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Proceedings Papers

Input Profiling for Injection Molding by Reinforcement Learning

Fan Wang, Shaoqiang Dong, Kourosh Danai, David O. Kazmer
Proc. ASME. IMECE2001, Dynamic Systems and Control, 701-708, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/DSC-24587
https://doi.org/10.1115/IMECE2001/DSC-24587
View Paper titled, Input Profiling for Injection Molding by Reinforcement Learning
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Topics: Injection molding, Reinforcement learning, Cycles, Feedback, Disks, Packing (Shipments), Packings (Cushioning), Pressure, Shapes, Simulation
Journal Articles

Fracture Toughness of Biological Composites With Multilevel Structural Hierarchy

Fan Wang, Kui Liu, Dechang Li, Baohua Ji
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. July 2020, 87(7): 071004.
Paper No: JAM-20-1134
https://doi.org/10.1115/1.4046845
Published Online: April 21, 2020
View Article titled, Fracture Toughness of Biological Composites With Multilevel Structural Hierarchy
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Topics: Composite materials, Fracture (Materials), Fracture toughness, Deformation
Journal Articles

Study on the Application of Ultrasonic Wave in Foundation Settlement Monitoring

Le-fan Wang, Xing-zhong Weng, Ye Li, Bo-wen Guan, Zhi-hua Yao, Qu Bo
Journal: Geotechnical Testing Journal
Publisher: ASTM International
Article Type: Technical Papers
Geotech. Test. J.. March 2019, 42(2): 365–384.
Paper No: GTJ20170296
https://doi.org/10.1520/GTJ20170296
Published Online: February 12, 2019
View Article titled, Study on the Application of Ultrasonic Wave in Foundation Settlement Monitoring
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Proceedings Papers

Experimental Investigation on Boiling Flow Characteristics Under Passive IVR-ERVC Conditions

Fan Wang, Bo Kuang, Pengfei Liu, Longkun He
Proc. ASME. ICONE26, Volume 6B: Thermal-Hydraulics and Safety Analyses, V06BT08A045, July 22–26, 2018
Publisher: American Society of Mechanical Engineers
Paper No: ICONE26-82254
https://doi.org/10.1115/ICONE26-82254
View Paper titled, Experimental Investigation on Boiling Flow Characteristics Under Passive IVR-ERVC Conditions
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Topics: Boiling, Flow (Dynamics), Cooling, Reactor vessels, Oscillations, Accidents, Critical heat flux, Heat, Pressurized water reactors, Test facilities
Proceedings Papers

Study of a Bionic Anti-Erosion Blade in a Double Suction Centrifugal Pump

Zhongdong Qian, Jing Dong, Zhiwei Guo, Zhiyuan Wang, Fan Wang
Proc. ASME. FEDSM2016, Volume 1A, Symposia: Turbomachinery Flow Simulation and Optimization; Applications in CFD; Bio-Inspired and Bio-Medical Fluid Mechanics; CFD Verification and Validation; Development and Applications of Immersed Boundary Methods; DNS, LES and Hybrid RANS/LES Methods; Fluid Machinery; Fluid-Structure Interaction and Flow-Induced Noise in Industrial Applications; Flow Applications in Aerospace; Active Fluid Dynamics and Flow Control — Theory, Experiments and Implementation, V01AT09A007, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: FEDSM2016-7627
https://doi.org/10.1115/FEDSM2016-7627
View Paper titled, Study of a Bionic Anti-Erosion Blade in a Double Suction Centrifugal Pump
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Topics: Bionics, Blades, Centrifugal pumps, Erosion, Suction, Domes (Structural elements), Pumps, Pressure
Proceedings Papers

An Innovative Way to Solve Problems Associated With Circular Connector Electrical Bonding Resistance

Frank Fan Wang
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73029
https://doi.org/10.1115/IPACK2013-73029
View Paper titled, An Innovative Way to Solve Problems Associated With Circular Connector Electrical Bonding Resistance
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Topics: Bonding, Aluminum, Aerospace industry, Electronic equipment, Military systems
Proceedings Papers

Liquid Cooled High Power Aerospace Electronics Fluid Channel Layout Design Strategy Based on Analytical Calculation

Frank Fan Wang
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A047, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73262
https://doi.org/10.1115/IPACK2013-73262
View Paper titled, Liquid Cooled High Power Aerospace Electronics Fluid Channel Layout Design Strategy Based on Analytical Calculation
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Topics: Aerospace industry, Design, Electronics, Fluids, Cooling, Computational fluid dynamics, Computer software, Pressure drop, Computers, Dimensions
eBook Chapter

The Exploration on Optimize the Access Performance of University's Web Portal

Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2011
ISBN: 9780791859919
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Topics: Gates (Closures)
Proceedings Papers

Force Air Cooled Electronic Equipment Under Loss of Cooling Condition With Blocked Air Duct

Frank Fan Wang
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 211-216, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33070
https://doi.org/10.1115/IPACK2007-33070
View Paper titled, Force Air Cooled Electronic Equipment Under Loss of Cooling Condition With Blocked Air Duct
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Topics: Cooling, Ducts, Electronic equipment, Design, Aerospace industry, Air flow, Buoyancy, Computational fluid dynamics, Electronics, Failure
Proceedings Papers

Study of Printed Circuit Board Shock Transmissibility

Frank Fan Wang
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 151-155, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33074
https://doi.org/10.1115/IPACK2007-33074
View Paper titled, Study of Printed Circuit Board Shock Transmissibility
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Topics: Printed circuit boards, Shock (Mechanics), Stress, Deflection, Resonance, Electronics, Excitation
Proceedings Papers

Reduce Vibration Analysis Errors With Precise Weight Predictions

Frank Fan Wang
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1075-1081, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73004
https://doi.org/10.1115/IPACK2005-73004
View Paper titled, Reduce Vibration Analysis Errors With Precise Weight Predictions
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Topics: Errors, Vibration analysis, Weight (Mass), Design, Finite element analysis, Computers, Electronics, Modeling, Testing, Avionics
Proceedings Papers

Comparing Shock, Random and Sine Vibration Loads of the Electronic Equipment

Frank Fan Wang
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1083-1088, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73005
https://doi.org/10.1115/IPACK2005-73005
View Paper titled, Comparing Shock, Random and Sine Vibration Loads of the Electronic Equipment
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Topics: Electronic equipment, Shock (Mechanics), Stress, Vibration, Resonance, Damage, Excitation, Random vibration, Spectral energy distribution, Waves
Proceedings Papers

Numerical Simulation for Rough Contact Incorporating Plastic Deformation

Fan Wang, Leon M. Keer
Proc. ASME. WTC2005, World Tribology Congress III, Volume 1, 253-254, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63307
https://doi.org/10.1115/WTC2005-63307
View Paper titled, Numerical Simulation for Rough Contact Incorporating Plastic Deformation
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Topics: Computer simulation, Deformation, Surface roughness, Pressure, Deflection, Hardening, Simulation, Stress
Proceedings Papers

Physics-of-Failure HALT Result Assessment

Frank Fan Wang, Clyde Jelinek, Jr., Mary Davis
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 57-62, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41089
https://doi.org/10.1115/IMECE2003-41089
View Paper titled, Physics-of-Failure HALT Result Assessment
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Topics: Failure, Physics, Design, Testing, Life testing, Mechanical properties, Product development
Journal Articles

Three-Dimensional Repeated Elasto-Plastic Point Contacts, Rolling, and Sliding

W. Wayne Chen, Q. Jane Wang, Fan Wang, Leon M. Keer, Jian Cao
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. March 2008, 75(2): 021021.
https://doi.org/10.1115/1.2755171
Published Online: February 27, 2008
View Article titled, Three-Dimensional Repeated Elasto-Plastic Point Contacts, Rolling, and Sliding
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Topics: Deformation, Hardening, Kinematics, Stress, Shear (Mechanics), Friction, Displacement, Work hardening
Proceedings Papers

Numerical Simulation and Analysis for 3D Elastic-Plastic Rough Contacts

Fan Wang, Leon M. Keer, Q. Jane Wang
Proc. ASME. IMECE2006, Tribology, 125-134, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-14663
https://doi.org/10.1115/IMECE2006-14663
View Paper titled, Numerical Simulation and Analysis for 3D Elastic-Plastic Rough Contacts
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Topics: Computer simulation, Surface roughness, Deflection, Deformation, Hardening, Polishing, Pressure, Residual stresses, Simulation, Stress
Journal Articles

Numerical Simulation for Three Dimensional Elastic-Plastic Contact with Hardening Behavior

Fan Wang, Leon M. Keer
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. July 2005, 127(3): 494–502.
https://doi.org/10.1115/1.1924573
Published Online: March 24, 2005
View Article titled, Numerical Simulation for Three Dimensional Elastic-Plastic Contact with Hardening Behavior
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Topics: Computation, Hardening, Pressure, Stress, Deformation, Computer simulation, Fast Fourier transforms