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Ki-Ju Kang
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Proceedings Papers

An Experimental Method to Measure Q-Parameter for Two Parameter Theory of Ductile Fracture

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Dong-Hak Kim, Jeong-Hyun Lee, Ki-Ju Kang
Proc. ASME. IMECE2003, Recent Advances in Mechanics of Solids and Structures, 61-70, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41867
https://doi.org/10.1115/IMECE2003-41867
View Paper titled, An Experimental Method to Measure Q-Parameter for Two Parameter Theory of Ductile Fracture
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Topics: Computer software, Displacement, Ductile fracture, Finite element analysis, Fracture (Materials), Geometry, Necking, Photography, Resolution (Optics), Simulation
Proceedings Papers

A New Periodic Cellular Metal With Kagome Trusses and Its Performance

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Yong-Hyun Lee, Ji-Eun Choi, Ki-Ju Kang
Proc. ASME. IMECE2006, Aerospace, 629-635, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-15467
https://doi.org/10.1115/IMECE2006-15467
View Paper titled, A New Periodic Cellular Metal With Kagome Trusses and Its Performance
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Topics: Metals, Compression, Deflection, Manufacturing, Mechanical behavior, Raw materials, Stiffness, Trusses (Building), Wire
Journal Articles

Effect of Geometry and Materials on Residual Stress Measurement in Thin Films by Using the Focused Ion Beam

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Ki-Ju Kang, Severine Darzens, Gee-Seob Choi
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. October 2004, 126(4): 457–464.
https://doi.org/10.1115/1.1789965
Published Online: November 9, 2004
View Articletitled, Effect of Geometry and Materials on Residual Stress Measurement in Thin Films by Using the Focused Ion Beam
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Topics: Focused ion beams, Geometry, Stress, Thin films, Displacement, Finite element analysis, Elasticity, Carbon, Diamonds
Journal Articles

Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints

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Ki-Ju Kang, Seon-Ho Choi, Tae-Sung Bae
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 385–390.
https://doi.org/10.1115/1.1510863
Published Online: December 12, 2002
View Articletitled, Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints
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Topics: Fatigue cracks, Fracture (Materials), Solder joints, Solders, Stress, Fatigue testing, Intermetallic compounds