strain gradient

Proceedings Papers

The Connection Between Microstructural Damage Modeling and Continuum Damage Modeling for Eutectic Sn-Pb Solder Alloys

Pradeep Sharma, Abhijit Dasgupta

Proc. ASME. IMECE2002, Applied Mechanics and Biomedical Technology, 79-88, November 17–22, 2002

Paper No: IMECE2002-39185

DOI: https://doi.org/10.1115/IMECE2002-39185

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Topics: Alloys, Damage, Modeling, Solders, Tin, Creep, Cycles, Energy dissipation, Grain boundaries, Plasticity

Proceedings Papers

Prediction of Rate-Independent Constitutive Behavior of Pb-Free Solders Based on First Principles

Pradeep Sharma, Abhijit Dasgupta, Surya Ganti, James Loman

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 125-134, November 17–22, 2002

Paper No: IMECE2002-39254

DOI: https://doi.org/10.1115/IMECE2002-39254

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Topics: Lead-free solders, Particulate matter, Alloys, Calibration, Design, Grain size, Micromechanics (Engineering), Particle size, Physics

Proceedings Papers

Improved Analytical and Semi-Analytical Durability Models (Constrained Models) for Various Surface-Mount Configurations

Pradeep Sharma, James Loman

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 159-164, November 17–22, 2002

Paper No: IMECE2002-39634

DOI: https://doi.org/10.1115/IMECE2002-39634

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Topics: Durability, Surface mount packaging, Calibration, Deformation, Finite element analysis, Physics, Resistors, Solder joints

Proceedings Papers

Prediction of Rate-Dependent Constitutive Behavior of Pb-Free Solders

Qian Zhang, Pradeep Sharma, Abhijit Dasgupta

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 209-214, November 15–21, 2003

Paper No: IMECE2003-41774

DOI: https://doi.org/10.1115/IMECE2003-41774

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Topics: Lead-free solders, Creep, Stress, Dislocations, Particulate matter, Steady state, Temperature, Tin, Constitutive equations, Dislocation density

Journal Articles

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data

Pradeep Sharma, Abhijit Dasgupta

J. Electron. Packag. September 2002, 124(3): 298–304.

DOI: https://doi.org/10.1115/1.1493203

Published Online: July 26, 2002

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Topics: Creep, Cycles, Damage, Durability, Failure, Fatigue, Grain size, Hydrostatics, Micromechanics (Engineering), Solders

Journal Articles

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation

Pradeep Sharma, Abhijit Dasgupta

J. Electron. Packag. September 2002, 124(3): 292–297.

DOI: https://doi.org/10.1115/1.1493202

Published Online: July 26, 2002

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Topics: Creep, Damage, Fatigue, Grain boundaries, Nucleation (Physics), Solders, Stress, Particulate matter, Micromechanics (Engineering)

Journal citation

NARROW

A Tutorial on the Stability and Bifurcation Analysis of the Electromechanical Behaviour of Soft Materials

Micro-Structural Design of Soft Solid Composite Electrolytes With Enhanced Ionic Conductivity

Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling

Tuning Crumpled Sheets for An Enhanced Flexoelectric Response

An Atomistic Perspective on the Effect of Strain Rate and Lithium Fraction on the Mechanical Behavior of Silicon Electrodes

Optimal Energy Management in a Range Extender PHEV Using a Cascaded Dynamic Programming Approach

Revisiting the Instability and Bifurcation Behavior of Soft Dielectrics

Flexoelectricity: A Perspective on an Unusual Electromechanical Coupling

The Connection Between Microstructural Damage Modeling and Continuum Damage Modeling for Eutectic Sn-Pb Solder Alloys

Prediction of Rate-Independent Constitutive Behavior of Pb-Free Solders Based on First Principles

Improved Analytical and Semi-Analytical Durability Models (Constrained Models) for Various Surface-Mount Configurations

Prediction of Rate-Dependent Constitutive Behavior of Pb-Free Solders

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation

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