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Chirag Kharangate
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Proceedings Papers

Machine Learning Algorithms for Predicting Condensation Pressure Drop in Mini/Micro Channels

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Farshad Barghi Golezani, Jiayuan Li, Logan Pirnstill, Chirag Kharangate
Proc. ASME. HT2024, ASME 2024 Heat Transfer Summer Conference, V001T03A009, July 15–17, 2024
Publisher: American Society of Mechanical Engineers
Paper No: HT2024-131476
https://doi.org/10.1115/HT2024-131476
View Paper titled, Machine Learning Algorithms for Predicting Condensation Pressure Drop in Mini/Micro Channels
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Topics: Algorithms, Condensation, Heat transfer, Machine learning, Microchannels, Pressure drop, Thermal systems, Two-phase flow, Artificial neural networks, Heat
Proceedings Papers

Inferring Flow Boiling Interfacial Shear Stress Using Physics Informed Neural Networks From Control Volume Models

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Logan M. Pirnstill, Chirag Kharangate
Proc. ASME. HT2024, ASME 2024 Heat Transfer Summer Conference, V001T03A006, July 15–17, 2024
Publisher: American Society of Mechanical Engineers
Paper No: HT2024-131314
https://doi.org/10.1115/HT2024-131314
View Paper titled, Inferring Flow Boiling Interfacial Shear Stress Using Physics Informed Neural Networks From Control Volume Models
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Topics: Artificial neural networks, Boiling, Flow (Dynamics), Heat transfer, Modeling, Physics, Shear stress
Proceedings Papers

Analytical Study of the Thermal Performance for an Embedded Microfluidic Cooling System

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Jarred Wilhite, Chirag Kharangate
Proc. ASME. HT2024, ASME 2024 Heat Transfer Summer Conference, V001T11A004, July 15–17, 2024
Publisher: American Society of Mechanical Engineers
Paper No: HT2024-131005
https://doi.org/10.1115/HT2024-131005
View Paper titled, Analytical Study of the Thermal Performance for an Embedded Microfluidic Cooling System
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Topics: Cooling, Cooling systems, Manifolds, Microchannels, Microfluidics, Heat, Silicon carbide, Energy dissipation, Fluids, Computer cooling
Proceedings Papers

Investigation of Silicon Carbide Embedded Cooling Technology for Compact Electronic Systems

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Jarred Wilhite, Chirag Kharangate
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111613
https://doi.org/10.1115/IPACK2023-111613
View Paper titled, Investigation of Silicon Carbide Embedded Cooling Technology for Compact Electronic Systems
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Topics: Cooling, Electronic systems, Silicon carbide
Proceedings Papers

Investigation of Universal Consolidated Database for Heat Transfer Coefficient in Flow Condensation and Machine Learning Modelling

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Logan M. Pirnstill, Yue Qiu, Chirag Kharangate
Proc. ASME. HT2023, ASME 2023 Heat Transfer Summer Conference, V001T16A006, July 10–12, 2023
Publisher: American Society of Mechanical Engineers
Paper No: HT2023-107311
https://doi.org/10.1115/HT2023-107311
View Paper titled, Investigation of Universal Consolidated Database for Heat Transfer Coefficient in Flow Condensation and Machine Learning Modelling
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Topics: Condensation, Databases, Flow (Dynamics), Heat transfer coefficients, Machine learning, Modeling
Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

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Ki Wook Jung, Eunho Cho, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031117.
Paper No: EP-20-1030
https://doi.org/10.1115/1.4047846
Published Online: August 17, 2020
View Articletitled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa
Open the PDF for Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa in another window
Topics: Flow (Dynamics), Fluids, Heat, Heat flux, Manifolds, Microchannels, Pressure drop, Temperature, Uncertainty, Cooling
Proceedings Papers

Experimental Investigation of Single-Phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger With R-245fa

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Ki Wook Jung, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6400
https://doi.org/10.1115/IPACK2019-6400
View Paper titled, Experimental Investigation of Single-Phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger With R-245fa
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Topics: Cooling, Heat exchangers, Manifolds, Microchannels