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Proceedings Papers

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

Shoji Kamiya, Hironori Takahashi, Masumi Saka, Hiroyuki Abé

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 169-174, November 16–21, 1997

Paper No: IMECE1997-0513

DOI: https://doi.org/10.1115/IMECE1997-0513

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Topics: Adhesives, Fracture (Materials), Fracture (Process), Particulate matter, Synthetic diamonds, Chemical vapor deposition, Diamond films, Nucleation (Physics), Stress, Electronics

Proceedings Papers

A New Approach to Calculate Atomic Flux Divergence by Electromigration

Kazuhiko Sasagawa, Naoaki Nakamura, Masumi Saka, Hiroyuki Abé

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 145-152, November 16–21, 1997

Paper No: IMECE1997-0510

DOI: https://doi.org/10.1115/IMECE1997-0510

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Topics: Electrodiffusion, Current density, Temperature, Corners (Structural elements), Metals, Modeling

Proceedings Papers

Study of Nucleation of Diamond on Silicon Substrate by Ab-Initio Molecular Dynamics

Tomoo Kayaba, Akinori Inoue, Masumi Saka, Hiroyuki Abé

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 83-85, November 15–20, 1998

Paper No: IMECE1998-0432

DOI: https://doi.org/10.1115/IMECE1998-0432

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Topics: Diamonds, Molecular dynamics, Nucleation (Physics), Silicon, Atoms, Carbon, Chemical vapor deposition, Diamond films, Simulation, Aluminum

Proceedings Papers

Analysis of Electromigration Considering Thomson Effect

Kazuhiko Sasagawa, Manabu Yagi, Masumi Saka, Hiroyuki Abé

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 87-92, November 15–20, 1998

Paper No: IMECE1998-0433

DOI: https://doi.org/10.1115/IMECE1998-0433

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Topics: Electrodiffusion, Thermoelectricity, Temperature distribution, Metals, Corners (Structural elements), Current density, Damage, Temperature

Journal Articles

Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect

Yasuhiro Kimura, Masumi Saka

J. Electron. Packag. June 2019, 141(2): 021008.

Paper No: EP-18-1073

DOI: https://doi.org/10.1115/1.4042980

Published Online: April 10, 2019

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Topics: Current density, Electrodiffusion, Finite element analysis, Flow (Dynamics), Electric potential, Anodes, Damage, Density, Solders, Atoms

Journal Articles

Joule Heat Welding of Thin Platinum and Tungsten Wires and the Thermoelectric Effects Around Bi-Metal Junctions

Hironori Tohmyoh, Tomochika Tanaka, Masato Fujimori, Masumi Saka

J. Micro Nano-Manuf. June 2013, 1(2): 024501.

Paper No: JMNM-12-1009

DOI: https://doi.org/10.1115/1.4024082

Published Online: April 17, 2013

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Topics: Heat, Joules, Junctions, Metals, Temperature, Thermoelectricity, Welding, Wire, Circuits, Platinum

Proceedings Papers

Joule Heat Welding of Thin Metallic Wires and Thermoelectric Effects Around Dissimilar Metal Weld

Hironori Tohmyoh, Tomochika Tanaka, Masato Fujimori, Masumi Saka

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 709-712, July 6–8, 2011

Paper No: IPACK2011-52071

DOI: https://doi.org/10.1115/IPACK2011-52071

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Topics: Heat, Joules, Metals, Thermoelectricity, Welding, Wire, Temperature, Circuits, Electrodes

Proceedings Papers

Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-Free Solder Bump

Shoho Ishikawa, Hironori Tohmyoh, Masumi Saka, Satoshi Watanabe, Motohisa Kuroha, Yoshikatsu Nakano

Paper No: IPACK2011-52112

DOI: https://doi.org/10.1115/IPACK2011-52112

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Topics: Fatigue life, Lead-free solders, Electronic components, Electronic packages, Electronic products, Fatigue, Fatigue damage, Fatigue failure, Finite element analysis, Reliability

Proceedings Papers

Evaluating the Dominant Factor for Electromigration in High Purities Al Film Deposited by Sputtering

Xu Zhao, Masumi Saka, Mitsuo Yamashita, Fumiaki Togoh

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 397-400, July 19–23, 2009

Paper No: InterPACK2009-89282

DOI: https://doi.org/10.1115/InterPACK2009-89282

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Topics: Electrodiffusion, Sputtering (Irradiation), Diffusion (Physics), Grain size, Temperature, Ceramics, Current density, Electron field emission, Focused ion beams, Materials properties

Proceedings Papers

High Performance Flip Chip Package With Higher Mountability and Longer Interconnect Life

Satoru Katsurayama, Hironori Tohmyoh, Masumi Saka

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 749-753, July 19–23, 2009

Paper No: InterPACK2009-89148

DOI: https://doi.org/10.1115/InterPACK2009-89148

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Topics: Flip-chip packages, Warping, Reliability, Cycles, Manufacturing, Stress

Proceedings Papers

Manipulation of Thin Metallic Wires by Joule Heat Joining

Hironori Tohmyoh, Hironao Takeda, M. A. Salam Akanda, Masumi Saka

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 563-567, July 19–23, 2009

Paper No: InterPACK2009-89122

DOI: https://doi.org/10.1115/InterPACK2009-89122

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Topics: Heat, Joining, Joules, Wire, Electrical properties, Electrodes, Electromagnetic actuators, Heating, Microelectromechanical systems, Nanoelectromechanical systems

Proceedings Papers

Reliability Analysis of Solderless Press-Fit Interconnections

Hironori Tohmyoh, Kiichiro Yamanobe, Masumi Saka, Jiro Utsunomiya, Takeshi Nakamura, Yoshikatsu Nakano

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 611-615, July 8–12, 2007

Paper No: IPACK2007-33264

DOI: https://doi.org/10.1115/IPACK2007-33264

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Topics: Event history analysis, Press fits, Manufacturing, Stress, Friction, Printed circuit boards, Damage, Displacement, Failure, Finite element analysis

Proceedings Papers

Reliability of Flip Chip Package Depending on Underfill Encapsulating Processes

Satoru Katsurayama, Masumi Saka

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 9-12, July 8–12, 2007

Paper No: IPACK2007-33562

DOI: https://doi.org/10.1115/IPACK2007-33562

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Topics: Flip-chip packages, Reliability, Warping, Stress, Deformation, Flip-chip, Flip-chip devices, Flow (Dynamics), Manufacturing

Proceedings Papers

Fabrication of Al Micro-Coil and Loop by Utilizing Electromigration

Yuxin Sun, Masumi Saka

Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 589-592, June 3–5, 2008

Paper No: MicroNano2008-70073

DOI: https://doi.org/10.1115/MicroNano2008-70073

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Topics: Electrodiffusion, Manufacturing, Fibers, Aluminum, Anodes, Atoms, Crystallization, Current density, Temperature

Proceedings Papers

Acoustic Microscopy for Micro Electrical Interconnections

Hironori Tohmyoh, Tsuyoshi Akaogi, Masumi Saka

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1689-1693, July 17–22, 2005

Paper No: IPACK2005-73061

DOI: https://doi.org/10.1115/IPACK2005-73061

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Topics: Acoustics, Microscopy, Design, Printed circuit boards, Silicon chips

Proceedings Papers

Effect of Line-Shape on Threshold Current Density of Electromigration Damage in Bamboo Lines

Kazuhiko Sasagawa, Shigeo Uno, Nao Yamaji, Masumi Saka

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1147-1152, July 17–22, 2005

Paper No: IPACK2005-73133

DOI: https://doi.org/10.1115/IPACK2005-73133

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Topics: Current density, Damage, Electrodiffusion, Shapes, Metals, Computer simulation, Density, Evaluation methods, Reliability

Proceedings Papers

Development of a New Microscopic Four-Point AFM Probe for the Measurement of Local Electrical Conductivity

Bing-Feng Ju, Yang Ju, Masumi Saka

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1955-1958, July 17–22, 2005

Paper No: IPACK2005-73433

DOI: https://doi.org/10.1115/IPACK2005-73433

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Topics: Atomic force microscopy, Electrical conductivity, Probes, Aluminum, Electrical potential drop techniques, Electrodes, Microscale devices, Photolithography, Position control, Resolution (Optics)

Proceedings Papers

Microwave Imaging of Conductivity Distribution of Silicon Wafers

Yang Ju, Masumi Saka, Hiroyuki Abe´

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 61-64, July 6–11, 2003

Paper No: IPACK2003-35117

DOI: https://doi.org/10.1115/IPACK2003-35117

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Topics: Electrical conductivity, Imaging, Microwaves, Semiconductor wafers, Thermal conductivity, Reflectance, Sensors, Signals, Resolution (Optics)

Proceedings Papers

Nondestructive Inspection of Chip Size Package by Millimeter Waves

Yang Ju, Hiroshi Yamamoto, Masumi Saka

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 765-768, July 6–11, 2003

Paper No: IPACK2003-35118

DOI: https://doi.org/10.1115/IPACK2003-35118

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Topics: Millimeter waves, Nondestructive evaluation, Delamination, Reflectance, Resolution (Optics), Sensors, Silicon chips, Solders

Proceedings Papers

Expression of a Governing Parameter for Electromigration Damage on Metal Line Ends

Masataka Hasegawa, Kazuhiko Sasagawa, Masumi Saka, Hiroyuki Abe´

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 717-722, July 6–11, 2003

Paper No: IPACK2003-35064

DOI: https://doi.org/10.1115/IPACK2003-35064

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Topics: Damage, Electrodiffusion, Metals, Boundary-value problems, Current density, Failure, Computer simulation, Diffusion (Physics), Electric current, Grain boundaries

Journal citation

NARROW

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

A New Approach to Calculate Atomic Flux Divergence by Electromigration

Study of Nucleation of Diamond on Silicon Substrate by Ab-Initio Molecular Dynamics

Analysis of Electromigration Considering Thomson Effect

Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect

Joule Heat Welding of Thin Platinum and Tungsten Wires and the Thermoelectric Effects Around Bi-Metal Junctions

Joule Heat Welding of Thin Metallic Wires and Thermoelectric Effects Around Dissimilar Metal Weld

Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-Free Solder Bump

Evaluating the Dominant Factor for Electromigration in High Purities Al Film Deposited by Sputtering

High Performance Flip Chip Package With Higher Mountability and Longer Interconnect Life

Manipulation of Thin Metallic Wires by Joule Heat Joining

Reliability Analysis of Solderless Press-Fit Interconnections

Reliability of Flip Chip Package Depending on Underfill Encapsulating Processes

Fabrication of Al Micro-Coil and Loop by Utilizing Electromigration

Acoustic Microscopy for Micro Electrical Interconnections

Effect of Line-Shape on Threshold Current Density of Electromigration Damage in Bamboo Lines

Development of a New Microscopic Four-Point AFM Probe for the Measurement of Local Electrical Conductivity

Microwave Imaging of Conductivity Distribution of Silicon Wafers

Nondestructive Inspection of Chip Size Package by Millimeter Waves

Expression of a Governing Parameter for Electromigration Damage on Metal Line Ends

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