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C. Roberts
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eBook Chapter
Publisher: ASME Press
Published: 2023
ISBN: 9780791886526
Proceedings Papers
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 357-360, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0683
Proceedings Papers
Proc. ASME. IMECE97, Advances in Bioengineering, 313-314, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0354
Proceedings Papers
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 205-211, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0666
Journal Articles
Journal:
Journal of Applied Mechanics
Publisher: ASME
Article Type: Discussions
J. Appl. Mech. March 1944, 11(1): A60–A61.
Published Online: March 8, 2021
eBook Chapter
Publisher: ASME Press
Published: 2020
Proceedings Papers
Proc. ASME. IMECE2017, Volume 9: Mechanics of Solids, Structures and Fluids; NDE, Structural Health Monitoring and Prognosis, V009T12A027, November 3–9, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2017-71088
Proceedings Papers
Yi Chen, Oksana Guba, Carlton F. Brooks, Christine C. Roberts, Bart G. van Bloemen Waanders, Martin B. Nemer
Proc. ASME. DSCC2016, Volume 2: Mechatronics; Mechatronics and Controls in Advanced Manufacturing; Modeling and Control of Automotive Systems and Combustion Engines; Modeling and Validation; Motion and Vibration Control Applications; Multi-Agent and Networked Systems; Path Planning and Motion Control; Robot Manipulators; Sensors and Actuators; Tracking Control Systems; Uncertain Systems and Robustness; Unmanned, Ground and Surface Robotics; Vehicle Dynamic Controls; Vehicle Dynamics and Traffic Control, V002T26A001, October 12–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: DSCC2016-9663
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A040, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48626
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A041, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48627
Proceedings Papers
Proc. ASME. IMECE2014, Volume 8A: Heat Transfer and Thermal Engineering, V08AT10A043, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-38593
Proceedings Papers
Proc. ASME. IMECE2013, Volume 3A: Biomedical and Biotechnology Engineering, V03AT03A013, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-64821
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A011, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73240
Proceedings Papers
Jordan C. Roberts, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A005, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73244
Journal Articles
Jordan C. Roberts, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031005.
Published Online: July 18, 2012
Proceedings Papers
Jordan C. Roberts, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 493-506, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52185
Proceedings Papers
Stress Measurement Errors in Flip Chip Packages Using Multi-Element Sensor Rosettes on (111) Silicon
Richard C. Jaeger, Jeffrey C. Suhling, Safina Hussain, Jordan C. Roberts, Mohammad A. Motalab, Chun-Hyung Cho
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 15-25, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89245
Proceedings Papers
Proc. ASME. IMECE2009, Volume 2: Biomedical and Biotechnology Engineering, 89-90, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11801
Proceedings Papers
Proc. ASME. IMECE2009, Volume 2: Biomedical and Biotechnology Engineering, 91-93, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11807
Proceedings Papers
Proc. ASME. IMECE2009, Volume 2: Biomedical and Biotechnology Engineering, 95-96, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11813
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