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Jon F. Ihlefeld
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Proceedings Papers

The Effect of Ballistic Electron Transport on Copper-Niobium Thermal Interface Conductance

Ramez Cheaito, John C. Duda, Thomas E. Beechem, Jon F. Ihlefeld, Khalid Hattar, Edward S. Piekos, Amit Misra, Jon K. Baldwin, Patrick E. Hopkins
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A009, July 14–19, 2013
Paper No: HT2013-17541
https://doi.org/10.1115/HT2013-17541
View Paper titled, The Effect of Ballistic Electron Transport on Copper-Niobium Thermal Interface Conductance
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Topics: Copper, Electrical conductance, Electron transport, Electromagnetic scattering, Electrons, Metals, Thermal conductivity, Resistors, Temperature, Thermoreflectance