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H. Conrad
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Proceedings Papers

Influence of the Conductivity of the Oil on the Electrorheology of Zeolite/Mineral Oil Suspensions

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C. W. Wu, Y. Chen, H. Conrad
Proc. ASME. IMECE96, Rheology and Fluid Mechanics of Nonlinear Materials, 267-275, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0250
https://doi.org/10.1115/IMECE1996-0250
View Paper titled, Influence of the Conductivity of the Oil on the Electrorheology of Zeolite/Mineral Oil Suspensions
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Topics: Electrical conductivity, Electrorheological fluids, Mineral oil, Thermal conductivity, Current density, Oils, Petroleum, Electric fields, Heat conduction, Heating
Proceedings Papers

Theoretical and Experimental Considerations of Electrorheology With DC and AC Fields

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C. W. Wu, H. Conrad
Proc. ASME. IMECE97, Rheology and Fluid Mechanics of Nonlinear Materials, 185-196, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0486
https://doi.org/10.1115/IMECE1997-0486
View Paper titled, Theoretical and Experimental Considerations of Electrorheology With DC and AC Fields
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Topics: Electrorheological fluids, Particulate matter, Current density, Design, Electrical conductivity, Fluids, Shear (Mechanics), Thermal conductivity, Thin films, Yield strength
Journal Articles

Wetting Kinetics of Molten 60Sn40Pb on a Ag-0.33 wt.% Pt Thick Film Conductor

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J. Campbell, H. Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 241–245.
https://doi.org/10.1115/1.2792099
Published Online: September 1, 1995
View Articletitled, Wetting Kinetics of Molten 60Sn40Pb on a Ag-0.33 wt.% Pt Thick Film Conductor
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Topics: Thick films, Wetting, Temperature, Tin, Alloys, Atoms, Diffusion (Physics), Intermetallic compounds, Solders
Journal Articles

Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints

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Z. Guo, Yi-Hsin Pao, H. Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 100–104.
https://doi.org/10.1115/1.2792074
Published Online: June 1, 1995
View Articletitled, Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints
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Topics: Deformation, Solder joints, Temperature, Shear rate, Shear stress, Creep, Diffusion (Physics), Dislocations, Grain size, High temperature
Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

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D. Barker, S. Burchett, H. Conrad, A. Dasgupta, P. Engel, J. Lau, Y. Pao, A. Rafanelli, R. Ross, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 1995, 117(2): 93.
https://doi.org/10.1115/1.2792086
Published Online: June 1, 1995
View Articletitled, Special Issue on Mechanics of Surface Mount Assemblies
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Topics: Surface mount assemblies
Journal Articles

Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints

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Z. Guo, H. Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 159–164.
https://doi.org/10.1115/1.2909312
Published Online: June 1, 1993
View Articletitled, Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints
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Topics: Fatigue cracks, Solder joints, Shear (Mechanics), Solders, Intermetallic compounds, Metals, Preferences, Temperature
Journal Articles

Computer Simulation of Thermo-Mechanical Fatigue of Solder Joints Including Microstructure Coarsening

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P. Hacke, A. F. Sprecher, H. Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 153–158.
https://doi.org/10.1115/1.2909311
Published Online: June 1, 1993
View Articletitled, Computer Simulation of Thermo-Mechanical Fatigue of Solder Joints Including Microstructure Coarsening
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Topics: Computer simulation, Fatigue, Solder joints, Thermomechanics, Creep, Stress, Cycles, Damage, Failure, Fatigue life
eBook Chapter

Modeling of the Thermomechanical Fatigue of 63Sn-37Pb Alloy

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Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1993
https://doi.org/10.1520/STP24251S
ISBN-10: 0-8031-1871-6
ISBN: 978-0-8031-1871-3
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eBook Chapter

Metallography Applied to the Structure of Electrorheological (ER) Fluids

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Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1993
https://doi.org/10.1520/STP25114S
ISBN-10: 0-8031-1484-2
ISBN: 978-0-8031-1484-5
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Journal Articles

Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue

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Z. Guo, A. F. Sprecher, H. Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 112–117.
https://doi.org/10.1115/1.2906406
Published Online: June 1, 1992
View Articletitled, Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue
Open the PDF for Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue in another window
Topics: Deformation, Low cycle fatigue, Solder joints, Tin, Stress, Alloys, Dislocations, Shear (Mechanics)
eBook Chapter

Multiparticle Erosion of Pyrex Glass

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Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1979
https://doi.org/10.1520/STP35796S
ISBN-10: 0-8031-0334-4
ISBN: 978-0-8031-0334-4
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Journal Articles

The Fracture Toughness of Beryllium

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H Conrad, J Hurd, D Woodard
Journal: Journal of Testing and Evaluation
Publisher: ASTM International
Article Type: Research-Article
J. Test. Eval.. March 1973, 1(2): 88–99.
https://doi.org/10.1520/JTE10883J
Published Online: March 1, 1973
View Articletitled, The Fracture Toughness of Beryllium
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eBook Chapter
Book cover for Applications Related Phenomena in Titanium Alloys

Introduction

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Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1968
https://doi.org/10.1520/STP33616S
ISBN-10: 0-8031-0748-X
ISBN: 978-0-8031-0748-9
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eBook
Book cover for Applications Related Phenomena in Titanium Alloys

Applications Related Phenomena in Titanium Alloys

Available to Purchase

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1968
https://doi.org/10.1520/STP432-EB
ISBN-10: 0-8031-0748-X
ISBN: 978-0-8031-0748-9
eBook Chapter

3-2 Cold Welding in Copper in an Ultra-High Vacuum

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Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1967
https://doi.org/10.1520/STP45164S
ISBN-10: 0-8031-6182-4
ISBN: 978-0-8031-6182-5
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