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Proceedings Papers

Modeling Gait Transitions of Quadruped and Their Generalization With CMAC Neural Networks

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Jian-Nan Lin, Shin-Min Song
Proc. ASME. IDETC-CIE2000, Volume 7A: 26th Biennial Mechanisms and Robotics Conference, 681-688, September 10–13, 2000
Publisher: American Society of Mechanical Engineers
Paper No: DETC2000/MECH-14124
https://doi.org/10.1115/DETC2000/MECH-14124
View Paper titled, Modeling Gait Transitions of Quadruped and Their Generalization With CMAC Neural Networks
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Topics: Artificial neural networks, Kinematics, Modeling
Proceedings Papers

Packaging Challenges of Thin High Bandwidth POP

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Fletcher (Cheng-Piao) Tung, Jensen (Ying-Chou) Tsai, Yu-Po Wang, Joe (Chih-Nan) Lin, Gary (Yue-Long) Fan
Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A014, November 11–14, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2019-11181
https://doi.org/10.1115/IMECE2019-11181
View Paper titled, Packaging Challenges of Thin High Bandwidth POP
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Topics: Manufacturing, Package on package, Packaging, Reliability, Warping
Proceedings Papers

Comparison of Two Ductile Crack Propagation Models of GTN and CZM for Pipe Steel Fracture

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Junqiang Wang, Haitao Wang, Nan Lin, Honglian Ma, Jinlong Wang
Proc. ASME. PVP2018, Volume 6A: Materials and Fabrication, V06AT06A004, July 15–20, 2018
Publisher: American Society of Mechanical Engineers
Paper No: PVP2018-84689
https://doi.org/10.1115/PVP2018-84689
View Paper titled, Comparison of Two Ductile Crack Propagation Models of GTN and CZM for Pipe Steel Fracture
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Topics: Ductile fracture, Fracture (Materials), Fracture (Process), Pipes, Steel, Crack propagation, Damage, Shapes, Accuracy and precision, Cohesion
Journal Articles

A Lifetime Prediction Method of Pressured Gas Polyethylene Pipes by Thermal-Oxidative Aging Test and Tensile Test

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Yang Wang, Hui-qing Lan, Tao Meng, Shan Chen, Jian-dong Zuo, Nan Lin
Journal: Journal of Pressure Vessel Technology
Publisher: ASME
Article Type: Research-Article
J. Pressure Vessel Technol. February 2018, 140(1): 011404.
Paper No: PVT-17-1131
https://doi.org/10.1115/1.4038526
Published Online: December 5, 2017
View Articletitled, A Lifetime Prediction Method of Pressured Gas Polyethylene Pipes by Thermal-Oxidative Aging Test and Tensile Test
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Topics: Polyethylene pipes, Pressure, Temperature, Mechanical properties
Proceedings Papers

Strain Actuation Behavior of Barium Titanate Single Crystal Loaded Electromechanically in Non-Variant [110] Direction

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Jay Shieh, Yen-Nan Lin, Yi-Chung Shu
Proc. ASME. SMASIS2012, Volume 2: Mechanics and Behavior of Active Materials; Integrated System Design and Implementation; Bio-Inspired Materials and Systems; Energy Harvesting, 149-153, September 19–21, 2012
Publisher: American Society of Mechanical Engineers
Paper No: SMASIS2012-8034
https://doi.org/10.1115/SMASIS2012-8034
View Paper titled, Strain Actuation Behavior of Barium Titanate Single Crystal Loaded Electromechanically in Non-Variant [110] Direction
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Topics: Crystals, Electric fields, Stress, Temperature, Prisms (Optics), Compressive stress, Machining, Switches, Testing
eBook Chapter

A New Chaos Based Image Encryption Algorithm

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Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2011
https://doi.org/10.1115/1.859919.paper200
ISBN: 9780791859919
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Topics: Algorithms, Chaos, Encryption
Proceedings Papers

Modeling Gait Transitions Between Two Periodic Gaits for Quadrupeds and Hexapods

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Jian-Nan Lin, Shin-Min Song
Proc. ASME. IMECE2003, Dynamic Systems and Control, Volumes 1 and 2, 675-682, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42710
https://doi.org/10.1115/IMECE2003-42710
View Paper titled, Modeling Gait Transitions Between Two Periodic Gaits for Quadrupeds and Hexapods
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Topics: Cycles, Modeling, Robots, Waves
Journal Articles

Study of Interfacial Phenomena Affecting Thermosonic Wire Bonding in Microelectronics

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Yeau-Ren Jeng, Professor, Jeng-Nan Lin, Graduate Student
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Papers
J. Tribol. July 2003, 125(3): 576–581.
https://doi.org/10.1115/1.1537265
Published Online: June 19, 2003
View Articletitled, Study of Interfacial Phenomena Affecting Thermosonic Wire Bonding in Microelectronics
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Topics: Bonding, Interface phenomena, Shear (Mechanics), Welding, Wire, Wire bonding, Surface roughness, Integrated circuits, Microelectronic devices