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Peter A. Kottke
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Proceedings Papers

Brazings for Metal-Ceramic Joining in Sodium Thermal Electrochemical Converter (Na-TEC) Devices

Andrey Gunawan, Jong Min Ha, Diane M. England, Alexander Limia, Peter A. Kottke, Andrei G. Fedorov, Seung Woo Lee, Shannon K. Yee
Proc. ASME. ES2018, ASME 2018 12th International Conference on Energy Sustainability, V001T07A008, June 24–28, 2018
Publisher: American Society of Mechanical Engineers
Paper No: ES2018-7517
https://doi.org/10.1115/ES2018-7517
View Paper titled, Brazings for Metal-Ceramic Joining in Sodium Thermal Electrochemical Converter (Na-TEC) Devices
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Topics: Ceramics, Joining, Metals, Sodium, Thermoelectric coolers, Brazing, Alloys, Electrolytes, Pressure, Carbon
Proceedings Papers

Techno-Economic Analysis of Dual-Stage Sodium Thermal Electrochemical Converter (Na-TEC) Power Block for Distributed CSP

Andrey Gunawan, Alexander Limia, Jong Min Ha, Peter A. Kottke, Seung Woo Lee, Andrei G. Fedorov, Shannon K. Yee
Proc. ASME. ES2018, ASME 2018 12th International Conference on Energy Sustainability, V001T11A008, June 24–28, 2018
Publisher: American Society of Mechanical Engineers
Paper No: ES2018-7505
https://doi.org/10.1115/ES2018-7505
View Paper titled, Techno-Economic Analysis of Dual-Stage Sodium Thermal Electrochemical Converter (Na-TEC) Power Block for Distributed CSP
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Topics: Sodium, Thermoelectric coolers, Design, Generators, Manufacturing, Temperature, Cycles, Electrodes, Heat, Heat engines
Journal Articles

Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps

Mohamed H. Nasr, Craig E. Green, Peter A. Kottke, Xuchen Zhang, Thomas E. Sarvey, Yogendra K. Joshi, Muhannad S. Bakir, Andrei G. Fedorov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011006.
Paper No: EP-16-1097
https://doi.org/10.1115/1.4035387
Published Online: January 5, 2017
View Article titled, Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps
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Topics: Boiling, Flow (Dynamics), Flux (Metallurgy), Heat, Thermal resistance, Heat flux, Wall temperature, Coolants, Pressure drop, Thermal management
Journal Articles

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010910.
Paper No: EP-15-1107
https://doi.org/10.1115/1.4032496
Published Online: March 10, 2016
View Article titled, Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
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Topics: Cooling, Design, Fins, Flow (Dynamics), Heat flux, Heat sinks, Heat transfer coefficients, Microfluidics, Temperature, Testing
Proceedings Papers

Performance and Integration Implications of Addressing Localized Hotspots Through Two Approaches: Clustering of Micro Pin-Fins and Dedicated Microgap Coolers

Craig E. Green, Peter A. Kottke, Thomas E. Sarvey, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A056, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48537
https://doi.org/10.1115/IPACK2015-48537
View Paper titled, Performance and Integration Implications of Addressing Localized Hotspots Through Two Approaches: Clustering of Micro Pin-Fins and Dedicated Microgap Coolers
Open the PDF for Performance and Integration Implications of Addressing Localized Hotspots Through Two Approaches: Clustering of Micro Pin-Fins and Dedicated Microgap Coolers in another window
Topics: Coolers, Fins, Computer simulation, Cooling, Density, Flow (Dynamics), Flux (Metallurgy), Heat, Coolants, Design
Proceedings Papers

3D IC With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A008, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48584
https://doi.org/10.1115/IPACK2015-48584
View Paper titled, 3D IC With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
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Topics: Cooling, Microfluidics, Heat sinks, Atmospheric pressure, Coolants, Heat flux, Heat transfer coefficients, Pressure drop, Silicon, Testing
Journal Articles

Two-Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors

Peter A. Kottke, Thomas M. Yun, Craig E. Green, Yogendra K. Joshi, Andrei G. Fedorov
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. January 2016, 138(1): 011501.
Paper No: HT-15-1103
https://doi.org/10.1115/1.4031111
Published Online: August 11, 2015
View Article titled, Two-Phase Convective Cooling for Ultrahigh Power Dissipation in Microprocessors
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Topics: Coolants, Cooling, Energy dissipation, Friction, Heat, Heat transfer, Pressure, Pressure drop, Temperature, Vapors
Proceedings Papers

Scale Analysis of Combined Radiation and Convection

Peter A. Kottke, Timothy P. Ferguson
Proc. ASME. IMECE2003, Heat Transfer, Volume 2, 373-378, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41920
https://doi.org/10.1115/IMECE2003-41920
View Paper titled, Scale Analysis of Combined Radiation and Convection
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Topics: Convection, Radiation (Physics)
Journal Articles

Scale Analysis of Combined Thermal Radiation and Convection Heat Transfer

Peter A. Kottke, Timothy P. Ferguson, Andrei G. Fedorov
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. April 2004, 126(2): 250–258.
https://doi.org/10.1115/1.1677409
Published Online: May 4, 2004
View Article titled, Scale Analysis of Combined Thermal Radiation and Convection Heat Transfer
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Topics: Boundary layers, Convection, Forced convection, Heat flux, Heat transfer, Mixed convection, Natural convection, Radiation (Physics), Thermal boundary layers, Thermal radiation
Journal Articles

The Measurement of Viscosity of Liquids Under Tension

Peter A. Kottke, Scott S. Bair, Ward O. Winer
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Papers
J. Tribol. April 2003, 125(2): 260–266.
https://doi.org/10.1115/1.1537270
Published Online: March 19, 2003
View Article titled, The Measurement of Viscosity of Liquids Under Tension
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Topics: Pressure, Tension, Viscosity, Bellows (Equipment), Viscosity measurement, Temperature