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Paul Kolodner
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Proceedings Papers

Numerical Analysis of Mist-Cooled High Power Components in Cabinets

Niru Kumari, Vaibhav Bahadur, Marc Hodes, Todd Salamon, Alan Lyons, Paul Kolodner, Suresh V. Garimella
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 933-944, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89269
https://doi.org/10.1115/InterPACK2009-89269
View Paper titled, Numerical Analysis of Mist-Cooled High Power Components in Cabinets
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Topics: Numerical analysis, Flow (Dynamics), Heat sinks, Drops, Evaporation, Telecommunications, Thermal management, Acoustics, Circuits, Cooling
Proceedings Papers

Effects of Interfacial Position on Drag Reduction in a Superhydrophobic Microchannel

Ryan Enright, Tara Dalton, Tom N. Krupenkin, Paul Kolodner, Marc Hodes, Todd R. Salamon
Proc. ASME. ICNMM2008, ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels, 835-845, June 23–25, 2008
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2008-62251
https://doi.org/10.1115/ICNMM2008-62251
View Paper titled, Effects of Interfacial Position on Drag Reduction in a Superhydrophobic Microchannel
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Topics: Drag reduction, Microchannels, Columns (Structural), Flow (Dynamics), Pressure drop, Confined flow, Fluids, Lasers, Microscopy, Pressure
Proceedings Papers

Thermal-Resistance Measurements on Mechanical Gap Fillers

Paul Kolodner, Marc Hodes, Ingo Ewes, Paul Holmes
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 91-98, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73084
https://doi.org/10.1115/IPACK2005-73084
View Paper titled, Thermal-Resistance Measurements on Mechanical Gap Fillers
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Topics: Fillers (Materials), Thermal resistance, Computation, Cooling, Heat sinks, Integrated circuits, Mechanical structures, Metalwork, Springs
Proceedings Papers

Efficient Cooling of Multiple Components in a Shielded Circuit Pack

Paul Kolodner, Cristian Bolle, Marc Hodes
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 71-78, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73071
https://doi.org/10.1115/IPACK2005-73071
View Paper titled, Efficient Cooling of Multiple Components in a Shielded Circuit Pack
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Topics: Circuits, Cooling, Heat sinks, Air flow, Gaskets, Computer software, Electromagnetic interference, Fins, Modeling, Stress
Proceedings Papers

Electrically Tunable Superhydrophobic Nanostructured Surfaces

Tom Krupenkin, J. Ashley Taylor, Paul Kolodner, Marc Hodes
Proc. ASME. ICNMM2006, ASME 4th International Conference on Nanochannels, Microchannels, and Minichannels, Parts A and B, 1211-1220, June 19–21, 2006
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2006-96014
https://doi.org/10.1115/ICNMM2006-96014
View Paper titled, Electrically Tunable Superhydrophobic Nanostructured Surfaces
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Topics: Drops, Microscale devices, Wetting
Proceedings Papers

Friction Factors and Nusselt Numbers in Microchannels With Superhydrophobic Walls

Ryan Enright, Cormac Eason, Tara Dalton, Marc Hodes, Todd Salamon, Paul Kolodner, Tom Krupenkin
Proc. ASME. ICNMM2006, ASME 4th International Conference on Nanochannels, Microchannels, and Minichannels, Parts A and B, 599-609, June 19–21, 2006
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2006-96134
https://doi.org/10.1115/ICNMM2006-96134
View Paper titled, Friction Factors and Nusselt Numbers in Microchannels With Superhydrophobic Walls
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Topics: Friction, Microchannels, Fluids, Flow (Dynamics), Heat transfer, Cooling, Electronics, Heat flux, Momentum, Pressure drop
Proceedings Papers

Numerical Simulation of Fluid Flow in Microchannels With Superhydrophobic Walls

Todd Salamon, Wonsuck Lee, Tom Krupenkin, Marc Hodes, Paul Kolodner, Ryan Enright, Andrew Salinger
Proc. ASME. IMECE2005, Heat Transfer, Part A, 819-829, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-82641
https://doi.org/10.1115/IMECE2005-82641
View Paper titled, Numerical Simulation of Fluid Flow in Microchannels With Superhydrophobic Walls
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Topics: Computer simulation, Fluid dynamics, Microchannels, Flow (Dynamics), Fluids, Wetting, Channel flow, Finite element analysis, Laminar flow, Pressure gradient
Journal Articles

Efficient Cooling of Multiple Components in a Shielded Circuit Pack

Marc Hodes, Cristian Bolle, Paul Kolodner
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2007, 129(2): 216–218.
https://doi.org/10.1115/1.2721095
Published Online: September 5, 2006
View Article titled, Efficient Cooling of Multiple Components in a Shielded Circuit Pack
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Topics: Circuits, Cooling, Gaskets, Heat sinks, Fins, Electromagnetic interference, Stress, Air flow, Flow (Dynamics)