1-11 of 11
Chin C. Lee
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples

Available to Purchase
Shou-Jen Hsu, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041006.
Paper No: EP-16-1095
https://doi.org/10.1115/1.4034842
Published Online: October 10, 2016
View Articletitled, Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples
Open the PDF for Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples in another window
Topics: Annealing, Intermetallic compounds, Solders, Temperature, Tin, Diffusion (Physics), Carbon, Steel
Journal Articles

The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes

Available to Purchase
Yuan-Yun Wu, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011006.
Paper No: EP-13-1063
https://doi.org/10.1115/1.4026171
Published Online: January 8, 2014
View Articletitled, The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes
Open the PDF for The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes in another window
Topics: Alloys, Bonding, Copper, Design, High temperature, Low temperature, Shear (Mechanics), Silver, Solid solutions, Temperature
Journal Articles

40 μ m Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding

Available to Purchase
Chu-Hsuan Sha, Wen P. Lin, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021004.
https://doi.org/10.1115/1.4006705
Published Online: June 11, 2012
View Articletitled, 40 μ m Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding
Open the PDF for 40 μ m Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding in another window
Topics: Bonding, Composite materials, Copper, Flip-chip, Silicon chips, Silver
Journal Articles

Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C

Available to Purchase
Chu-Hsuan Sha, Pin J. Wang, Wen P. Lin, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041007.
https://doi.org/10.1115/1.4005295
Published Online: December 9, 2011
View Articletitled, Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C
Open the PDF for Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C in another window
Topics: Bonding, Diffusion bonding (Metals), Pressure, Silver, Shear (Mechanics), Shear strength, Solders, Atoms, Temperature
Journal Articles

40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding

Available to Purchase
Chu-Hsuan Sha, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031012.
https://doi.org/10.1115/1.4004660
Published Online: September 30, 2011
View Articletitled, 40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding
Open the PDF for 40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding in another window
Topics: Bonding, Flip-chip, Silicon chips, Silver, Soldering, Thermal expansion, Pressure, Copper
Journal Articles

Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging

Available to Purchase
Chu-Hsuan Sha, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021005.
https://doi.org/10.1115/1.4003990
Published Online: June 23, 2011
View Articletitled, Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging
Open the PDF for Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging in another window
Topics: Electronic packaging, Stainless steel, Surface finishing, Grain boundaries, Grain size, X-ray diffraction, X-ray analysis
Journal Articles

Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates

Available to Purchase
Chu-Hsuan Sha, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021003.
https://doi.org/10.1115/1.4003868
Published Online: June 22, 2011
View Articletitled, Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates
Open the PDF for Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates in another window
Topics: Bonding, Silicon chips, Pressure, Shear (Mechanics), Silicon, Thermal expansion, Low temperature, Temperature
Journal Articles

Silver Flip-Chip Technology by Solid-State Bonding

Available to Purchase
Pin J. Wang, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. September 2010, 132(3): 035001.
https://doi.org/10.1115/1.4002297
Published Online: September 30, 2010
View Articletitled, Silver Flip-Chip Technology by Solid-State Bonding
Open the PDF for Silver Flip-Chip Technology by Solid-State Bonding in another window
Topics: Bonding, Flip-chip, Silver, Silicon chips
Journal Articles

Flip-Chip Interconnect for Coplanar Strip Lines

Available to Purchase
Young K. Song, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2008, 130(4): 044501.
https://doi.org/10.1115/1.2993140
Published Online: November 17, 2008
View Articletitled, Flip-Chip Interconnect for Coplanar Strip Lines
Open the PDF for Flip-Chip Interconnect for Coplanar Strip Lines in another window
Topics: Flip-chip, Strips, Circuits, Solders, Signals, Waveguides
Journal Articles

Direct Silver to Copper Bonding Process

Available to Purchase
Pin J. Wang, Jong S. Kim, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. December 2008, 130(4): 045001.
https://doi.org/10.1115/1.2993144
Published Online: November 14, 2008
View Articletitled, Direct Silver to Copper Bonding Process
Open the PDF for Direct Silver to Copper Bonding Process in another window
Topics: Bonding, Copper, Silver, Electronic packaging, Thermal expansion, Stress, Scanning electron microscopy
Journal Articles

Advances in Bonding Technology for Electronic Packaging

Available to Purchase
Chin C. Lee, Chen Y. Wang, Goran Matijasevic
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 201–207.
https://doi.org/10.1115/1.2909318
Published Online: June 1, 1993
View Articletitled, Advances in Bonding Technology for Electronic Packaging
Open the PDF for Advances in Bonding Technology for Electronic Packaging in another window
Topics: Bonding, Electronic packaging, Alloys, Temperature, Acoustics, Diffusion (Physics), Melting point, Microscopy, Oxidation, Soldering