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D. B. Barker
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Journal Articles

Vibration Induced Fatigue Life Estimation of Corner Leads of Peripheral Leaded Components

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Sidharth, D. B. Barker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 244–249.
https://doi.org/10.1115/1.2792159
Published Online: December 1, 1996
View Articletitled, Vibration Induced Fatigue Life Estimation of Corner Leads of Peripheral Leaded Components
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Topics: Corners (Structural elements), Fatigue life, Vibration, Stress, Displacement, Finite element analysis, Avionics, Boundary-value problems, Electronic packages, Electronic packaging
Journal Articles

Modeling Solder Joint Fatigue Life for Gullwing Leaded Packages: Part I—Elastic Plastic Stress Model

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V. K. Gupta, D. B. Barker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 123–129.
https://doi.org/10.1115/1.2792078
Published Online: June 1, 1995
View Articletitled, Modeling Solder Joint Fatigue Life for Gullwing Leaded Packages: Part I—Elastic Plastic Stress Model
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Topics: Fatigue life, Modeling, Solder joints, Stress, Finite element analysis, Simulation, Electronics, Experimental design, Finite element methods, Materials properties
Journal Articles

Local PWB and Component Bowing of an Assembly Subjected to a Bending Moment

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D. B. Barker, Sidharth
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 92–97.
https://doi.org/10.1115/1.2905511
Published Online: June 1, 1994
View Articletitled, Local PWB and Component Bowing of an Assembly Subjected to a Bending Moment
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Topics: Manufacturing, Printed circuit boards, Cross section (Physics), Electronic components, Rotation, Stiffness, Stress
Journal Articles

Modeling the Vibration Restraints of Wedge Lock Card Guides

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D. B. Barker, Y. S. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 189–194.
https://doi.org/10.1115/1.2909316
Published Online: June 1, 1993
View Articletitled, Modeling the Vibration Restraints of Wedge Lock Card Guides
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Topics: Locks (Waterways), Modeling, Vibration, Wedges, Boundary-value problems, Deflection, Elastic constants, Frequency response, Rotation, Springs
Journal Articles

Estimating the Vibration Fatigue Life of Quad Leaded Surface Mount Components

Available to Purchase
D. B. Barker, Y. S. Chen, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 195–200.
https://doi.org/10.1115/1.2909317
Published Online: June 1, 1993
View Articletitled, Estimating the Vibration Fatigue Life of Quad Leaded Surface Mount Components
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Topics: Fatigue life, Surface mount components, Vibration, Finite element analysis, Modeling, Printed circuit boards, Reliability, Solder joints, Stress analysis (Engineering)
Journal Articles

Effect of SMC Lead Dimensional Variabilities on Lead Compliance and Solder Joint Fatigue Life

Available to Purchase
D. B. Barker, I. Sharif, A. Dasgupta, M. G. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 177–184.
https://doi.org/10.1115/1.2906415
Published Online: June 1, 1992
View Articletitled, Effect of SMC Lead Dimensional Variabilities on Lead Compliance and Solder Joint Fatigue Life
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Topics: Fatigue life, Solder joints, Surface mount components, Stiffness, Finite element analysis, Surface mount packaging, Computation, Design, Dimensions, Failure
Journal Articles

Fatigue Analysis of a Planarpak™ Surface Mount Component

Available to Purchase
I. Sharif, D. B. Barker, A. Dasgupta, M. G. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 1991, 113(2): 194–199.
https://doi.org/10.1115/1.2905387
Published Online: June 1, 1991
View Articletitled, Fatigue Analysis of a Planarpak™ Surface Mount Component
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Topics: Bonding, Fatigue analysis, Fatigue life, Finite element model, Printed circuit boards, Solders, Stress, Surface mount components, Surface mount devices, Thermal stresses