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Krishnaswami Srihari
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Proceedings Papers

Video Based Manufacturing Courses for Electronics

John A. Fillo, Chittaranjan Sahay, Krishnaswami Srihari
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 471-477, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1126
https://doi.org/10.1115/IMECE1997-1126
View Paper titled, Video Based Manufacturing Courses for Electronics
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Topics: Electronics, Manufacturing, Defense industry, Packaging, Students, Wire
Proceedings Papers

Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages (WLCSP)

Pushkraj Tumne, Vikram Venkatadri, Santosh Kudtarkar, Michael Delaus, Daryl Santos, Ross Havens, Krishnaswami Srihari
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 713-721, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52078
https://doi.org/10.1115/IPACK2011-52078
View Paper titled, Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages (WLCSP)
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Topics: Design, Semiconductor wafers, Solders, Reliability, Electronics, Failure, Flip-chip, Intermetallic compounds, Brittle fracture, Failure mechanisms
Proceedings Papers

Optimizing System-on-Film (SOF) Design Using Finite Element Analysis

Vikram Venkatadri, Mark Downey, Xiaojie Xue, Dipak Sengupta, Daryl Santos, Ross Havens, Krishnaswami Srihari
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 723-731, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52143
https://doi.org/10.1115/IPACK2011-52143
View Paper titled, Optimizing System-on-Film (SOF) Design Using Finite Element Analysis
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Topics: Bonding, Compression, Design, Finite element analysis
Journal Articles

A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems

Vikram Venkatadri, Bahgat Sammakia, Krishnaswami Srihari, Daryl Santos
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041011.
https://doi.org/10.1115/1.4005298
Published Online: December 9, 2011
View Article titled, A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems
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Topics: Thermal management, Cooling, Silicon, Circuits, Integrated circuits, Heat
Proceedings Papers

Angular Offset Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment

Rohan Kulkarni, Krishnaswami Srihari
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 277-282, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89233
https://doi.org/10.1115/InterPACK2009-89233
View Paper titled, Angular Offset Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment
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Topics: Electronics, Manufacturing, Optical fiber, Polarization (Light), Fibers, Displacement, Polarization (Electricity), Polarization (Waves), Electric discharge, Experimental design
Proceedings Papers

Mapping Growth of an Emerging Technology: A Case Study of Flexible Electronics

Srikanth Poranki, Nagen Nagarur, Krishnaswami Srihari
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 301-307, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89315
https://doi.org/10.1115/InterPACK2009-89315
View Paper titled, Mapping Growth of an Emerging Technology: A Case Study of Flexible Electronics
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Topics: Flexible electronics, Electronics, Cycles, Diffusion (Physics), Explosions, Failure, Innovation, Patents, Plastics, Roads
Proceedings Papers

Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment

Rohan Kulkarni, Krishnaswami Srihari
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 261-265, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89221
https://doi.org/10.1115/InterPACK2009-89221
View Paper titled, Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment
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Topics: Electronics, Manufacturing, Optical fiber, Polarization (Electricity), Polarization (Light), Polarization (Waves), Fibers, Engineering design processes, Experimental design, Manufacturing technology
Proceedings Papers

New Product Introduction of Fully Buffered DIMM: A Process Perspective

Gurudutt Chennagiri, Satyanarayan Iyer, Pei-Fang Tsai, Krishnaswami Srihari
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 917-922, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33678
https://doi.org/10.1115/IPACK2007-33678
View Paper titled, New Product Introduction of Fully Buffered DIMM: A Process Perspective
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Topics: Adhesion, Failure mechanisms, Failure mode and effects analysis, Heat sinks, Manufacturing, Product reliability, Reliability, Separation (Technology), Shock (Mechanics), Vibration tests
Proceedings Papers

Optimizing the Cycle Time of a Multi-Spindle Pick-and-Place Machine

Ashok Thiagarajan, Purushothaman Damodaran, Krishnaswami Srihari
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 931-936, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33808
https://doi.org/10.1115/IPACK2007-33808
View Paper titled, Optimizing the Cycle Time of a Multi-Spindle Pick-and-Place Machine
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Topics: Cycles, Machinery, Assembly lines, Computer software, Lumber, Nozzles, Solders, Electronics, Manufacturing, Ovens
Proceedings Papers

Mechanical Reliability Evaluation of Stripped and Replated Component Termination Finishes

Guhan Subbarayan, Robert Kinyanjui, Pei Fang Tsai, Krishnaswami Srihari
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 43-49, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33666
https://doi.org/10.1115/IPACK2007-33666
View Paper titled, Mechanical Reliability Evaluation of Stripped and Replated Component Termination Finishes
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Topics: Finishes, Reliability, Tin, Testing, Hazardous substances, Integrated circuits, Intermetallic compounds, Lumber, Nickel, Optical microscopes
Proceedings Papers

PB-Free Wave Soldering of Thick Printed Circuit Boards Using No-Clean VOC Free Flux

Shantanu Mukherjee, Manuel Castro, Pei-Fang Jennifer Tsai, Krishnaswami Srihari, Van D. Nguyen
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 143-147, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-42930
https://doi.org/10.1115/IMECE2007-42930
View Paper titled, PB-Free Wave Soldering of Thick Printed Circuit Boards Using No-Clean VOC Free Flux
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Topics: Printed circuit boards, Wave soldering, Waves, Alloys, Capillarity, Conveyor systems, Finishes, Inspection, Lead-free solders, Liquid alloys
Proceedings Papers

Modeling and Experimental Verification of the Contact Resistance of a Novel Anisotropic Conductive Adhesive

S. Manian Ramkumar, Krishnaswami Srihari
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 149-157, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-42931
https://doi.org/10.1115/IMECE2007-42931
View Paper titled, Modeling and Experimental Verification of the Contact Resistance of a Novel Anisotropic Conductive Adhesive
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Topics: Adhesives, Anisotropy, Contact resistance, Manufacturing, Modeling
Proceedings Papers

A Repeatable and Reliable Rework Process for Lead-Free Fine Pitch BGA’s

Deepak Manjunath, Satyanarayan Iyer, Shawn Eckel, Purushothaman Damodaran, Krishnaswami Srihari
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 391-397, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-83026
https://doi.org/10.1115/IMECE2005-83026
View Paper titled, A Repeatable and Reliable Rework Process for Lead-Free Fine Pitch BGA’s
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Topics: Ball-Grid-Array packaging, Copper, Forced convection, Iron, Lead-free solders, Machinery, Ovens, Reliability, Solder joints, Soldering
Proceedings Papers

A Study on Optical Fiber Damage Due to Optoelectronic Assembly Processes

Kaustubh R. Nagarkar, Peter Borgesen, Krishnaswami Srihari
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 399-405, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-83030
https://doi.org/10.1115/IMECE2005-83030
View Paper titled, A Study on Optical Fiber Damage Due to Optoelectronic Assembly Processes
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Topics: Damage, Manufacturing, Optical fiber, Fibers, Equipment performance, Adhesives, Lasers, Optical microscopy, Packaging, Photodiodes
Proceedings Papers

A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging

S. Manian Ramkumar, Krishnaswami Srihari
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 381-390, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-83021
https://doi.org/10.1115/IMECE2005-83021
View Paper titled, A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging
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Topics: Adhesives, Anisotropy, Manufacturing, Surface mount packaging, Temperature
Proceedings Papers

Analysis of Solder Wetting in Sn-Ag-Cu.05 Lead Free Alloy

Scott J. Anson, Jacob G. Slezak, Krishnaswami Srihari
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 145-154, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-15759
https://doi.org/10.1115/IMECE2006-15759
View Paper titled, Analysis of Solder Wetting in Sn-Ag-Cu.05 Lead Free Alloy
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Topics: Alloys, Solders, Tin, Wetting, Temperature, Electronics, Manufacturing, Soldering, Damage, Risk
Proceedings Papers

An Experimental Study of Lead-Free Wave Soldering Using SAC 305 and No-Clean Flux

Guhan Subbarayan, Buck Warnock, Purushothaman Damodaran, Krishnaswami Srihari, Jorge Arellano
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 101-108, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13927
https://doi.org/10.1115/IMECE2006-13927
View Paper titled, An Experimental Study of Lead-Free Wave Soldering Using SAC 305 and No-Clean Flux
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Topics: Wave soldering, Alloys, Solders, Wetting, Chemistry, Copper, Finishes, Silver, Temperature, Convection
Proceedings Papers

An Experimental Study on Voids in Mixed Alloy Assemblies

Felix Bruno, Purushothaman Damodaran, Krishnaswami Srihari, Guhan Subbarayan
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 81-89, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13556
https://doi.org/10.1115/IMECE2006-13556
View Paper titled, An Experimental Study on Voids in Mixed Alloy Assemblies
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Topics: Alloys, Manufacturing, Solders, Reliability, Solder joints, Electronics, Fracture (Materials), Ball-Grid-Array packaging, Crack propagation, Creep
Journal Articles

A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging

S. Manian Ramkumar, Krishnaswami Srihari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 149–156.
https://doi.org/10.1115/1.2721086
Published Online: August 14, 2006
View Article titled, A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging
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Topics: Adhesives, Anisotropy, Ball-Grid-Array packaging, Temperature, Manufacturing, Particulate matter, Shear (Mechanics), Contact resistance, Chain, Magnetic fields