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Ercan M. Dede
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Journal Articles

Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics

Open Access
Ercan M. Dede, Feng Zhou, Yuqing Zhou, Danny J. Lohan, Mehdi Asheghi, Kenneth E. Goodson, Kris Erickson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021009.
Paper No: EP-24-1066
https://doi.org/10.1115/1.4067649
Published Online: February 20, 2025
View Articletitled, Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics
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Topics: Additive manufacturing, Ceramics, Design, Electronics, Heat sinks, Manifolds, Manufacturing, Metals, Polymers, Cooling
Proceedings Papers

Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opal (NiIOs) Structures

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Kaiying Jiang, Daeyoung Kong, Sreekant Narumanchi, James Palko, Ercan M. Dede, Chulmin Ahn, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A017, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141329
https://doi.org/10.1115/IPACK2024-141329
View Paper titled, Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opal (NiIOs) Structures
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Topics: Boiling, Copper, Corrosion, Erosion, Nickel
Proceedings Papers

Scalable Large-Area Two-Phase Capillary-Enhanced Micro-Cooler Using Silicon Microchannel Fin Array With 3D Silicon Manifold for High-Heat-Flux Electronics Cooling Application

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Heungdong Kwon, Daeyoung Kong, Hyoungsoon Lee, James Palko, Ercan M. Dede, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140613
https://doi.org/10.1115/IPACK2024-140613
View Paper titled, Scalable Large-Area Two-Phase Capillary-Enhanced Micro-Cooler Using Silicon Microchannel Fin Array With 3D Silicon Manifold for High-Heat-Flux Electronics Cooling Application
Open the PDF for Scalable Large-Area Two-Phase Capillary-Enhanced Micro-Cooler Using Silicon Microchannel Fin Array With 3D Silicon Manifold for High-Heat-Flux Electronics Cooling Application in another window
Topics: Boiling, Computer cooling, Flow (Dynamics), Heat, Manifolds, Microchannels, Microcoolers, Silicon
Journal Articles

Solid-State LiDAR With Optimized Dynamic Beam Power Intensity for Reduced Thermal Load

Open Access
Danny J. Lohan, Ercan M. Dede, Paul Schmalenberg
Journal: ASME Open Journal of Engineering
Publisher: ASME
Article Type: Research Papers
ASME Open J. Engineering. January 2024, 3: 031021.
Paper No: AOJE-24-1062
https://doi.org/10.1115/1.4065898
Published Online: July 25, 2024
View Articletitled, Solid-State LiDAR With Optimized Dynamic Beam Power Intensity for Reduced Thermal Load
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Topics: Lasers, Lidar, Optoelectronic devices, Temperature, Thermal loads, Light sources, Sensors, Thermal management, Heat
Journal Articles

Thermal Performance of a Pump-Assisted Capillary Loop Cooler

Open Access
Danny J. Lohan, Bhaskarjyoti Sarma, Shailesh N. Joshi, Ercan M. Dede, Anali Soto, Srivathsan Sudhakar, Justin A. Weibel
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2024, 16(9): 091006.
Paper No: TSEA-23-1499
https://doi.org/10.1115/1.4065619
Published Online: June 13, 2024
View Articletitled, Thermal Performance of a Pump-Assisted Capillary Loop Cooler
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Topics: Design, Flow (Dynamics), Heat, Heat flux, Heat losses, Heat transfer, Pressure drop, Pumps, Temperature, Valves
Proceedings Papers

Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments

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Bidzina Kekelia, Qianying Wu, Sreekant Narumanchi, Joshua Major, Gilbert Moreno, Mehdi Asheghi, Ercan M. Dede, James Palko, Kenneth Goodson
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113781
https://doi.org/10.1115/IPACK2023-113781
View Paper titled, Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments
Open the PDF for Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments in another window
Topics: Copper, Critical heat flux, Data centers, Heat, Heat transfer, Microcoolers, Pool boiling, Refrigerants, Reliability
Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

Available to Purchase
Ki Wook Jung, Eunho Cho, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031117.
Paper No: EP-20-1030
https://doi.org/10.1115/1.4047846
Published Online: August 17, 2020
View Articletitled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa
Open the PDF for Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa in another window
Topics: Flow (Dynamics), Fluids, Heat, Heat flux, Manifolds, Microchannels, Pressure drop, Temperature, Uncertainty, Cooling
Journal Articles

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Open Access
Jae Choon Kim, Zongqing Ren, Anil Yuksel, Ercan M. Dede, Prabhakar R. Bandaru, Dan Oh, Jaeho Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2021, 143(1): 010801.
Paper No: EP-20-1051
https://doi.org/10.1115/1.4047414
Published Online: June 29, 2020
View Articletitled, Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging
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Topics: Heat, Metamaterials, Thermal management, Cooling, Temperature, Thermal conductivity, Electronic packaging, Design, Packaging, Anisotropy
Proceedings Papers

Experimental Investigation of Single-Phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger With R-245fa

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Ki Wook Jung, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6400
https://doi.org/10.1115/IPACK2019-6400
View Paper titled, Experimental Investigation of Single-Phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger With R-245fa
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Topics: Cooling, Heat exchangers, Manifolds, Microchannels
Journal Articles

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

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Yanghe Liu, Shailesh N. Joshi, Ercan M. Dede
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011003.
Paper No: EP-19-1014
https://doi.org/10.1115/1.4044476
Published Online: September 19, 2019
View Articletitled, Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems
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Topics: Bonding, Electronics, High temperature, Manufacturing, Stress, Tension-leg platforms, Thermal stresses, Tin, Transients (Dynamics), Temperature
Journal Articles

Two-Phase Performance of a Hybrid Jet Plus Multipass Microchannel Heat Sink

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Shailesh N. Joshi, Danny J. Lohan, Ercan M. Dede
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. February 2020, 12(1): 011019.
Paper No: TSEA-18-1466
https://doi.org/10.1115/1.4044347
Published Online: September 7, 2019
View Articletitled, Two-Phase Performance of a Hybrid Jet Plus Multipass Microchannel Heat Sink
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Topics: Boiling, Flow (Dynamics), Heat flux, Heat sinks, Heat transfer, Heat transfer coefficients, Microchannels, Pressure drop, Temperature, Pressure
Journal Articles

Design, Fabrication, and Performance Evaluation of a Hybrid Wick Vapor Chamber

Free
Feng Zhou, Yanghe Liu, Ercan M. Dede
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. August 2019, 141(8): 081802.
Paper No: HT-18-1761
https://doi.org/10.1115/1.4043797
Published Online: June 12, 2019
View Articletitled, Design, Fabrication, and Performance Evaluation of a Hybrid Wick Vapor Chamber
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Topics: Design, Heat flux, Vapors, Thermal resistance, Temperature, Heat, Cooling, Flat heat pipes
Journal Articles

Special Issue on InterPACK 2018

Free
Ercan M. Dede, Lauren Boteler, Changqing Chen, Przemyslaw Jakub Gromala, Benjamin Leever, Wei Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. September 2019, 141(3): 030301.
Paper No: EP-19-1036
https://doi.org/10.1115/1.4043484
Published Online: May 8, 2019
View Articletitled, Special Issue on InterPACK 2018
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Topics: Electronic packaging, Electronics, Microelectromechanical systems, Design, Internet of things, Condition monitoring, Data centers, Electric vehicles, Energy conversion, Engineering teachers
Journal Articles

Optimal Design of Three-Dimensional Heat Flow Structures for Power Electronics Applications

Available to Purchase
Ercan M. Dede, Yanghe Liu, Shailesh N. Joshi, Feng Zhou, Danny J. Lohan, Jong-Won Shin
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021011.
Paper No: TSEA-18-1001
https://doi.org/10.1115/1.4041440
Published Online: December 5, 2018
View Articletitled, Optimal Design of Three-Dimensional Heat Flow Structures for Power Electronics Applications
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Topics: Design, Flow (Dynamics), Gates (Closures), Heat, Optimization, Temperature, Electronics, Manufacturing
Journal Articles

Thermal Metamaterials for Heat Flow Control in Electronics

Available to Purchase
Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010904.
Paper No: EP-17-1093
https://doi.org/10.1115/1.4039020
Published Online: March 2, 2018
View Articletitled, Thermal Metamaterials for Heat Flow Control in Electronics
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Topics: Composite materials, Design, Electronics, Flow control, Heat, Heat flux, Metamaterials, Printed circuit boards, Temperature, Anisotropy
Proceedings Papers

Thermal Metamaterials for Heat Flow Control in Electronics

Available to Purchase

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74112
https://doi.org/10.1115/IPACK2017-74112
View Paper titled, Thermal Metamaterials for Heat Flow Control in Electronics
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Topics: Electronics, Flow control, Heat, Metamaterials, Flow (Dynamics), Anisotropy, Blocks (Building materials), Circuit design, Composite materials, Design
Proceedings Papers

Local-Scale Simulations of Nucleate Boiling on Micrometer-Featured Surfaces

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Hariswaran Sitaraman, Gilberto Moreno, Ercan M. Dede, Shailesh N. Joshi, Feng Zhou, Sreekant Narumanchi
Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T11A011, July 9–12, 2017
Publisher: American Society of Mechanical Engineers
Paper No: HT2017-4710
https://doi.org/10.1115/HT2017-4710
View Paper titled, Local-Scale Simulations of Nucleate Boiling on Micrometer-Featured Surfaces
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Topics: Engineering simulation, Nucleate boiling, Simulation, Cavities, Computational fluid dynamics, Nucleation (Physics), Bubbles, Buoyancy, Convection, Deformation
Proceedings Papers

Combined Lumped and Continuum Parameter Design Optimization of Electro-Thermal Systems.

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Danny J. Lohan, James T. Allison, Ercan M. Dede, Masanori Ishigaki
Proc. ASME. IDETC-CIE2016, Volume 2B: 42nd Design Automation Conference, V02BT03A013, August 21–24, 2016
Publisher: American Society of Mechanical Engineers
Paper No: DETC2016-60218
https://doi.org/10.1115/DETC2016-60218
View Paper titled, Combined Lumped and Continuum Parameter Design Optimization of Electro-Thermal Systems.
Open the PDF for Combined Lumped and Continuum Parameter Design Optimization of Electro-Thermal Systems. in another window
Topics: Design, Optimization, Circuits, Circuit design, Damping, Electrical components, Electronics, Energy gap, Flat heat pipes, Semiconductors (Materials)
Journal Articles

Modular Design for a Single-Phase Manifold Mini/Microchannel Cold Plate

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Feng Zhou, Yan Liu, Yanghe Liu, Shailesh N. Joshi, Ercan M. Dede
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. June 2016, 8(2): 021010.
Paper No: TSEA-15-1162
https://doi.org/10.1115/1.4031932
Published Online: December 8, 2015
View Articletitled, Modular Design for a Single-Phase Manifold Mini/Microchannel Cold Plate
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Topics: Coolants, Design, Flow (Dynamics), Heat sinks, Manifolds, Microchannels, Pressure drop, Cooling, Temperature
Proceedings Papers

Modular Flow Structure Design for a Single-Phase Manifold Microchannel Cold Plate

Available to Purchase

Feng Zhou, Yan Liu, Shailesh N. Joshi, Yanghe Liu, Ercan M. Dede
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A008, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48029
https://doi.org/10.1115/IPACK2015-48029
View Paper titled, Modular Flow Structure Design for a Single-Phase Manifold Microchannel Cold Plate
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Topics: Design, Flow (Dynamics), Manifolds, Microchannels, Cooling, Shapes, Coolants, Temperature, Channel flow, Computer cooling