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Proceedings Papers

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

M. Uschitsky, E. Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 141-170, November 16–21, 1997

Paper No: IMECE1997-0818

DOI: https://doi.org/10.1115/IMECE1997-0818

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Topics: Diffusion (Physics), Epoxy adhesives, Epoxy resins, Molding, Particulate matter, Fillers (Materials), Stress, Weight (Mass), Electronic packaging, Indium compounds

Proceedings Papers

Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure

M. Uschitsky, E. Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 33-54, November 16–21, 1997

Paper No: IMECE1997-0813

DOI: https://doi.org/10.1115/IMECE1997-0813

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Topics: Epoxy adhesives, Epoxy resins, Glass fibers, Stress, Fibers, Buckling, Delamination, Design, Metals, Optical fiber

Proceedings Papers

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, E. Suhir, G. W. Kammlott

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 171-206, November 16–21, 1997

Paper No: IMECE1997-0819

DOI: https://doi.org/10.1115/IMECE1997-0819

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Topics: Composite materials, Molding, Thermoelasticity, Fillers (Materials), Thermal stresses, Epoxy adhesives, Epoxy resins, Design, Integrated circuits, Reliability

Proceedings Papers

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

Y. Feng, V. R. Raju, E. Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 89-139, November 16–21, 1997

Paper No: IMECE1997-0817

DOI: https://doi.org/10.1115/IMECE1997-0817

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Topics: Failure, Adhesion, Fracture mechanics, Manufacturing, Mechanical behavior, Microelectronic devices, Modeling, Molding, Reliability, Surfaces (Materials)

Journal Articles

Analysis of a Bow-Free Prestressed Test Specimen

E. Suhir, J. Nicolics

J. Appl. Mech. November 2014, 81(11): 114502.

Paper No: JAM-14-1309

DOI: https://doi.org/10.1115/1.4028551

Published Online: September 26, 2014

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Topics: Manufacturing, Stress, Cross section (Physics), Thermal stresses

Journal Articles

Predicted Size of an Inelastic Zone in a Ball-Grid-Array Assembly

E. Suhir, L. Bechou, B. Levrier

J. Appl. Mech. March 2013, 80(2): 021007.

Paper No: JAM-12-1023

DOI: https://doi.org/10.1115/1.4007476

Published Online: January 22, 2013

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Topics: Ball-Grid-Array packaging, Bonding, Manufacturing, Shear stress, Stress, Yield stress, Ceramics

Journal Articles

Predicted Thermal Stresses in a Trimaterial Assembly With Application to Silicon-Based Photovoltaic Module

E. Suhir, D. Shangguan, L. Bechou

J. Appl. Mech. March 2013, 80(2): 021008.

Paper No: JAM-12-1025

DOI: https://doi.org/10.1115/1.4007477

Published Online: January 22, 2013

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Topics: Manufacturing, Stress, Shear stress

Journal Articles

Predicted Thermal Stress in a Multileg Thermoelectric Module (TEM) Design

E. Suhir, A. Shakouri

J. Appl. Mech. March 2013, 80(2): 021012.

Paper No: JAM-12-1078

DOI: https://doi.org/10.1115/1.4007524

Published Online: January 22, 2013

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Topics: Design, Manufacturing, Shear stress, Stress, Thermal stresses

Journal Articles

Lattice-Misfit Stresses in a Circular Bi-Material Gallium-Nitride Assembly

E. Suhir

J. Appl. Mech. January 2013, 80(1): 014505.

Paper No: JAM-11-1481

DOI: https://doi.org/10.1115/1.4007104

Published Online: November 19, 2012

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Topics: Manufacturing, Shear stress, Stress, Gallium nitride

Journal Articles

Assembly Bonded at the Ends: Could Thinner and Longer Legs Result in a Lower Thermal Stress in a Thermoelectric Module Design?

E. Suhir, A. Shakouri

J. Appl. Mech. November 2012, 79(6): 061010.

DOI: https://doi.org/10.1115/1.4006597

Published Online: September 17, 2012

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Topics: Manufacturing, Shear stress, Stress

Journal Articles

Elastic Stability of a Cantilever Beam (Rod) Supported by an Elastic Foundation, With Application to Nano-Composites

E. Suhir

J. Appl. Mech. January 2012, 79(1): 011009.

DOI: https://doi.org/10.1115/1.4005190

Published Online: December 13, 2011

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Topics: Buckling, Cantilever beams, Elastic constants, Nanocomposites, Stability, Stiffness, Nanofibers, Temperature, Rods, Composite materials

Journal Articles

Predicted Thermal Stresses in a Circular Assembly With Identical Adherends and With Application to a Holographic Memory Package Design

E. Suhir, C. Gu, L. Cao

J. Appl. Mech. January 2012, 79(1): 011011.

DOI: https://doi.org/10.1115/1.4005192

Published Online: December 13, 2011

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Topics: Design, Manufacturing, Stress, Thermal stresses, Bonding

Journal Articles

Predicted Response of the Die-Carrier Assembly in Flexible Electronics to the Combined Action of Tension and Bending Applied to the Carrier

E. Suhir

J. Appl. Mech. January 2012, 79(1): 011010.

DOI: https://doi.org/10.1115/1.4005191

Published Online: December 13, 2011

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Topics: Manufacturing, Shear stress, Stress, Flexible electronics, Tension, Cross section (Physics)

Journal Articles

Predictive Modeling of the Dynamic Response of Electronic Systems to Shocks and Vibrations

E. Suhir

Appl. Mech. Rev. September 2010, 63(5): 050803.

DOI: https://doi.org/10.1115/1.4003712

Published Online: March 23, 2011

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Topics: Dynamic response, Electronic systems, Finite element analysis, Modeling, Shock (Mechanics), Stress, Vibration, Electronics

Journal Articles

Helicopter Landing Ship: Undercarriage Strength and the Role of the Human Factor

E. Suhir

J. Offshore Mech. Arct. Eng. February 2010, 132(1): 011603.

DOI: https://doi.org/10.1115/1.4000497

Published Online: December 22, 2009

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Topics: Human factors, Probability, Ships

Journal Articles

Predictive Analytical Thermal Stress Modeling in Electronics and Photonics

E. Suhir

Appl. Mech. Rev. July 2009, 62(4): 040801.

DOI: https://doi.org/10.1115/1.3077136

Published Online: June 4, 2009

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Topics: Finite element analysis, Manufacturing, Modeling, Stress, Thermal stresses, Design, Electronics, Photonics, Bonding, Temperature

Proceedings Papers

Structural Analysis of Microelectronic and Photonic Systems

E. Suhir

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 907-920, July 17–22, 2005

Paper No: IPACK2005-73249

DOI: https://doi.org/10.1115/IPACK2005-73249

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Topics: Photonic systems, Structural analysis, Modeling, Design, ASME honors and awards, Engineering disciplines, Engineering research, Experimental methods, Fibers, Finite element analysis

Proceedings Papers

Thermal Stress Modeling in Micro- and Opto-Electronics: Review and Extension

E. Suhir

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 753-776, November 15–21, 2003

Paper No: IMECE2003-43777

DOI: https://doi.org/10.1115/IMECE2003-43777

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Topics: Modeling, Optoelectronic devices, Thermal stresses, Design, Accelerated life testing, Computer-aided engineering, Experimental methods, Finite element analysis, Geometry, Materials properties

Journal Articles

Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review

E. Suhir, Fellow ASME,

J. Electron. Packag. June 2003, 125(2): 261–267.

DOI: https://doi.org/10.1115/1.1569510

Published Online: June 10, 2003

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Topics: Modeling, Stress, Thermal stresses, Finite element analysis, Photonics, Thermal expansion, Design, Microelectronic devices, Optical fiber, Manufacturing

Journal Articles

Could Shock Tests Adequately Mimic Drop Test Conditions?

E. Suhir, ASME Fellow

J. Electron. Packag. September 2002, 124(3): 170–177.

DOI: https://doi.org/10.1115/1.1487356

Published Online: July 26, 2002

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Topics: Dynamic response, Impulse (Physics), Shock (Mechanics), Vibration, Stress, Life testing, Deflection

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Journal citation

NARROW

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

Analysis of a Bow-Free Prestressed Test Specimen

Predicted Size of an Inelastic Zone in a Ball-Grid-Array Assembly

Predicted Thermal Stresses in a Trimaterial Assembly With Application to Silicon-Based Photovoltaic Module

Predicted Thermal Stress in a Multileg Thermoelectric Module (TEM) Design

Lattice-Misfit Stresses in a Circular Bi-Material Gallium-Nitride Assembly

Assembly Bonded at the Ends: Could Thinner and Longer Legs Result in a Lower Thermal Stress in a Thermoelectric Module Design?

Elastic Stability of a Cantilever Beam (Rod) Supported by an Elastic Foundation, With Application to Nano-Composites

Predicted Thermal Stresses in a Circular Assembly With Identical Adherends and With Application to a Holographic Memory Package Design

Predicted Response of the Die-Carrier Assembly in Flexible Electronics to the Combined Action of Tension and Bending Applied to the Carrier

Predictive Modeling of the Dynamic Response of Electronic Systems to Shocks and Vibrations

Helicopter Landing Ship: Undercarriage Strength and the Role of the Human Factor

Predictive Analytical Thermal Stress Modeling in Electronics and Photonics

Structural Analysis of Microelectronic and Photonic Systems

Thermal Stress Modeling in Micro- and Opto-Electronics: Review and Extension

Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review

Could Shock Tests Adequately Mimic Drop Test Conditions?

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