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Proceedings Papers

Finite Element Vibration Analysis for Zero Inserting Force Socket

Kuo-Ning Chiang, Hsueh-Horng Fu
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 81-86, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0893
https://doi.org/10.1115/IMECE1996-0893
View Paper titled, Finite Element Vibration Analysis for Zero Inserting Force Socket
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Topics: Finite element analysis, Vibration analysis, Finite element model, Boundary-value problems, Design, Finite element methods, Packaging, Vibration
Proceedings Papers

Prediction of the Solder Joint Configuration Under Various Geometric Parameters

Wei-Long Chen, Bor-Lin Shyu, Kuo-Ning Chiang
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 397-400, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1116
https://doi.org/10.1115/IMECE1997-1116
View Paper titled, Prediction of the Solder Joint Configuration Under Various Geometric Parameters
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Topics: Solder joints, Shapes, Electronic packaging, Energy conservation, Gravity (Force), Numerical analysis, Shape design, Solders, Surface tension, Weight (Mass)
Proceedings Papers

On the Equivalent Finite Element Beam Model for Ball Grid Array Analysis

Hsien-Chie Cheng, Kuo-Ning Chiang, Ming-Hsiao Lee
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 353-360, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1110
https://doi.org/10.1115/IMECE1997-1110
View Paper titled, On the Equivalent Finite Element Beam Model for Ball Grid Array Analysis
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Topics: Ball-Grid-Array packaging, Finite element analysis, Optimization, Packaging, Pipes, Plastics, Solder joints
Proceedings Papers

Parametric Analysis of Thermally Enhanced BGA Reliability Using a Finite-Volume-Weighted Averaging Technique

Hsien-Chie Cheng, Kuo-Ning Chiang, Chao-Kuang Chen
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 13-20, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0423
https://doi.org/10.1115/IMECE1998-0423
View Paper titled, Parametric Analysis of Thermally Enhanced BGA Reliability Using a Finite-Volume-Weighted Averaging Technique
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Topics: Ball-Grid-Array packaging, Reliability, Solder joints, Ball-Grid-Array packages, Design, Fatigue, Geometry, Corners (Structural elements), Finite element analysis, Manufacturing
Proceedings Papers

On Enhancing Eutectic Solder Joint Reliability Using a 2 nd -Reflow-Process Approach

Kuo-Ning Chiang, Hsien-Chie Cheng
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 21-25, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0424
https://doi.org/10.1115/IMECE1998-0424
View Paper titled, On Enhancing Eutectic Solder Joint Reliability Using a 2 nd -Reflow-Process Approach
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Topics: Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Geometry, Fatigue life, Flip-chip, Flip-chip devices, Materials properties
Proceedings Papers

Thermal-Mechanical Analysis of an NCA Type of Chip-on-Glass Assemblies

Hsien-Chie Cheng, Ming-Hsiao Lee, Kuo-Ning Chiang, Chung-Wen Chang
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 43-49, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2245
https://doi.org/10.1115/IMECE2000-2245
View Paper titled, Thermal-Mechanical Analysis of an NCA Type of Chip-on-Glass Assemblies
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Topics: Adhesion, Adhesives, Bonding, Composite materials, Contact resistance, Cracking (Materials), Delamination, Design, Electrodes, Finite element model
Journal Articles

Empirical High Cycle Fatigue Assessment Model of MEMS Devices

Chia-Cheng Chang, Kuo-Ning Chiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011005.
Paper No: EP-19-1027
https://doi.org/10.1115/1.4044278
Published Online: September 19, 2019
View Article titled, Empirical High Cycle Fatigue Assessment Model of MEMS Devices
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Topics: Design, Fatigue life, High cycle fatigue, Microelectromechanical systems, Silicon-on-insulator, Simulation, Stress, Torsion, Cycles, Damage
Journal Articles

Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures

Chia-Cheng Chang, Sheng-Da Lin, Kuo-Ning Chiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031008.
Paper No: EP-18-1004
https://doi.org/10.1115/1.4040297
Published Online: June 26, 2018
View Article titled, Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures
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Topics: Stress, High cycle fatigue, Displacement, Silicon, Thin films, Fatigue life
Journal Articles

Microstructure Effects on Cutting Forces and Flow Stress in Ultra-Precision Machining of Polycrystalline Brittle Materials

Siva Venkatachalam, Omar Fergani, Xiaoping Li, Jiang Guo Yang, Kuo-Ning Chiang, Steven Y. Liang
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research-Article
J. Manuf. Sci. Eng. April 2015, 137(2): 021020.
Paper No: MANU-13-1403
https://doi.org/10.1115/1.4029648
Published Online: April 1, 2015
View Article titled, Microstructure Effects on Cutting Forces and Flow Stress in Ultra-Precision Machining of Polycrystalline Brittle Materials
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Topics: Cutting, Flow (Dynamics), Grain boundaries, Grain size, Machining, Stress, Thrust, Modeling, Brittleness
Proceedings Papers

Reliability Assessment of 3D Chip Stacking Package Using Metal Bonding and Through Silicon Via Technologies

Shih-Yi Syu, Tuan-Yu Hung, Chao-Jen Huang, Han-Jung Wang, Hsin-Li Lee, Kuo-Ning Chiang
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 113-120, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40158
https://doi.org/10.1115/IMECE2010-40158
View Paper titled, Reliability Assessment of 3D Chip Stacking Package Using Metal Bonding and Through Silicon Via Technologies
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Topics: Metal bonding, Reliability, Silicon, Copper, Thermal expansion, Finite element analysis, Modeling, Stress concentration, Thermomechanics, Computer software
Proceedings Papers

Thin Film Residual Stress Assessment of MEMS Microphone Using Process Modeling Technology

Han-Jung Wang, Hung-An Deng, Shih-Ying Chiang, Kuo-Ning Chiang
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 401-407, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52201
https://doi.org/10.1115/IPACK2011-52201
View Paper titled, Thin Film Residual Stress Assessment of MEMS Microphone Using Process Modeling Technology
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Topics: Microelectromechanical systems, Microphones, Modeling, Stress, Thin films, Finite element analysis, Aluminum, Deformation, Polysilicon, Residual stresses
Proceedings Papers

Determination and Verification of Silicon Die Strength Using Ball-Breaker Test

Pei-Chi Chen, Shin-Yueh Yang, Kuo-Ning Chiang
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 299-305, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52200
https://doi.org/10.1115/IPACK2011-52200
View Paper titled, Determination and Verification of Silicon Die Strength Using Ball-Breaker Test
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Topics: Silicon, Fracture (Materials), Finite element methods, Semiconductor wafers, Computer software, Diluents, Electronic packaging, Failure, Failure mechanisms, Packaging density (Electronics)
Proceedings Papers

Thermal Management on Hot Spot Elimination / Junction Temperature Reduction for High Power Density System in Package Structure

Chan-Yen Chou, Chung-Jung Wu, Hsiu-Ping Wei, Ming-Chih Yew, Chien-Chia Chiu, Kuo-Ning Chiang
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 227-232, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33534
https://doi.org/10.1115/IPACK2007-33534
View Paper titled, Thermal Management on Hot Spot Elimination / Junction Temperature Reduction for High Power Density System in Package Structure
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Topics: Junctions, Power density, System-in-package, Temperature, Thermal management, Heat, Metals, Design, Slug flows, Solders
Proceedings Papers

Failure Mode and Thermal Performance Analysis of Stacked Panel Level Package (PLP)

Hsiu-Ping Wei, Ming-Chih Yew, Chao-Jen Huang, Kuo-Ning Chiang
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 693-701, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33368
https://doi.org/10.1115/IPACK2007-33368
View Paper titled, Failure Mode and Thermal Performance Analysis of Stacked Panel Level Package (PLP)
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Topics: Failure mechanisms, Reliability, Fillers (Materials), Finite element analysis, Manufacturing, Packaging, Polymers, Solder joints, Cycles, Failure
Proceedings Papers

Characterization of Time and Temperature Dependent Mechanical Behavior of Underfill Materials in Electronic Packaging Application

Chia-Tai Kuo, Ming-Chuen Yip, Kuo-Ning Chiang
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 473-483, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35232
https://doi.org/10.1115/IPACK2003-35232
View Paper titled, Characterization of Time and Temperature Dependent Mechanical Behavior of Underfill Materials in Electronic Packaging Application
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Topics: Creep, Electronic packaging, Mechanical behavior, Temperature, Testing, Thermomechanics, Adhesion, Solder masks, Deformation, Stress
Proceedings Papers

Analysis and Validation of Sensing Sensitivity of a Piezoresistive Pressure Sensor

Chun-Te Lin, Chih-Tang Peng, Ji-Cheng Lin, Kuo-Ning Chiang
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 225-231, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35053
https://doi.org/10.1115/IPACK2003-35053
View Paper titled, Analysis and Validation of Sensing Sensitivity of a Piezoresistive Pressure Sensor
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Topics: Finite element methods, Pressure sensors
Proceedings Papers

Design and Reliability Analysis of Wafer Level Package With Bubble-Like Buffer Layer

Chang-Chun Lee, Kuo-Ning Chiang
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 813-818, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35052
https://doi.org/10.1115/IPACK2003-35052
View Paper titled, Design and Reliability Analysis of Wafer Level Package With Bubble-Like Buffer Layer
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Topics: Bubbles, Design, Event history analysis, Polishing equipment, Reliability, Semiconductor wafers
Proceedings Papers

Investigation of Thermal Effect of Packaged CMOS Compatible Pressure Sensor

Chih-Tang Peng, Ji-Cheng Lin, Chun-Te Lin, Kuo-Ning Chiang
Proc. ASME. IMECE2002, Manufacturing, 505-512, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-33723
https://doi.org/10.1115/IMECE2002-33723
View Paper titled, Investigation of Thermal Effect of Packaged CMOS Compatible Pressure Sensor
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Topics: Complementary metal oxide semiconductors, Finite element methods, Pressure sensors, Temperature effects
Proceedings Papers

Design and Analysis of the CMOS Compatible Pressure Sensor Using Flip Chip and Flex Circuit Board Technologies

Chih-Tang Peng, Chang-Chun Lee, Kuo-Ning Chiang
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 43-49, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41091
https://doi.org/10.1115/IMECE2003-41091
View Paper titled, Design and Analysis of the CMOS Compatible Pressure Sensor Using Flip Chip and Flex Circuit Board Technologies
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Topics: Complementary metal oxide semiconductors, Design, Finite element methods, Flexible electronics, Flip-chip, Flip-chip devices, Pressure sensors
Proceedings Papers

A Novel Silicon Base Piezoresistive Pressure Sensor Using Front Side Etching Process

Chih-Tang Peng, Ji-Cheng Lin, Chun-Te Lin, Kuo-Ning Chiang, Jin-Shown Shie
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 79-86, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41092
https://doi.org/10.1115/IMECE2003-41092
View Paper titled, A Novel Silicon Base Piezoresistive Pressure Sensor Using Front Side Etching Process
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Topics: Etching, Finite element methods, Pressure sensors, Silicon