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Proceedings Papers

Effects of Image Uncertainty on Blood Flow Simulation

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Huiru Li, Huidan Yu, Jie Wei, Xiaoping Du
Proc. ASME. IDETC-CIE2024, Volume 3B: 50th Design Automation Conference (DAC), V03BT03A037, August 25–28, 2024
Publisher: American Society of Mechanical Engineers
Paper No: DETC2024-141625
https://doi.org/10.1115/DETC2024-141625
View Paper titled, Effects of Image Uncertainty on Blood Flow Simulation
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Topics: Blood flow, Computational fluid dynamics, Shapes, Simulation, Uncertainty, Image segmentation, Flow (Dynamics), Pressure, Vessels, Blood vessels
Journal Articles

Transient Tip Clearance Prediction Model Considering Transient Radial Temperature Distribution of Discs in a Gas Turbine Engine

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Jie Wei, Heli Yang, Pengbo Zheng, Baotong Wang, Xinqian Zheng
Journal: Journal of Turbomachinery
Publisher: ASME
Article Type: Research Papers
J. Turbomach. April 2024, 146(4): 041012.
Paper No: TURBO-23-1264
https://doi.org/10.1115/1.4064222
Published Online: December 21, 2023
View Articletitled, Transient Tip Clearance Prediction Model Considering Transient Radial Temperature Distribution of Discs in a Gas Turbine Engine
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Topics: Blades, Clearances (Engineering), Deformation, Disks, Temperature, Transients (Dynamics), Heat transfer, Thermal deformation, Gas turbines, Temperature distribution
Proceedings Papers

Transient Tip Clearance Prediction Model Considering Transient Radial Temperature Distribution of Discs in a Gas Turbine Engine

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Jie Wei, Heli Yang, Pengbo Zheng, Baotong Wang, Xinqian Zheng
Proc. ASME. GT2023, Volume 11A: Structures and Dynamics — Aerodynamics Excitation and Damping; Bearing and Seal Dynamics, V11AT22A027, June 26–30, 2023
Publisher: American Society of Mechanical Engineers
Paper No: GT2023-103522
https://doi.org/10.1115/GT2023-103522
View Paper titled, Transient Tip Clearance Prediction Model Considering Transient Radial Temperature Distribution of Discs in a Gas Turbine Engine
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Topics: Clearances (Engineering), Disks, Fluids, Gas turbines, Temperature distribution, Transient heat transfer, Transients (Dynamics)
Journal Articles

Effects of Soil Conditioning on Tool Wear for Earth Pressure Balance Shield Tunneling in Sandy Gravel Based on Laboratory Test

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Ying-Jie Wei, Yu-You Yang, Tong Qiu
Journal: Journal of Testing and Evaluation
Publisher: ASTM International
Article Type: Technical Papers
J. Test. Eval.. July 2021, 49(4): 2692–2706.
Paper No: JTE20180851
https://doi.org/10.1520/JTE20180851
Published Online: September 24, 2019
View Articletitled, Effects of Soil Conditioning on Tool Wear for Earth Pressure Balance Shield Tunneling in Sandy Gravel Based on Laboratory Test
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Journal Articles

Evaluation of Cutting Tool Wear of Earth Pressure Balance Shield in Granular Soil Based on Laboratory Test

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Ying-jie Wei, Xiao Zheng, Fei Su, Ming-ming Li, Fan Li, Yu-you Yang
Journal: Journal of Testing and Evaluation
Publisher: ASTM International
Article Type: Technical Papers
J. Test. Eval.. February 2019, 47(2): 927–941.
Paper No: JTE20180402
https://doi.org/10.1520/JTE20180402
Published Online: February 13, 2019
View Articletitled, Evaluation of Cutting Tool Wear of Earth Pressure Balance Shield in Granular Soil Based on Laboratory Test
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Proceedings Papers

Investigation of Vaned Diffuser Splitters on the Performance and Flow Control of High Pressure Ratio Centrifugal Compressors

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Xiao He, Xinqian Zheng, Jie Wei, Hanxuan Zeng
Proc. ASME. GT2016, Volume 2D: Turbomachinery, V02DT42A008, June 13–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: GT2016-56255
https://doi.org/10.1115/GT2016-56255
View Paper titled, Investigation of Vaned Diffuser Splitters on the Performance and Flow Control of High Pressure Ratio Centrifugal Compressors
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Topics: Compressors, Diffusers, Flow control, High pressure (Physics), Shock (Mechanics), Flow separation, Chords (Trusses), Flow (Dynamics), Pressure, Design
Proceedings Papers

Hybrid Cooling Technology for Large-Scale Computing Systems: From Back to the Future

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Jie Wei
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 107-111, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52045
https://doi.org/10.1115/IPACK2011-52045
View Paper titled, Hybrid Cooling Technology for Large-Scale Computing Systems: From Back to the Future
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Topics: Cooling, Water, Convection, Architecture, Cooling systems, Design, Energy consumption, Flow (Dynamics), Low temperature, Maintainability
Proceedings Papers

Design of the Moderator and Cryogenic System for Generating Cold-Neutrons at the CPHS

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Qixi Feng, Quanke Feng, Bin Zhong, Tianjiao Liang, Takeshi Kawai, Jie Wei, C.-K. Loong
Proc. ASME. ICONE18, 18th International Conference on Nuclear Engineering: Volume 3, 171-173, May 17–21, 2010
Publisher: American Society of Mechanical Engineers
Paper No: ICONE18-29492
https://doi.org/10.1115/ICONE18-29492
View Paper titled, Design of the Moderator and Cryogenic System for Generating Cold-Neutrons at the CPHS
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Topics: Design, Neutrons, Neutron sources, Hadrons, Materials characterization, Methane, Neutron diffraction, Optimization, Proton beams, Resolution (Optics)
Proceedings Papers

Challenges in Package Cooling of High Performance Servers

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Jie Wei
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 501-507, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33637
https://doi.org/10.1115/IPACK2007-33637
View Paper titled, Challenges in Package Cooling of High Performance Servers
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Topics: Cooling, Composite materials, Energy dissipation, Heat, Thermal conductivity, Density, Diamonds, Flat heat pipes, Heat conduction, Heat pipes
Proceedings Papers

Monitoring Acoustic Noise in Steel Pipelines

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Dieter Meinert, Michael Gorny, Ansgar Pollmann, Jie-Wei Chen, Andrea Garbi
Proc. ASME. IPC2008, 2008 7th International Pipeline Conference, Volume 1, 509-516, September 29–October 3, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IPC2008-64115
https://doi.org/10.1115/IPC2008-64115
View Paper titled, Monitoring Acoustic Noise in Steel Pipelines
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Topics: Acoustics, Noise (Sound), Pipelines, Steel, Damage, Inspection, Pipes, Sensors
Proceedings Papers

Assessing Capabilities and Limitations of Air- and Liquid-Cooling for Low Profile Servers

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Albert Chan, Jie Wei
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 445-450, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73293
https://doi.org/10.1115/IPACK2005-73293
View Paper titled, Assessing Capabilities and Limitations of Air- and Liquid-Cooling for Low Profile Servers
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Topics: Cooling
Proceedings Papers

Thermal Management of Fujitsu High-End Unix Servers

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Jie Wei, Masahiro Suzuki
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 469-475, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73313
https://doi.org/10.1115/IPACK2005-73313
View Paper titled, Thermal Management of Fujitsu High-End Unix Servers
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Topics: Computers, Cooling, Thermal management
Proceedings Papers

Thermal Design and Packaging of a Prototype Refrigeration Cooling System for CMOS-Based MCMs

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Jie Wei, Hideo Kubo, Junichi Ishimine
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 351-356, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35156
https://doi.org/10.1115/IPACK2003-35156
View Paper titled, Thermal Design and Packaging of a Prototype Refrigeration Cooling System for CMOS-Based MCMs
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Topics: Complementary metal oxide semiconductors, Cooling, Cooling systems, Design, Engineering prototypes, Low temperature, Packaging, Refrigeration
Proceedings Papers

Study on Alternative Cooling Methods Beyond Next Generation Microprocessors

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Albert Chan, Jie Wei
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 97-102, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35041
https://doi.org/10.1115/IPACK2003-35041
View Paper titled, Study on Alternative Cooling Methods Beyond Next Generation Microprocessors
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Topics: Cooling, Heat sinks, Refrigeration