1-5 of 5
Manish K. Tiwari
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

On the Thermal Performance of a Microparallel Channels Heat Exchanger

Ivana Fernandes de Sousa, Carolina Palma Naveira Cotta, Daduí Cordeiro Guerrieri, Manish K. Tiwari
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021006.
Paper No: TSEA-18-1266
https://doi.org/10.1115/1.4041439
Published Online: October 31, 2018
View Article titled, On the Thermal Performance of a Microparallel Channels Heat Exchanger
Open the PDF for On the Thermal Performance of a Microparallel Channels Heat Exchanger in another window
Topics: Heat exchangers, Temperature, Flow (Dynamics), Fluids, Microchannels
Proceedings Papers

Hot Water Cooled Electronics for High Exergetic Utility

Severin Zimmermann, Manish K. Tiwari, Ingmar Meijer, Bruno Michel, Dimos Poulikakos
Proc. ASME. HT2012, Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and Mass Transfer in Biotechnology; Environmental Heat Transfer; Visualization of Heat Transfer; Education and Future Directions in Heat Transfer, 373-380, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: HT2012-58432
https://doi.org/10.1115/HT2012-58432
View Paper titled, Hot Water Cooled Electronics for High Exergetic Utility
Open the PDF for Hot Water Cooled Electronics for High Exergetic Utility in another window
Topics: Electronics, Hot water, Heat sinks, Cooling, Data centers, Coolants, Heat, Temperature, Engineering prototypes, Manifolds
Proceedings Papers

3D Integrated Water Cooling of a Composite Multilayer Stack of Chips

Fabio Alfieri, Manish K. Tiwari, Igor Zinovik, Dimos Poulikakos, Thomas Brunschwiler, Bruno Michel
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 565-574, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22813
https://doi.org/10.1115/IHTC14-22813
View Paper titled, 3D Integrated Water Cooling of a Composite Multilayer Stack of Chips
Open the PDF for 3D Integrated Water Cooling of a Composite Multilayer Stack of Chips in another window
Topics: Composite materials, Cooling, Water, Heat transfer, Heat, Modeling, Porous materials, Temperature, Computational fluid dynamics, Fins
Journal Articles

3D Integrated Water Cooling of a Composite Multilayer Stack of Chips

Fabio Alfieri, Manish K. Tiwari, Igor Zinovik, Dimos Poulikakos, Thomas Brunschwiler, Bruno Michel
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. December 2010, 132(12): 121402.
https://doi.org/10.1115/1.4002287
Published Online: September 22, 2010
View Article titled, 3D Integrated Water Cooling of a Composite Multilayer Stack of Chips
Open the PDF for 3D Integrated Water Cooling of a Composite Multilayer Stack of Chips in another window
Topics: Cooling, Flow (Dynamics), Fluids, Heat, Heat transfer, Materials properties, Porous materials, Temperature, Water, Simulation
Proceedings Papers

Electrospun Nanocomposites as Flexible Sensors

Manish K. Tiwari, Alexander L. Yarin, Constantine M. Megaridis
Proc. ASME. MSEC2008, ASME 2008 International Manufacturing Science and Engineering Conference, Volume 2, 281-285, October 7–10, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MSEC_ICM&P2008-72475
https://doi.org/10.1115/MSEC_ICMP2008-72475
View Paper titled, Electrospun Nanocomposites as Flexible Sensors
Open the PDF for Electrospun Nanocomposites as Flexible Sensors in another window
Topics: Nanocomposites, Sensors, Strips, Composite materials, Electrical resistance, Elongation, Fibers, Filters, Geometry, Nanoparticles