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Hironori Tohmyoh
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Proceedings Papers

Materials Evaluation and Environmental Monitoring Utilizing an Acoustic Resonance

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Hironori Tohmyoh
Proc. ASME. LEMP2020, JSME 2020 Conference on Leading Edge Manufacturing/Materials and Processing, V001T07A003, September 3, 2020
Publisher: American Society of Mechanical Engineers
Paper No: LEMP2020-8503
https://doi.org/10.1115/LEMP2020-8503
View Paper titled, Materials Evaluation and Environmental Monitoring Utilizing an Acoustic Resonance
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Topics: Acoustics, Polymer films, Reflectance, Resonance, Ultrasound, Reflection, Water, Acoustical properties, Density, Temperature
Journal Articles

Determination of the Structural Elasticity of Human Fingernails by Bending Test and Comparison With the Structural Elasticity of Human Hair

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Hironori Tohmyoh, Daiki Taniguchi
Journal: Journal of Engineering and Science in Medical Diagnostics and Therapy
Publisher: ASME
Article Type: Research-Article
ASME J of Medical Diagnostics. August 2019, 2(3): 031001.
Paper No: JESMDT-18-1059
https://doi.org/10.1115/1.4042926
Published Online: April 1, 2019
View Articletitled, Determination of the Structural Elasticity of Human Fingernails by Bending Test and Comparison With the Structural Elasticity of Human Hair
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Journal Articles

Trial for Monitoring the Water Temperature Utilizing the Frequency Dependence of Reflection Coefficient of Ultrasound Passing Through Thin Layer

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Hironori Tohmyoh, Shu Terashima
Journal: Journal of Nondestructive Evaluation, Diagnostics and Prognostics of Engineering Systems
Publisher: ASME
Article Type: Research-Article
ASME J Nondestructive Evaluation. May 2019, 2(2): 021001.
Paper No: NDE-18-1030
https://doi.org/10.1115/1.4042871
Published Online: March 25, 2019
View Articletitled, Trial for Monitoring the Water Temperature Utilizing the Frequency Dependence of Reflection Coefficient of Ultrasound Passing Through Thin Layer
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Topics: Acoustics, Reflectance, Temperature, Thin films, Ultrasound, Water, Water temperature, Reflection, Echoes, Resonance
Journal Articles

Detection of an Electromotive Force during Resistance Spot Welding and Its Correlation with Nugget Growth

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Hironori Tohmyoh, Yuta Hasegawa, Yoichi Matsui
Journal: Journal of Testing and Evaluation
Publisher: ASTM International
Article Type: Technical Papers
J. Test. Eval.. November 2019, 47(6): 4239–4248.
Paper No: JTE20180384
https://doi.org/10.1520/JTE20180384
Published Online: February 15, 2019
View Articletitled, Detection of an Electromotive Force during Resistance Spot Welding and Its Correlation with Nugget Growth
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Journal Articles

Joule Heat Welding of Thin Platinum and Tungsten Wires and the Thermoelectric Effects Around Bi-Metal Junctions

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Hironori Tohmyoh, Tomochika Tanaka, Masato Fujimori, Masumi Saka
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Technical Briefs
J. Micro Nano-Manuf. June 2013, 1(2): 024501.
Paper No: JMNM-12-1009
https://doi.org/10.1115/1.4024082
Published Online: April 17, 2013
View Articletitled, Joule Heat Welding of Thin Platinum and Tungsten Wires and the Thermoelectric Effects Around Bi-Metal Junctions
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Topics: Heat, Joules, Junctions, Metals, Temperature, Thermoelectricity, Welding, Wire, Circuits, Platinum
Proceedings Papers

Joule Heat Welding of Thin Metallic Wires and Thermoelectric Effects Around Dissimilar Metal Weld

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Hironori Tohmyoh, Tomochika Tanaka, Masato Fujimori, Masumi Saka
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 709-712, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52071
https://doi.org/10.1115/IPACK2011-52071
View Paper titled, Joule Heat Welding of Thin Metallic Wires and Thermoelectric Effects Around Dissimilar Metal Weld
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Topics: Heat, Joules, Metals, Thermoelectricity, Welding, Wire, Temperature, Circuits, Electrodes
Proceedings Papers

Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-Free Solder Bump

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Shoho Ishikawa, Hironori Tohmyoh, Masumi Saka, Satoshi Watanabe, Motohisa Kuroha, Yoshikatsu Nakano
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 207-211, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52112
https://doi.org/10.1115/IPACK2011-52112
View Paper titled, Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-Free Solder Bump
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Topics: Fatigue life, Lead-free solders, Electronic components, Electronic packages, Electronic products, Fatigue, Fatigue damage, Fatigue failure, Finite element analysis, Reliability
Proceedings Papers

High Performance Flip Chip Package With Higher Mountability and Longer Interconnect Life

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Satoru Katsurayama, Hironori Tohmyoh, Masumi Saka
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 749-753, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89148
https://doi.org/10.1115/InterPACK2009-89148
View Paper titled, High Performance Flip Chip Package With Higher Mountability and Longer Interconnect Life
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Topics: Flip-chip packages, Warping, Reliability, Cycles, Manufacturing, Stress
Proceedings Papers

Manipulation of Thin Metallic Wires by Joule Heat Joining

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Hironori Tohmyoh, Hironao Takeda, M. A. Salam Akanda, Masumi Saka
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 563-567, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89122
https://doi.org/10.1115/InterPACK2009-89122
View Paper titled, Manipulation of Thin Metallic Wires by Joule Heat Joining
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Topics: Heat, Joining, Joules, Wire, Electrical properties, Electrodes, Electromagnetic actuators, Heating, Microelectromechanical systems, Nanoelectromechanical systems
Proceedings Papers

Reliability Analysis of Solderless Press-Fit Interconnections

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Hironori Tohmyoh, Kiichiro Yamanobe, Masumi Saka, Jiro Utsunomiya, Takeshi Nakamura, Yoshikatsu Nakano
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 611-615, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33264
https://doi.org/10.1115/IPACK2007-33264
View Paper titled, Reliability Analysis of Solderless Press-Fit Interconnections
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Topics: Event history analysis, Press fits, Manufacturing, Stress, Friction, Printed circuit boards, Damage, Displacement, Failure, Finite element analysis
Journal Articles

Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability

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Satoru Katsurayama, Hironori Tohmyoh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031005.
https://doi.org/10.1115/1.3144153
Published Online: June 23, 2009
View Articletitled, Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability
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Topics: Flip-chip packages, Hardening (Curing), Manufacturing, Reliability, Temperature, Warping, Flow (Dynamics), Flip-chip devices
Proceedings Papers

Acoustic Microscopy for Micro Electrical Interconnections

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Hironori Tohmyoh, Tsuyoshi Akaogi, Masumi Saka
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1689-1693, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73061
https://doi.org/10.1115/IPACK2005-73061
View Paper titled, Acoustic Microscopy for Micro Electrical Interconnections
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Topics: Acoustics, Microscopy, Design, Printed circuit boards, Silicon chips
Proceedings Papers

A High-Resolution Dry-Contact Acoustic Imaging of the Solder Joints for Ball Grid Array Assembly

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Hironori Tohmyoh, Masumi Saka
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 817-822, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35228
https://doi.org/10.1115/IPACK2003-35228
View Paper titled, A High-Resolution Dry-Contact Acoustic Imaging of the Solder Joints for Ball Grid Array Assembly
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Topics: Acoustics, Ball-Grid-Array packaging, Imaging, Manufacturing, Resolution (Optics), Solder joints, Microscopy, Ultrasound, Semiconductor wafers, Signals
Journal Articles

Analysis of Solderless Press-Fit Interconnections During the Assembly Process

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Hironori Tohmyoh, Kiichiro Yamanobe, Masumi Saka, Jiro Utsunomiya, Takeshi Nakamura, Yoshikatsu Nakano
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031007.
https://doi.org/10.1115/1.2957330
Published Online: July 30, 2008
View Articletitled, Analysis of Solderless Press-Fit Interconnections During the Assembly Process
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Topics: Finite element analysis, Manufacturing, Pins (Engineering), Press fits, Stress, Friction
Journal Articles

Thermal Opening Technique for Nondestructive Evaluation of Closed Cracks

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Hironori Tohmyoh, Masumi Saka, Yuichi Kondo
Journal: Journal of Pressure Vessel Technology
Publisher: ASME
Article Type: Research Papers
J. Pressure Vessel Technol. February 2007, 129(1): 103–108.
https://doi.org/10.1115/1.2389026
Published Online: April 11, 2006
View Articletitled, Thermal Opening Technique for Nondestructive Evaluation of Closed Cracks
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Topics: Electromagnetic scattering, Fracture (Materials), Radiation scattering, Scattering (Physics), Thermal stresses, Waves, Nondestructive evaluation, Signals