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Journal Articles

Computer Simulation of Thermo-Mechanical Fatigue of Solder Joints Including Microstructure Coarsening

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P. Hacke, A. F. Sprecher, H. Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 153–158.
https://doi.org/10.1115/1.2909311
Published Online: June 1, 1993
View Articletitled, Computer Simulation of Thermo-Mechanical Fatigue of Solder Joints Including Microstructure Coarsening
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Topics: Computer simulation, Fatigue, Solder joints, Thermomechanics, Creep, Stress, Cycles, Damage, Failure, Fatigue life