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Gene T. Colwell
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Proceedings Papers

Prevention of Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets Cooled by Forced Air Convection in Cold Climates

Eric B. Zimmerman, Hisham Hegab, Gene T. Colwell
Proc. ASME. IMECE96, Application of CAE/CAD to Electronic Systems, 83-87, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1006
https://doi.org/10.1115/IMECE1996-1006
View Paper titled, Prevention of Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets Cooled by Forced Air Convection in Cold Climates
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Topics: Air flow, Axial flow, Cold climates, Computer simulation, Containers, Convection, Cooling, Cooling systems, Electronics, Fans
Proceedings Papers

Analysis of Soil Heat Exchangers for Thermal Management of Outdoor Electronic Cabinets

Hisham E. Hegab, Eric B. Zimmerman, Gene T. Colwell
Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 191-196, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0652
https://doi.org/10.1115/IMECE1998-0652
View Paper titled, Analysis of Soil Heat Exchangers for Thermal Management of Outdoor Electronic Cabinets
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Topics: Heat exchangers, Soil, Thermal management, Cooling, Electronics, Heat, Stress, Temperature, Transients (Dynamics), Computer simulation
Journal Articles

Thermal Management of Outdoor Electronic Cabinets Using Soil Heat Exchangers

Hisham E. Hegab, Assistant Professor,, Eric B. Zimmerman, Associate Professor,, Gene T. Colwell, Professor Emeritus,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 7–11.
https://doi.org/10.1115/1.1392320
Published Online: March 1, 2002
View Article titled, Thermal Management of Outdoor Electronic Cabinets Using Soil Heat Exchangers
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Topics: Computer simulation, Heat, Heat exchangers, Heat pipes, Soil, Stress, Temperature, Thermal management, Cooling systems, Transients (Dynamics)
Journal Articles

Transient Modeling of the Thermal Behavior of Outdoor Electronic Cabinets

Eric B. Zimmerman, Gene T. Colwell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 258–263.
https://doi.org/10.1115/1.2792161
Published Online: December 1, 1996
View Article titled, Transient Modeling of the Thermal Behavior of Outdoor Electronic Cabinets
Open the PDF for Transient Modeling of the Thermal Behavior of Outdoor Electronic Cabinets in another window
Topics: Modeling, Transients (Dynamics), Temperature, Computer simulation, Differential equations, Electronics, Runge-Kutta methods, Sensitivity analysis