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Proceedings Papers

Wickability and Transient Cooling Capacity of Binary Mixtures

Mauricio A. Salinas, S. M. You, B. Elliott Short, Jr., Donald C. Price
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 255-261, July 8–12, 2007
Paper No: HT2007-32459
DOI: https://doi.org/10.1115/HT2007-32459
View Paper titled, Wickability and Transient Cooling Capacity of Binary Mixtures
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Topics: Cooling, Transients (Dynamics), Fluids, Metals, Phase change materials, Water, Aerospace industry, Capillarity, Electronics, Ethanol
Proceedings Papers

Design of a Transient, Temperature Control System for a Low-Temperature Infrared Optical Telescope Utilizing a Ramai R-Cooled Thermoelectric Assembly as the Condenser of a Two-Phase Cooling System

Donald C. Price, W. Gerald Wyatt, Pete Townsend, Mark C. Woods, Brad W. Fennell
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 683-695, July 17–22, 2005
Paper No: IPACK2005-73496
DOI: https://doi.org/10.1115/IPACK2005-73496
View Paper titled, Design of a Transient, Temperature Control System for a Low-Temperature Infrared Optical Telescope Utilizing a Ramai R-Cooled Thermoelectric Assembly as the Condenser of a Two-Phase Cooling System
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Topics: Condensers (steam plant), Cooling systems, Design, Low temperature, Manufacturing, Telescopes, Temperature control, Transients (Dynamics), Temperature, Optical elements
Proceedings Papers

Design of Cast Pin Fin Coldwalls for Air-Cooled Electronics Systems

B. Elliott Short, Jr., Donald C. Price, Peter E. Raad
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 47-55, July 6–11, 2003
Paper No: IPACK2003-35004
DOI: https://doi.org/10.1115/IPACK2003-35004
View Paper titled, Design of Cast Pin Fin Coldwalls for Air-Cooled Electronics Systems
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Topics: Design, Electronics, Reynolds number, Control systems, Fins, Flow (Dynamics), Friction
Proceedings Papers

Thermal Design of an Airborne, Military Computer Chassis With Air-Cooled, Cast Pin Fin Coldwalls

Donald C. Price, B. Elliott Short, Jr.
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 631-639, November 15–21, 2003
Paper No: IMECE2003-42209
DOI: https://doi.org/10.1115/IMECE2003-42209
View Paper titled, Thermal Design of an Airborne, Military Computer Chassis With Air-Cooled, Cast Pin Fin Coldwalls
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Topics: Computers, Design, Military systems, Electronics, Flow (Dynamics), Turbines, Aircraft, Cycles, Heat exchangers, Temperature
Journal Articles

Thermal Design of an Airborne Computer Chassis With Air-Cooled, Cast Pin Fin Coldwalls

Donald C. Price, Life Fellow, ASME Principal Fellow,, B. Elliott Short,, Jr., Mem., ASME Senior Principal Mechanical Engineer,
Journal: Journal of Heat Transfer
Article Type: Article
J. Heat Transfer. January 2005, 127(1): 11–17.
DOI: https://doi.org/10.1115/1.1839583
Published Online: February 15, 2005
View Article titled, Thermal Design of an Airborne Computer Chassis With Air-Cooled, Cast Pin Fin Coldwalls
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Topics: Computers, Design, Flow (Dynamics), Printed circuit boards, Temperature, Thermal management, Cooling, Electronics, Flight
Journal Articles

Design of Cast Pin Fin Coldwalls for Air-Cooled Electronics Systems

B. Elliott Short,, Jr., Mem. ASME, Donald C. Price, Fellow ASME, Peter E. Raad, Mem. ASME
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 67–73.
DOI: https://doi.org/10.1115/1.1648063
Published Online: April 30, 2004
View Article titled, Design of Cast Pin Fin Coldwalls for Air-Cooled Electronics Systems
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Topics: Design, Flow (Dynamics), Heat transfer, Pressure drop, Electronics