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Proceedings Papers

DSC, TMA, DMA, and TGA of Epoxies for Fiber-Optic Transceiver Applications

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John Lau, Steve Erasmus, Fred Sporon-Fiedler, Chris Chang
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 163-168, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24720
https://doi.org/10.1115/IMECE2001/EPP-24720
View Paper titled, DSC, TMA, DMA, and TGA of Epoxies for Fiber-Optic Transceiver Applications
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Topics: Epoxy adhesives, Epoxy resins, Fibers, Absorption, Glass transition, Hardening (Curing), Materials properties, Storage, Temperature
Proceedings Papers

TSV Interposers With Embedded Microchannels for 3D IC and LED Integration

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John Lau, Heng-Chieh Chien, Ray Tain
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 297-304, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52204
https://doi.org/10.1115/IPACK2011-52204
View Paper titled, TSV Interposers With Embedded Microchannels for 3D IC and LED Integration
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Topics: Microchannels, Silicon, Cooling, Optical instruments, Pressure drop, Structural design, System-in-package
Proceedings Papers

Thermal-Fatigue Life Prediction Equation for Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints

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John Lau, S. W. Ricky Lee, Fubin Song, Dongkai Shangguan, Dennis C. Lau, Walter Dauksher
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1013-1019, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73362
https://doi.org/10.1115/IPACK2005-73362
View Paper titled, Thermal-Fatigue Life Prediction Equation for Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints
Open the PDF for Thermal-Fatigue Life Prediction Equation for Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints in another window
Topics: Ball-Grid-Array packaging, Fatigue, Lead-free solders, Alloys, Failure mechanisms, Vehicles
Proceedings Papers

A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints

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John Lau, Ricky Lee, Walter Dauksher, Dongkai Shangguan, Fubin Song, Dennis Lau
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1021-1029, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73364
https://doi.org/10.1115/IPACK2005-73364
View Paper titled, A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints
Open the PDF for A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints in another window
Topics: Ball-Grid-Array packaging, Fatigue life, Lead-free solders, Reliability, Design, Fatigue, Manufacturing
Proceedings Papers

Effects of Void, Crack, and PCB Thickness on the Solder Joint Reliability of Wafer-Level Chip-Scale Package (WLCSP) Assemblies

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John Lau, Yida Zou, Sergio Camerlo
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 195-202, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39495
https://doi.org/10.1115/IMECE2002-39495
View Paper titled, Effects of Void, Crack, and PCB Thickness on the Solder Joint Reliability of Wafer-Level Chip-Scale Package (WLCSP) Assemblies
Open the PDF for Effects of Void, Crack, and PCB Thickness on the Solder Joint Reliability of Wafer-Level Chip-Scale Package (WLCSP) Assemblies in another window
Topics: Fracture (Materials), Reliability, Semiconductor wafers, Solder joints, Creep, Fracture mechanics, Manufacturing, Printed circuit boards, Solders, Temperature
Proceedings Papers

Lead-Free Solder-Joint Reliability of a Photonic Device Under Transient and Steady State Loadings

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Walter Dauksher, John Lau
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 387-394, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42253
https://doi.org/10.1115/IMECE2003-42253
View Paper titled, Lead-Free Solder-Joint Reliability of a Photonic Device Under Transient and Steady State Loadings
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Topics: Alloys, Boundary-value problems, Cavities, Creep, Energy generation, Lasers, Lead-free solders, Packaging, Photonic equipment, Relaxation (Physics)
Proceedings Papers

Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5Sn3.9Ag0.6Cu Lead-Free Solder Paste on PCBs (Printed Circuit Boards)

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John Lau, Walter Dauksher
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 229-238, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-55041
https://doi.org/10.1115/IMECE2003-55041
View Paper titled, Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5Sn3.9Ag0.6Cu Lead-Free Solder Paste on PCBs (Printed Circuit Boards)
Open the PDF for Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5Sn3.9Ag0.6Cu Lead-Free Solder Paste on PCBs (Printed Circuit Boards) in another window
Topics: Ceramics, Lead-free solders, Printed circuit boards, Reliability, Solders, Fatigue, Computers, Creep, Density, Energy dissipation
Proceedings Papers

Effects of Dwell-Time on the Thermal-Fatigue Life of SnAgCu Lead-Free Solder Joints

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John Lau, Walter Dauksher
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 257-263, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-62492
https://doi.org/10.1115/IMECE2004-62492
View Paper titled, Effects of Dwell-Time on the Thermal-Fatigue Life of SnAgCu Lead-Free Solder Joints
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Topics: Fatigue, Lead-free solders, Creep, Temperature, Ball-Grid-Array packaging, Cycles, Density
Proceedings Papers

Thermal Fatigue-Life Prediction of Lead-Free Solder Joints

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John Lau, Ricky Lee, Dongkai Shangguan
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 265-270, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-62493
https://doi.org/10.1115/IMECE2004-62493
View Paper titled, Thermal Fatigue-Life Prediction of Lead-Free Solder Joints
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Topics: Fatigue life, Lead-free solders, Reliability, Ball-Grid-Array packaging, Design, Fatigue, Manufacturing
Proceedings Papers

Effects of Dwell-Time and Ramp-Rate on The Thermal-Fatigue Life of SnAgCu Joints

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Walter Dauksher, John Lau
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 23-28, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-79984
https://doi.org/10.1115/IMECE2005-79984
View Paper titled, Effects of Dwell-Time and Ramp-Rate on The Thermal-Fatigue Life of SnAgCu Joints
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Topics: Creep, Density, Fatigue, Finite element analysis
Proceedings Papers

Thermal-Mechanical Analysis of a Flip-Chip VCSEL (Vertical-Cavity Surface-Emitting Laser) Package With Low-Temperature Lead-Free (SnBi) Solder Joints

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John Lau, Walter Dauksher
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 299-324, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-79981
https://doi.org/10.1115/IMECE2005-79981
View Paper titled, Thermal-Mechanical Analysis of a Flip-Chip VCSEL (Vertical-Cavity Surface-Emitting Laser) Package With Low-Temperature Lead-Free (SnBi) Solder Joints
Open the PDF for Thermal-Mechanical Analysis of a Flip-Chip VCSEL (Vertical-Cavity Surface-Emitting Laser) Package With Low-Temperature Lead-Free (SnBi) Solder Joints in another window
Topics: Cavities, Failure analysis, Finishes, Flip-chip, Lasers, Low temperature, Solder joints
Journal Articles

Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards)

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John Lau, ASME Fellow, Walter Dauksher
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 96–105.
https://doi.org/10.1115/1.1846069
Published Online: June 3, 2005
View Articletitled, Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards)
Open the PDF for Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards) in another window
Topics: Ceramics, Creep, Cycles, Lead-free solders, Reliability, Solders, Temperature, Printed circuit boards, Fatigue, Weibull distribution
Journal Articles

Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards

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John Lau, Eric Schneider, Tom Baker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 1996, 118(2): 101–104.
https://doi.org/10.1115/1.2792127
Published Online: June 1, 1996
View Articletitled, Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards
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Topics: Copper, Flip-chip, Flip-chip devices, Lumber, Shock (Mechanics), Solders, Vibration, Vibration tests, Epoxy adhesives, Epoxy resins
Journal Articles

Advantages and Disadvantages of Thin Small Outline Packages (TSOP) With Copper Gull-Wing Leads

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John Lau, Suresh Golwalkar, Steve Erasmus
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 1994, 116(3): 234–237.
https://doi.org/10.1115/1.2905691
Published Online: September 1, 1994
View Articletitled, Advantages and Disadvantages of Thin Small Outline Packages (TSOP) With Copper Gull-Wing Leads
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Topics: Copper, Wings, Alloys, Manufacturing, Solder joints, Stress
Journal Articles

Reliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints Under Bending, Twisting, and Thermal Conditions

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John Lau, Steve Erasmus
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 322–328.
https://doi.org/10.1115/1.2909335
Published Online: September 1, 1993
View Articletitled, Reliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints Under Bending, Twisting, and Thermal Conditions
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Topics: Reliability, Solder joints, Corners (Structural elements), Fatigue, Fatigue life, Finite element methods, Solders, Stress, Thermal stresses
Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

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Donald Barker, Hans Conrad, Peter Engel, Tai-Ran Hsu, John Lau, Yi-Hsin Pao, Anthony Rafanelli, Harvey Solomon, Donald Stone, Frank Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 1993, 115(2): 139–140.
https://doi.org/10.1115/1.2909308
Published Online: June 1, 1993
View Articletitled, Special Issue on Mechanics of Surface Mount Assemblies
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Topics: Surface mount assemblies